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1. 发明授权

US07619870B2 Electrostatic chuck 有权
标题翻译：静电吸盘
公开(公告)号：US07619870B2
公开(公告)日：2009-11-17
申请号：US11834994
申请日：2007-08-07
申请人： Shinji Himori , Shoichiro Matsuyama , Atsushi Matsuura , Hiroshi Inazumachi , Mamoru Kosakai , Yukio Miura , Keigo Maki
发明人： Shinji Himori , Shoichiro Matsuyama , Atsushi Matsuura , Hiroshi Inazumachi , Mamoru Kosakai , Yukio Miura , Keigo Maki
IPC分类号： H01T23/00
CPC分类号： H01L21/6833
摘要： An electrostatic chuck device includes an electrostatic chuck section including a substrate and a power supply terminal for applying a DC voltage to an electrostatic-adsorption inner electrode; and a metal base section fixed to the other main surface of the electrostatic chuck section. Here, a concave portion is formed in the main surface of the metal base section facing the electrostatic chuck section and a dielectric plate is fixed to the concave portion. The dielectric plate and the electrostatic chuck section are adhesively bonded to each other with an insulating adhesive bonding layer interposed therebetween. The dielectric plate and the concave portion are adhesively bonded to each other with an insulating adhesive bonding layer interposed therebetween. The dielectric constant of the insulating adhesive bonding layer is smaller than that of any one of the dielectric plate and the substrate.
摘要翻译：静电吸盘装置包括：静电吸盘部，其包括基板和用于向静电吸附内部电极施加直流电压的电源端子; 以及固定在静电吸盘部的另一个主面上的金属基部。这里，在面向静电卡盘部的金属基部的主面上形成有凹部，电介质板固定在凹部。电介质板和静电卡盘部分之间插入绝缘粘合剂粘合层彼此粘合。电介质板和凹部通过绝缘性粘合剂层粘合而彼此接合。绝缘粘合剂接合层的介电常数小于介质板和基板中的任何一种的介电常数。

2. 发明申请

US20080037195A1 ELECTROSTATIC CHUCK 有权
标题翻译：静电卡
公开(公告)号：US20080037195A1
公开(公告)日：2008-02-14
申请号：US11834994
申请日：2007-08-07
申请人： Shinji HIMORI , Shoichiro MATSUYAMA , Atsushi MATSUURA , Hiroshi INAZUMACHI , Mamoru KOSAKAI , Yukio MIURA , Keigo MAKI
发明人： Shinji HIMORI , Shoichiro MATSUYAMA , Atsushi MATSUURA , Hiroshi INAZUMACHI , Mamoru KOSAKAI , Yukio MIURA , Keigo MAKI
IPC分类号： H01L21/683 , H01L21/00
CPC分类号： H01L21/6833
摘要： An electrostatic chuck device includes an electrostatic chuck section including a substrate and a power supply terminal for applying a DC voltage to an electrostatic-adsorption inner electrode; and a metal base section fixed to the other main surface of the electrostatic chuck section. Here, a concave portion is formed in the main surface of the metal base section facing the electrostatic chuck section and a dielectric plate is fixed to the concave portion. The dielectric plate and the electrostatic chuck section are adhesively bonded to each other with an insulating adhesive bonding layer interposed therebetween. The dielectric plate and the concave portion are adhesively bonded to each other with an insulating adhesive bonding layer interposed therebetween. The dielectric constant of the insulating adhesive bonding layer is smaller than that of any one of the dielectric plate and the substrate.
摘要翻译：静电吸盘装置包括：静电吸盘部，其包括基板和用于向静电吸附内部电极施加直流电压的电源端子; 以及固定在静电吸盘部的另一个主面上的金属基部。这里，在面向静电卡盘部的金属基部的主面上形成有凹部，电介质板固定在凹部。电介质板和静电卡盘部分之间插入绝缘粘合剂粘合层彼此粘合。电介质板和凹部通过绝缘性粘合剂层粘合而彼此接合。绝缘粘合剂接合层的介电常数小于介质板和基板中的任何一种的介电常数。

