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1. 发明专利

JP2008101410A Magnetically towed automatic door opening/closing structure for furniture, buddhist altar, and indoor fitting 审中-公开
标题翻译：自动门自动门打开/关闭家具，布达佩斯和室内配件结构
公开(公告)号：JP2008101410A
公开(公告)日：2008-05-01
申请号：JP2006285637
申请日：2006-10-20
申请人： Keiichiro Saito , 齊藤啓一郎
发明人： SAITO KEIICHIRO
IPC分类号： E05F1/00 , A47G33/02
摘要： PROBLEM TO BE SOLVED: To provide an automatic door opening/closing structure which improves the versatility of a conventional automatic door opening/closing structure for a Buddhist altar, by changing a towing manner of doors, and can expand the versatile range thereof to the Buddhist altar, furniture, building materials, fittings, etc.
SOLUTION: A new magnetically towed automatic door opening/closing structure is set up by applying magnetic attraction between the north pole and the south pole of a permanent magnet, and creating a magnetically towing spindle by using the attraction. Further by making combined use of the present structure and the conventional automatic door opening/closing device, the versatile range of the automatic door opening/closing structure is expanded.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种自动门打开/关闭结构，其通过改变门的牵引方式来提高常规的佛教自动门打开/关闭结构的通用性，并且可以扩大其通用范围到佛教坛，家具，建筑材料，配件等。解决方案：通过在永磁体的北极和南极之间施加磁吸引力来建立新的磁力牵引自动门打开/关闭结构，以及通过使用吸引力创建磁力牵引主轴。此外，通过结合使用本结构和传统的自动门打开/关闭装置，自动门打开/关闭结构的通用范围扩大。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2011050574A Buddhist altar door opening/closing device 审中-公开
标题翻译： BUDDHIST ALTAR门开启/关闭装置
公开(公告)号：JP2011050574A
公开(公告)日：2011-03-17
申请号：JP2009202551
申请日：2009-09-02
申请人： Keiichiro Saito , 齊藤啓一郎
发明人： SAITO KEIICHIRO
IPC分类号： A47G33/02
摘要： PROBLEM TO BE SOLVED: To provide a space-saving Buddhist altar door opening/closing device capable of improving the versatility and convenience and applicability to a furniture type Buddhist altar, a traditional Buddhist altar or a Buddhist altar for the next generation, etc. by changing setting positions of a drive part and a transmission part and the angle of a drive shaft of a conventional Buddhist altar door opening/closing device and changing a method of traction and a folding door structure, etc.
SOLUTION: The direction of the drive shaft of the Buddhist altar door opening/closing device is changed from the horizontal to the vertical direction relative to a flat plane of a device setting board. The drive part is attached below the device setting board and the transmission part is attached above the device setting board. As a result, the thickness in the vertical direction of a projection above the device setting board can be suppressed low, and the method of traction of the folding door of the altar is changed from the direct traction depending on a shaft to the indirect traction as follows. The folding door is indirectly drawn with magnetic attraction between permanent magnets, and the folding door is folded with magnetic repellence by applying the magnetic repellence between a permanent magnet and an electromagnet. The Buddhist altar door opening/closing device opens/closes the folding door by applying this interoperation.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供节省空间的佛教祭坛开门装置，能够提高家具式佛教坛，传统佛教坛或下一代佛教坛的通用性和便利性，适用性，通过改变驱动部分和传动部分的设置位置以及传统的佛教门打开/关闭装置的驱动轴的角度，并改变牵引和折叠门结构的方法等。解决方案：佛教门开闭装置的驱动轴的方向相对于装置设定板的平面从水平方向向垂直方向变化。驱动部分安装在设备设置板下方，传动部分安装在设备设置板上。结果，可以将装置设置板上方的突起的垂直方向的厚度抑制得较低，并且将祭坛的折叠门的牵引方法从直接牵引力变为从轴到直接牵引力作为间接牵引力如下。折叠门在永久磁铁之间被间接地吸引磁吸引，并且通过在永磁体和电磁体之间施加磁排斥力，折叠门通过磁性斥力折叠。佛教祭祀门打开/关闭装置通过这种互操作打开/关闭折叠门。版权所有（C）2011，JPO＆INPIT

