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1. 发明申请

US20120321514A1 ANALYZING SYSTEM AND METHOD OF MANAGING MEASUREMENT RESULTS 审中-公开
标题翻译：分析系统和管理测量结果的方法
公开(公告)号：US20120321514A1
公开(公告)日：2012-12-20
申请号：US13527231
申请日：2012-06-19
申请人： Kenichi ITOU , Naoki SHINDO , Noriyuki SAITO
发明人： Kenichi ITOU , Naoki SHINDO , Noriyuki SAITO
IPC分类号： G01N33/48 , B65G49/00
CPC分类号： G01N35/00871 , B01L3/527 , B01L3/5453 , B01L9/06 , B01L2200/18 , B01L2300/021 , B01L2300/1805 , G01N35/00732 , G01N2035/0091
摘要： An analyzer system comprising: a transporting apparatus having a rack stocker for stocking a rack which holds one or more samples, the transporting apparatus being configured to transport the rack in the rack stocker; a measuring apparatus configured to perform a measurement on a sample of the rack transported by the transporting apparatus; an obtaining section configured to obtain identification data of a person who sets the rack on the rack stocker; a data storage; and a system controller, is disclosed. The system controller is configured to store, in the data storage, a result of the measurement of the sample as well as the identification data obtained from the person who had set the rack holding the sample on the rack stocker.
摘要翻译：一种分析仪系统，包括：运送装置，具有用于存放保持一个或多个样品的齿条的齿条储料器，所述输送装置构造成将所述齿条运送到所述齿条储片器中; 测量装置，被配置为对由所述传送装置传送的所述架子的样本进行测量; 获取部，被配置为获得将所述架子设置在所述架子储存器上的人的识别数据; 数据存储; 和系统控制器。系统控制器被配置为在数据存储器中存储样品的测量结果以及从将搁置样品的机架放置在机架储盘器上的人获得的识别数据。

2. 发明授权

US07132733B2 Semiconductor device 有权
公开(公告)号：US07132733B2
公开(公告)日：2006-11-07
申请号：US10996783
申请日：2004-11-24
申请人： Kenichi Itou , Noboru Takeuchi , Shigetoyo Kawakami , Toshiyuki Fukuda
发明人： Kenichi Itou , Noboru Takeuchi , Shigetoyo Kawakami , Toshiyuki Fukuda
IPC分类号： H01L23/495
CPC分类号： H01L21/568 , H01L21/4828 , H01L21/56 , H01L21/561 , H01L21/6835 , H01L23/3107 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/0401 , H01L2224/05554 , H01L2224/16145 , H01L2224/16245 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48644 , H01L2224/49171 , H01L2224/73203 , H01L2224/73265 , H01L2224/83001 , H01L2224/85001 , H01L2224/85385 , H01L2224/85444 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/18301 , H01L2924/20752 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.

3. 发明授权

US07495319B2 Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same 有权
标题翻译：树脂封装的半导体器件和引线框架及其制造方法
公开(公告)号：US07495319B2
公开(公告)日：2009-02-24
申请号：US11071343
申请日：2005-03-03
申请人： Toshiyuki Fukuda , Masanori Minamio , Hiroaki Fujimoto , Ryuichi Sahara , Kenichi Itou
发明人： Toshiyuki Fukuda , Masanori Minamio , Hiroaki Fujimoto , Ryuichi Sahara , Kenichi Itou
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L21/565 , H01L21/566 , H01L23/495 , H01L23/49503 , H01L23/4952 , H01L23/49548 , H01L23/645 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16245 , H01L2224/16257 , H01L2224/16258 , H01L2224/32145 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73253 , H01L2224/73265 , H01L2224/81385 , H01L2224/95001 , H01L2224/97 , H01L2225/1029 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01037 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/18161 , H01L2924/19104 , Y10T156/10 , H01L2924/00012 , H01L2224/81 , H01L2224/48145 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/01033
摘要： There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin. A plurality of terminals 8 for electrical connection are provided in a grid pattern in a region inside the first external terminal portions and exposed on a lower surface of the encapsulating resin. A plurality of semiconductor elements or coils and resistors can be incorporated, and further semiconductor devices can be stacked.
摘要翻译：设置有引线框架，该引线框架包括设置在平面上的多个第一外部端子部分5，由各个第一外部端子部分的后表面形成的内部引线部分6，其布置成围绕内部引线部分内的区域; 由位于相应的内部引线部分外部的凸起部分的最上表面形成的第二外部端子部分7; 半导体元件2通过凸块3接合到内引线部分; 以及封装树脂4，其封装半导体元件和内引线部分的周围。第一外部端子部分沿着该区域的周边布置在封装树脂的下表面区域中，并且第二外部端子部分暴露在封装树脂的上表面上。用于电连接的多个端子8以第一外部端子部分内的区域中的网格图案设置并暴露在封装树脂的下表面上。可以并入多个半导体元件或线圈和电阻器，并且可以堆叠另外的半导体器件。

