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    • 1. 发明授权
    • Non-adhesive sputtering structure including a sputtering target and backing plate
    • 包括溅射靶和背板的非粘性溅射结构
    • US09194035B2
    • 2015-11-24
    • US13537867
    • 2012-06-29
    • Kyung Il ParkKeun-Ik JeonSang-Su KimYoun-Yong Lee
    • Kyung Il ParkKeun-Ik JeonSang-Su KimYoun-Yong Lee
    • C23C14/24C23C14/34H01J37/32H01J37/34
    • C23C14/3407H01J37/32522H01J37/3435H01J37/3497Y10T29/49947
    • A non-adhesive sputtering structure includes a sputtering target having a plate shape; and a backing plate having a plate shape. The backing plate faces the sputtering target, and facing surfaces of the sputtering target and the backing plate are in contact with each other. The backing plate includes a body having a longitudinal axis; and a cooling member through which a cooling material flows in a longitudinal direction of the body substantially parallel to the longitudinal axis. The cooling material conducts heat generated from the sputtering target from sputtering to outside the backing plate. The non-adhesive sputtering structure further includes a plurality of non-adhesive fastening members which maintain the facing surfaces of the backing plate and the sputtering target in contact with each other. The non-adhesive fastening members are extended through a thickness of the backing plate and correspond to regions of the backing plate excluding the cooling member.
    • 非粘合溅射结构包括具有板形的溅射靶; 以及具有板形的背板。 背板面对溅射靶,并且溅射靶和背板的相对表面彼此接触。 背板包括具有纵向轴线的主体; 以及冷却构件,冷却材料通过所述冷却构件沿主体的纵向方向基本上平行于纵向轴线流动。 冷却材料将溅射靶产生的热从溅射传导到背板外部。 非粘合性溅射结构还包括多个不粘合的紧固构件,其保持背板和溅射靶的相对表面彼此接触。 非粘合的紧固构件延伸穿过背板的厚度并且对应于除了冷却构件之外的背板的区域。
    • 2. 发明申请
    • NON-ADHESIVE SPUTTERING STRUCTURE INCLUDING A SPUTTERING TARGET AND BACKING PLATE
    • 非粘合性喷射结构,包括喷射目标和背板
    • US20130001077A1
    • 2013-01-03
    • US13537867
    • 2012-06-29
    • Kyung Il PARKKeun-Ik JEONSang-Su KIMYoun-Yong LEE
    • Kyung Il PARKKeun-Ik JEONSang-Su KIMYoun-Yong LEE
    • C23C14/34B23P11/00
    • C23C14/3407H01J37/32522H01J37/3435H01J37/3497Y10T29/49947
    • A non-adhesive sputtering structure includes a sputtering target having a plate shape; and a backing plate having a plate shape. The backing plate faces the sputtering target, and facing surfaces of the sputtering target and the backing plate are in contact with each other. The backing plate includes a body having a longitudinal axis; and a cooling member through which a cooling material flows in a longitudinal direction of the body substantially parallel to the longitudinal axis. The cooling material conducts heat generated from the sputtering target from sputtering to outside the backing plate. The non-adhesive sputtering structure further includes a plurality of non-adhesive fastening members which maintain the facing surfaces of the backing plate and the sputtering target in contact with each other. The non-adhesive fastening members are extended through a thickness of the backing plate and correspond to regions of the backing plate excluding the cooling member.
    • 非粘合溅射结构包括具有板形的溅射靶; 以及具有板形的背板。 背板面对溅射靶,并且溅射靶和背板的相对表面彼此接触。 背板包括具有纵向轴线的主体; 以及冷却构件,冷却材料通过所述冷却构件沿主体的纵向方向基本上平行于纵向轴线流动。 冷却材料将溅射靶产生的热从溅射传导到背板外部。 非粘合性溅射结构还包括多个不粘合的紧固构件,其保持背板和溅射靶的相对表面彼此接触。 非粘合的紧固构件延伸穿过背板的厚度并且对应于除了冷却构件之外的背板的区域。