3. 发明授权

US4600566A Method of lithium isotope separation 失效
标题翻译：锂同位素分离方法
公开(公告)号：US4600566A
公开(公告)日：1986-07-15
申请号：US575981
申请日：1984-02-01
申请人： Sachio Fujine , Keiichiro Saito , Koreyuki Shiba
发明人： Sachio Fujine , Keiichiro Saito , Koreyuki Shiba
IPC分类号： B01D59/30 , B01J20/281 , C01D15/00 , G01N30/02 , G01N30/88 , G01N30/96
CPC分类号： B01D59/30 , C01D15/00 , G01N30/02
摘要： A method of lithium isotope separation by using a cryptand resin as an adsorbent is herein disclosed.
摘要翻译：本文公开了通过使用穴状树脂作为吸附剂的锂同位素分离方法。

4. 发明申请

US20060228562A1 Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating 审中-公开
标题翻译：半导体装置，缓冲涂层用树脂组合物，芯片接合用树脂组合物和用于封装的树脂组合物
公开(公告)号：US20060228562A1
公开(公告)日：2006-10-12
申请号：US11388791
申请日：2006-03-24
申请人： Ken Ukawa , Keiichiro Saito , Hiroyuki Yasuda , Junya Kusunoki
发明人： Ken Ukawa , Keiichiro Saito , Hiroyuki Yasuda , Junya Kusunoki
IPC分类号： B32B27/00 , B32B27/38 , H01L21/56 , C08L83/10 , C08L63/00 , C08G77/42
CPC分类号： C08G59/027 , C08G59/3218 , C08G59/4021 , C08G61/06 , C08G77/455 , C09D163/00 , H01L23/293 , H01L23/3142 , H01L23/49513 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , Y10T428/31511 , Y10T428/31663 , Y10T428/31721 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention can provide a semiconductor device exhibiting excellent anti-solder reflow resistance and higher reliability in surface mounting using a lead-free solder. In accordance with the present invention, there is provided a semiconductor device formed by placing a semiconductor chip whose surface is coated with a cured resin composition for buffer coating on a pad in a lead frame via a cured resin composition for die bonding and encapsulating the semiconductor chip on the pad in the lead frame by a cured resin composition for encapsulating, wherein the cured resin composition for buffer coating has an elastic modulus of 0.5 GPa to 2.0 GPa both inclusive at 25° C.; the cured resin composition for die bonding has an elastic modulus of 1 MPa to 120 MPa both inclusive at 260° C.; and the cured resin composition for encapsulating has an elastic modulus of 400 MPa to 1200 MPa both inclusive at 260° C. and a thermal expansion coefficient of 20 ppm to 50 ppm both inclusive at 260° C., and the product of the elastic modulus of the cured resin composition for encapsulating and thermal expansion coefficient of the cured resin composition for encapsulating is 8000 to 45000 both inclusive.
摘要翻译：本发明可以提供一种使用无铅焊料显示优异的抗焊料回流电阻和更高的表面安装可靠性的半导体器件。根据本发明，提供了一种半导体器件，其通过将用于芯片焊接的固化树脂组合物放置在表面上涂覆有用于缓冲涂层的固化树脂组合物的半导体芯片在引线框架中的焊盘上，并将半导体通过用于封装的固化树脂组合物将引线框架上的焊盘切片，其中用于缓冲涂层的固化树脂组合物在25℃下具有0.5GPa至2.0GPa（包括端值）的弹性模量; 用于模片粘合的固化树脂组合物在260℃下的弹性模量为1MPa至120MPa（包括端值）。并且用于封装的固化树脂组合物在260℃下的弹性模量为400MPa至1200MPa（包括端值）和260℃下的热膨胀系数为20ppm至50ppm，并且弹性模量用于封装的固化树脂组合物和用于封装的固化树脂组合物的热膨胀系数为8000〜45000。

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