4. 发明授权

US4973105A Structure of vehicle seat with height adjuster 失效
标题翻译：具有高度调节器的车座结构
公开(公告)号：US4973105A
公开(公告)日：1990-11-27
申请号：US429432
申请日：1989-10-31
申请人： Kenichi Itou
发明人： Kenichi Itou
IPC分类号： B60N2/16 , B60N2/58
CPC分类号： B60N2/5816 , B60N2/161 , B60N2/165 , B60N2/1803 , B60N2/1842 , B60N2/1864 , B60N2/6009
摘要： A structure of a vehicle seat with a height adjuster, with a side cover attached laterally of a seat cushion of the seat, in which a side covering member is provided at one side of the seat cushion where the side cover exists in such a manner as to be disposed in a clearance between the side cover and side wall of the seat cushion. Even when the seat cushion is raised to a highest level by operation of the height adjuster, the side covering member still covers the clearance to thereby prevent an objectionable interior under the seat cushion from being exposed to view. Provision of an auxiliary frame around a forward half portion of seat cushion frame adds to the effect of such exposure prevention in cooperation with the side covering member, which also prevents the exposure from being viewed from forward side of the seat cushion.
摘要翻译：具有高度调节器的车辆座椅的结构，其侧面安装在座椅的座垫的侧面，侧面覆盖部件设置在座垫的一侧，其侧面存在以如被设置在座垫的侧盖和侧壁之间的间隙中。即使通过高度调节器的操作将座垫升高到最高水平时，侧面覆盖构件仍然覆盖该间隙，从而防止座垫下方的令人反感的内部暴露于视野。在座椅坐垫框架的前半部分周围设置辅助框架，与侧面覆盖构件协同地增加了防止曝光的效果，这也防止了从座垫的前侧观察曝光。

5. 发明申请

US20110177657A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20110177657A1
公开(公告)日：2011-07-21
申请号：US13079294
申请日：2011-04-04
申请人： Kenichi ITOU , Noboru TAKEUCHI , Shigetoyo KAWAKAMI , Toshiyuki FUKUDA
发明人： Kenichi ITOU , Noboru TAKEUCHI , Shigetoyo KAWAKAMI , Toshiyuki FUKUDA
IPC分类号： H01L21/58
CPC分类号： H01L21/568 , H01L21/4828 , H01L21/56 , H01L21/561 , H01L21/6835 , H01L23/3107 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/0401 , H01L2224/05554 , H01L2224/16145 , H01L2224/16245 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48644 , H01L2224/49171 , H01L2224/73203 , H01L2224/73265 , H01L2224/83001 , H01L2224/85001 , H01L2224/85385 , H01L2224/85444 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/18301 , H01L2924/20752 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.
摘要翻译：半导体器件包括：半导体元件; 安装有半导体元件的管芯焊盘; 多个电极端子，每个电极端子具有与半导体元件电连接的连接部分; 以及用于密封半导体元件，芯片焊盘和电极端子的密封树脂，使得与具有连接部分的表面相反侧的每个电极端子的表面作为外部端子表面露出。在每个电极端子的与连接部分的表面上形成具有平面形状的凹部，并且凹部布置在从密封树脂的外边缘侧面露出的电极端子的端部与连接部一部分。尽管通过减轻施加到电极端子的外力来保持用于抑制电极端子和密封树脂之间的剥离的结构的功能，但可以使半导体器件小型化。

6. 发明申请

US20090294950A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20090294950A1
公开(公告)日：2009-12-03
申请号：US12537511
申请日：2009-08-07
申请人： Kenichi Itou , Noboru Takeuchi , Shigetoyo Kawakami , Toshiyuki Fukuda
发明人： Kenichi Itou , Noboru Takeuchi , Shigetoyo Kawakami , Toshiyuki Fukuda
IPC分类号： H01L23/52
CPC分类号： H01L21/568 , H01L21/4828 , H01L21/56 , H01L21/561 , H01L21/6835 , H01L23/3107 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/0401 , H01L2224/05554 , H01L2224/16145 , H01L2224/16245 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48644 , H01L2224/49171 , H01L2224/73203 , H01L2224/73265 , H01L2224/83001 , H01L2224/85001 , H01L2224/85385 , H01L2224/85444 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/18301 , H01L2924/20752 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.
摘要翻译：半导体器件包括：半导体元件; 安装有半导体元件的管芯焊盘; 多个电极端子，每个电极端子具有与半导体元件电连接的连接部分; 以及用于密封半导体元件，芯片焊盘和电极端子的密封树脂，使得与具有连接部分的表面相反侧的每个电极端子的表面作为外部端子表面露出。在每个电极端子的与连接部分的表面上形成具有平面形状的凹部，并且凹部布置在从密封树脂的外缘侧面露出的电极端子的端部与连接部一部分。尽管通过减轻施加到电极端子的外力来保持用于抑制电极端子和密封树脂之间的剥离的结构的功能，但可以使半导体器件小型化。

