专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08764882B2 Fluid treatment method, fluid treatment apparatus, and fluid 有权
标题翻译：流体处理方法，流体处理装置和流体
公开(公告)号：US08764882B2
公开(公告)日：2014-07-01
申请号：US13320817
申请日：2010-05-11
申请人： Keiichirou Kametani , Morimasa Watanabe , Osamu Tanaka
发明人： Keiichirou Kametani , Morimasa Watanabe , Osamu Tanaka
IPC分类号： B01D53/06
CPC分类号： B01D53/06 , B01D53/261 , B01D2253/108 , B01D2257/504 , B01D2257/80 , B01D2259/4009 , B01D2259/402 , Y02C10/08
摘要： A fluid treatment method reduces a concentration of a first component included in a fluid-to-be-treated. A fluid treatment apparatus reduces a concentration of a first component included in a fluid-to-be-treated. A concentration of a second component differing from the first component is reduced in the fluid-to-be-treated in order to obtain a first fluid. The first fluid passes through at least part of an adsorption unit in order to obtain a second fluid. The adsorption unit is capable of adsorbing both the first component and the second component and has at least an ability to adsorb the first component that is temperature dependent. A third fluid pass through a portion of the adsorption unit through which the first fluid has passed. The third fluid has a concentration of the second component that is lower than in the fluid-to-be-treated and a temperature that is higher than the fluid-to-be-treated.
摘要翻译：流体处理方法降低包含在待处理流体中的第一成分的浓度。流体处理装置减少包括在待处理流体中的第一组分的浓度。在待处理的流体中，与第一组分不同的第二组分的浓度降低以获得第一流体。第一流体通过吸附单元的至少一部分以获得第二流体。吸附单元能够吸附第一组分和第二组分，并且至少具有吸附温度依赖性的第一组分的能力。第三流体通过第一流体通过的吸附单元的一部分。第三流体的第二组分的浓度低于待处理的流体中的浓度，并且其温度高于待处理的流体。

2. 发明申请

US20120300359A1 CURRENT PASSING DEVICE AND CURRENT PASSING METHOD 审中-公开
标题翻译：电流传递装置和电流通过方法
公开(公告)号：US20120300359A1
公开(公告)日：2012-11-29
申请号：US13577851
申请日：2011-02-25
申请人： Kiminari Yamashita , Yukihiro Utaka , Aiko Saitou , Yoshinobu Nagano , Keiichirou Kametani
发明人： Kiminari Yamashita , Yukihiro Utaka , Aiko Saitou , Yoshinobu Nagano , Keiichirou Kametani
IPC分类号： H01G5/16
CPC分类号： B01D53/0438 , B01D2259/40096 , B01J20/08 , B01J20/103 , B01J20/18 , B01J20/20 , B01J20/2803 , B01J20/28045 , B01J20/3007 , B01J20/3078 , B01J20/3441 , B01J2220/42
摘要： A current passing device passes current through bodies. The current passing device includes a first current receiving element having an electrical resistance, a second current receiving element having a contact resistance greater than the electrical resistance of the first current receiving element in a state in which the second current receiving element has been brought into direct contact with the first current receiving element without pressing the second current receiving element, a pressing mechanism arranged to press the first current receiving element and the second current receiving element closer together, and an electrically conductive intervening member disposed between the first current receiving element and the second current receiving element. The intervening member has a degree of deformation greater than degrees of deformation of both the first and second current receiving elements in a case where the intervening member has been pressed due to the pressing mechanism.
摘要翻译：电流通过装置使电流通过体。电流通过装置包括具有电阻的第一电流接收元件，在第二电流接收元件已经被引导到的状态下，具有大于第一电流接收元件的电阻的接触电阻的第二电流接收元件与第一电流接收元件接触而不按压第二电流接收元件;按压机构，其布置成将第一电流接收元件和第二电流接收元件压靠在一起;以及导电中间部件，其设置在第一电流接收元件和第二电流接收元件之间，第二电流接收元件。在中间部件由于按压机构而被按压的情况下，中间部件的变形度大于第一和第二电流接收元件的变形程度。

