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1. 发明申请

US20060191790A1 Apparatus and method for electrochemically processing a microelectronic workpiece 审中-公开
标题翻译：用于电化学处理微电子工件的设备和方法
公开(公告)号：US20060191790A1
公开(公告)日：2006-08-31
申请号：US11413666
申请日：2006-04-27
申请人： Kyle Hanson , Scott Grace , Matt Johnson , Ken Gibbons
发明人： Kyle Hanson , Scott Grace , Matt Johnson , Ken Gibbons
IPC分类号： G01N27/26
CPC分类号： C25D17/008 , C25D5/08 , C25D17/001 , C25D17/002 , C25D17/007 , H01L21/2885
摘要： A reactor for use in electrochemical processing of a microelectronic workpiece is set forth and described herein. The apparatus comprises one or more walls defining a processing space therebetween for containing a processing fluid. The processing space includes at least a first fluid flow region and a second fluid flow region. A first electrode is disposed in the processing fluid of the first fluid flow region while a second electrode, comprising at least a portion of the microelectronic workpiece, is disposed in the processing fluid of the second fluid flow region. Fluid flow within the first fluid flow region is generally directed toward the first electrode and away from the second electrode while fluid flow within the second fluid flow region is generally directed toward the second electrode and away from the first electrode. Depending on the particular electrochemical process that is to be executed, the first e electrode may constitute either an anode or a cathode in the electrochemical processing of the microelectronic workpiece. The foregoing reactor architecture is particularly useful in connection with electroplating of the microelectronic workpiece and, more particularly, in electroplating operations that employ a consumable anode, such as a phosphorized copper anode.
摘要翻译：本文阐述并描述了用于微电子工件的电化学处理的反应器。该装置包括一个或多个在其间限定处理空间的壁，用于容纳处理流体。处理空间至少包括第一流体流动区域和第二流体流动区域。第一电极设置在第一流体流动区域的处理流体中，而包括微电子工件的至少一部分的第二电极设置在第二流体流动区域的处理流体中。第一流体流动区域内的流体流动通常指向第一电极并远离第二电极，而第二流体流动区域内的流体流动通常指向第二电极并远离第一电极。根据要执行的特定电化学过程，第一e电极可以构成微电子工件的电化学处理中的阳极或阴极。上述反应器结构特别适用于微电子工件的电镀，更具体地，在使用消耗性阳极（例如磷化铜阳极）的电镀操作中。

2. 发明申请

US20060191795A1 Apparatus and method for electrochemically processing a microelectronic workpiece 审中-公开
公开(公告)号：US20060191795A1
公开(公告)日：2006-08-31
申请号：US11414641
申请日：2006-04-27
申请人： Kyle Hanson , Scott Grace , Matt Johnson , Ken Gibbons
发明人： Kyle Hanson , Scott Grace , Matt Johnson , Ken Gibbons
IPC分类号： C25D21/06
CPC分类号： C25D17/008 , C25D5/08 , C25D17/001 , C25D17/002 , C25D17/007 , H01L21/2885
摘要： A reactor for use in electrochemical processing of a microelectronic workpiece is set forth and described herein. The apparatus comprises one or more walls defining a processing space therebetween for containing a processing fluid. The processing space includes at least a first fluid flow region and a second fluid flow region. A first electrode is disposed in the processing fluid of the first fluid flow region while a second electrode, comprising at least a portion of the microelectronic workpiece, is disposed in the processing fluid of the second fluid flow region. Fluid flow within the first fluid flow region is generally directed toward the first electrode and away from the second electrode while fluid flow within the second fluid flow region is generally directed toward the second electrode and away from the first electrode. Depending on the particular electrochemical process that is to be executed, the first e electrode may constitute either an anode or a cathode in the electrochemical processing of the microelectronic workpiece. The foregoing reactor architecture is particularly useful in connection with electroplating of the microelectronic workpiece and, more particularly, in electroplating operations that employ a consumable anode, such as a phosphorized copper anode.

3. 发明授权

US06368475B1 Apparatus for electrochemically processing a microelectronic workpiece 有权
标题翻译：用于电化学处理微电子工件的装置
公开(公告)号：US06368475B1
公开(公告)日：2002-04-09
申请号：US09531828
申请日：2000-03-21
申请人： Kyle M. Hanson , Scott Grace , Matt Johnson , Ken Gibbons
发明人： Kyle M. Hanson , Scott Grace , Matt Johnson , Ken Gibbons
IPC分类号： C25B900
CPC分类号： C25D17/008 , C25D5/08 , C25D17/001 , C25D17/002 , C25D17/007 , H01L21/2885
摘要： A reactor for use in electrochemical processing of a microelectronic workpiece is set forth and described herein. The apparatus comprises one or more walls defining a processing space therebetween for containing a processing fluid. The processing space includes at least a first fluid flow region and a second fluid flow region. A first electrode is disposed in the processing fluid of the first fluid flow region while a second electrode, comprising at least a portion of the microelectronic workpiece, is disposed in the processing fluid of the second fluid flow region. Fluid flow within the first fluid flow region is generally directed toward the first electrode and away from the second electrode while fluid flow within the second fluid flow region is generally directed toward the second electrode and away from the first electrode. Depending on the particular electrochemical process that is to be executed, the first electrode may constitute either an anode or a cathode in the electrochemical processing of the microelectronic workpiece.
摘要翻译：本文阐述并描述了用于微电子工件的电化学处理的反应器。该装置包括一个或多个在其间限定处理空间的壁，用于容纳处理流体。处理空间至少包括第一流体流动区域和第二流体流动区域。第一电极设置在第一流体流动区域的处理流体中，而包括微电子工件的至少一部分的第二电极设置在第二流体流动区域的处理流体中。第一流体流动区域内的流体流动通常指向第一电极并远离第二电极，而第二流体流动区域内的流体流动通常指向第二电极并远离第一电极。根据要执行的特定电化学过程，第一电极可以构成微电子工件的电化学处理中的阳极或阴极。

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