7. 发明授权

US07397113B2 Semiconductor device 有权
公开(公告)号：US07397113B2
公开(公告)日：2008-07-08
申请号：US11474659
申请日：2006-06-26
申请人： Kenichi Itou , Noboru Takeuchi , Shigetoyo Kawakami , Toshiyuki Fukuda
发明人： Kenichi Itou , Noboru Takeuchi , Shigetoyo Kawakami , Toshiyuki Fukuda
IPC分类号： H01L23/495
CPC分类号： H01L21/568 , H01L21/4828 , H01L21/56 , H01L21/561 , H01L21/6835 , H01L23/3107 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/0401 , H01L2224/05554 , H01L2224/16145 , H01L2224/16245 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48644 , H01L2224/49171 , H01L2224/73203 , H01L2224/73265 , H01L2224/83001 , H01L2224/85001 , H01L2224/85385 , H01L2224/85444 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/18301 , H01L2924/20752 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.

8. 发明申请

US20070170578A1 Semiconductor device, electronic apparatus comprising the same, and method for fabrication of substrate for semiconductor device used therein 失效
标题翻译：半导体装置，包括该半导体装置的电子装置及其中使用的半导体装置用基板的制造方法
公开(公告)号：US20070170578A1
公开(公告)日：2007-07-26
申请号：US11584518
申请日：2006-10-23
申请人： Noriyuki Yoshikawa , Noboru Takeuchi , Kenichi Itou , Toshiyuki Fukuda
发明人： Noriyuki Yoshikawa , Noboru Takeuchi , Kenichi Itou , Toshiyuki Fukuda
IPC分类号： H01L23/12
CPC分类号： H01L23/49811 , H01L21/4846 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/1423 , H01L2924/15311 , H01L2924/181 , H05K1/113 , H05K3/3436 , H05K2201/0367 , H05K2201/0394 , H05K2201/09509 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A semiconductor device has upper electrodes and external terminals which are protruding above the both surfaces of a substrate for semiconductor device and connected to each other by penetrating electrodes, a first insulating film covering at least a metal pattern except for the portions of the first insulating film corresponding to the upper electrodes, a second insulating film covering at least another metal pattern except for the portions of the second insulating film corresponding to the external terminals, and a semiconductor element connected to the upper electrodes and placed on the substrate for semiconductor device. The solder-connected surface of the external terminal is positioned to have a height larger than that of a surface of the second insulating film. The semiconductor element is placed on the first insulating film and covered, together with the upper electrodes, with a mold resin.
摘要翻译：半导体器件具有上部电极和外部端子，该上部电极和外部端子突出在半导体器件用基板的两面之上，并且通过穿透电极彼此连接，除了第一绝缘膜的部分之外至少覆盖金属图案的第一绝缘膜对应于上部电极的第二绝缘膜，覆盖除了与外部端子对应的第二绝缘膜的部分之外的至少另一种金属图案的第二绝缘膜，以及连接到上部电极并放置在半导体器件的基板上的半导体元件。外部端子的焊接连接表面被定位成具有比第二绝缘膜的表面高的高度。将半导体元件放置在第一绝缘膜上并与上部电极一起用模制树脂覆盖。

9. 发明申请

US20060273433A1 Semiconductor device 有权
公开(公告)号：US20060273433A1
公开(公告)日：2006-12-07
申请号：US11474659
申请日：2006-06-26
申请人： Kenichi Itou , Noboru Takeuchi , Shigetoyo Kawakami , Toshiyuki Fukuda
发明人： Kenichi Itou , Noboru Takeuchi , Shigetoyo Kawakami , Toshiyuki Fukuda
IPC分类号： H01L23/495
CPC分类号： H01L21/568 , H01L21/4828 , H01L21/56 , H01L21/561 , H01L21/6835 , H01L23/3107 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/0401 , H01L2224/05554 , H01L2224/16145 , H01L2224/16245 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48644 , H01L2224/49171 , H01L2224/73203 , H01L2224/73265 , H01L2224/83001 , H01L2224/85001 , H01L2224/85385 , H01L2224/85444 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/18301 , H01L2924/20752 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.

10. 发明授权

US06998951B2 Common mode choke coil array 有权
公开(公告)号：US06998951B2
公开(公告)日：2006-02-14
申请号：US10334946
申请日：2003-01-02
申请人： Kenichi Itou , Katsuji Matsuta , Masahiko Kawaguchi
发明人： Kenichi Itou , Katsuji Matsuta , Masahiko Kawaguchi
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F17/0006 , H01F37/00 , H01F2017/0093 , H05K1/0233 , H05K1/165
摘要： A common mode choke coil array of a two-element type includes two common mode choke coil elements including at least two spiral coils and arranged side by side in a laminate body (chip member) in plan view. The spiral coils are configured so that the number of turns of the coils on the sides thereof where the coils are adjacent to each other is smaller than the number of turns of the coils on the sides thereof where the coils are distant from each other. The spiral directions of the coils arranged side by side are opposite to each other.

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