3. 发明申请

US20120068119A1 FLUID TREATMENT METHOD, FLUID TREATMENT APPARATUS, AND FLUID 有权
标题翻译：流体处理方法，流体处理装置和流体
公开(公告)号：US20120068119A1
公开(公告)日：2012-03-22
申请号：US13320817
申请日：2010-05-11
申请人： Keiichirou Kametani , Morimasa Watanabe , Osamu Tanaka
发明人： Keiichirou Kametani , Morimasa Watanabe , Osamu Tanaka
IPC分类号： C09K3/00 , B01D53/26 , B01D53/02
CPC分类号： B01D53/06 , B01D53/261 , B01D2253/108 , B01D2257/504 , B01D2257/80 , B01D2259/4009 , B01D2259/402 , Y02C10/08
摘要： A fluid treatment method reduces a concentration of a first component included in a fluid-to-be-treated. A fluid treatment apparatus reduces a concentration of a first component included in a fluid-to-be-treated. A concentration of a second component differing from the first component is reduced in the fluid-to-be-treated in order to obtain a first fluid. The first fluid passes through at least part of an adsorption unit in order to obtain a second fluid. The adsorption unit is capable of adsorbing both the first component and the second component and has at least an ability to adsorb the first component that is temperature dependent. A third fluid pass through a portion of the adsorption unit through which the first fluid has passed. The third fluid has a concentration of the second component that is lower than in the fluid-to-be-treated and a temperature that is higher than the fluid-to-be-treated.
摘要翻译：流体处理方法降低包含在待处理流体中的第一成分的浓度。流体处理装置减少包括在待处理流体中的第一组分的浓度。在待处理的流体中，与第一组分不同的第二组分的浓度降低以获得第一流体。第一流体通过吸附单元的至少一部分以获得第二流体。吸附单元能够吸附第一组分和第二组分，并且至少具有吸附温度依赖性的第一组分的能力。第三流体通过第一流体通过的吸附单元的一部分。第三流体的第二组分的浓度低于待处理的流体中的浓度，并且其温度高于待处理的流体。

4. 发明申请

US20110230331A1 ADSORBING MOLDED BODY, ADSORPTION RECOVERY TREATMENT APPARATUS, AND ADSORBATE DESORBING METHOD (amended 审中-公开
标题翻译：吸烟成型身体，吸收恢复治疗装置和吸烟者解毒方法（修订版）
公开(公告)号：US20110230331A1
公开(公告)日：2011-09-22
申请号：US13130945
申请日：2009-10-19
申请人： Kiminari Yamashita , Yukihiro Utaka , Aiko Saitou , Yoshinobu Nagano , Keiichirou Kametani
发明人： Kiminari Yamashita , Yukihiro Utaka , Aiko Saitou , Yoshinobu Nagano , Keiichirou Kametani
IPC分类号： B01J20/34 , B01J20/00 , B01J20/28 , B01D53/02
CPC分类号： B01D53/02 , B01D2253/3425 , B01D2259/40096 , B01J20/08 , B01J20/103 , B01J20/18 , B01J20/2803 , B01J20/28042 , B01J20/3007 , B01J20/3078 , B01J20/3408 , B01J2220/42
摘要： An adsorbing molded body is configured to be subjected to ohmic heating or electromagnetic wave heating. The adsorbing molded body includes an electrically conductive powder adsorbent, an insulating powder adsorbent, and an inorganic binder that binds the powder adsorbents together. An adsorption recovery treatment apparatus includes the adsorbing molded body and a heating unit to heat the adsorbing molded body, preferably ohmically or using electromagnetic waves. An adsorbate desorbing method includes desorbing an adsorbate, which the adsorbing molded body has adsorbed, from the adsorbing molded body by heating the adsorbing molded body, preferably ohmically or using electromagnetic waves.
摘要翻译：吸附成型体被配置为经受欧姆加热或电磁波加热。吸附成型体包括导电粉末吸附剂，绝缘粉末吸附剂和将粉末吸附剂结合在一起的无机粘合剂。吸附回收处理装置包括吸附成型体和加热单元，以加热吸附成型体，优选欧姆地或使用电磁波。吸附物解吸方法包括通过加热吸附成型体，优选欧姆地或使用电磁波，将吸附成型体吸附的被吸附物从吸附成型体解吸。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式