3. 发明授权

US06689984B2 Susceptor with built-in electrode and manufacturing method therefor 有权
标题翻译：具有内置电极的受体和其制造方法
公开(公告)号：US06689984B2
公开(公告)日：2004-02-10
申请号：US10285791
申请日：2002-10-31
申请人： Keigo Maki
发明人： Keigo Maki
IPC分类号： B23K1000
CPC分类号： H01J37/32559
摘要： There is provided a susceptor with a built-in electrode that has excellent corrosion resistance and plasma resistance, and that has excellent durability to the stress of heat cycles, and a manufacturing method for a susceptor with a built-in electrode that enables the susceptor to be manufactured economically. The susceptor with a built-in electrode comprises: a susceptor substrate formed from an aluminum oxide based sintered body; an internal electrode built into the susceptor substrate; and a power supply terminal that is provided so as to make contact with this internal electrode, wherein the internal electrode is formed from an aluminum oxide and molybdenum carbide based composite sintered body containing 30 to 95 volume % of molybdenum carbide and 5 to 75 volume % of aluminum oxide.
摘要翻译：本发明提供一种具有优异的耐腐蚀性和等离子体电阻的内置电极的感受体，并且对于热循环的应力具有优异的耐久性，以及具有内置电极的基座的制造方法，经济地制造。具有内置电极的基座包括：由基于氧化铝的烧结体形成的基座基板; 内置于基座基板内的电极; 以及设置成与该内部电极接触的电源端子，其中，内部电极由含有30〜95体积％的碳化钼和5〜75体积％的氧化铝和碳化钼系复合烧结体形成，的氧化铝。

4. 发明授权

US08168452B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08168452B2
公开(公告)日：2012-05-01
申请号：US12954714
申请日：2010-11-26
申请人： Keigo Maki , Daisuke Ito
发明人： Keigo Maki , Daisuke Ito
IPC分类号： H01L21/00
CPC分类号： H01L22/14 , H01L22/20 , H01L22/22 , H01L24/05 , H01L24/13 , H01L2224/02311 , H01L2224/02333 , H01L2224/02377 , H01L2224/02381 , H01L2224/0239 , H01L2224/0401 , H01L2224/05548 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/94 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/14 , H01L2224/03 , H01L2224/11 , H01L2924/00014 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/05599 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A method for manufacturing a semiconductor device, the semiconductor device including an integrated circuit having plural connection terminals arranged on a predetermined local region of the integrated circuit, plural metal bumps, and a wiring layer connected to at least a portion of the connection terminals via the plural metal bumps, the method includes the steps of a) measuring an impedance value of the predetermined local region of the integrated circuit, b) determining whether the measured impedance value matches a predetermined impedance value, c) determining positions of the plural metal bumps in accordance with the determination result of step b), d) forming the plural metal bumps on the positions determined in step c), and e) forming the wiring layer on the plural metal bumps.
摘要翻译：一种半导体器件的制造方法，所述半导体器件包括集成电路，所述集成电路具有布置在所述集成电路的预定局部区域上的多个连接端子，多个金属凸块和经由所述连接端子的至少一部分连接到所述连接端子的布线层多个金属凸块，该方法包括以下步骤：a）测量集成电路的预定局部区域的阻抗值，b）确定测量的阻抗值是否与预定阻抗值匹配，c）确定多个金属凸块的位置根据步骤b）的确定结果，d）在步骤c）中确定的位置上形成多个金属凸块，以及e）在多个金属凸块上形成布线层。

5. 发明申请

US20100002354A1 ELECTROSTATIC CHUCK DEVICE 有权
标题翻译：静电切割装置
公开(公告)号：US20100002354A1
公开(公告)日：2010-01-07
申请号：US12310094
申请日：2007-08-01
申请人： Hiroshi Inazumachi , Mamoru Kosakai , Miura Yukio , Keigo Maki
发明人： Hiroshi Inazumachi , Mamoru Kosakai , Miura Yukio , Keigo Maki
IPC分类号： H01L21/683
CPC分类号： H01L21/6833 , H02N13/00 , Y10T279/23
摘要： An electrostatic chuck device which enables to perform a plasma process having high in-plane uniformity to a plane-like sample by improving the in-plane uniformity of the electric field intensity in a plasma when applied to a plasma processing apparatus. Specifically disclosed is an electrostatic chuck device (21) including an electrostatic chuck section (22), a metal base section (23) serving as a high-frequency generating electrode, and an insulating plate (24). The electrostatic chuck section (22) is composed of a dielectric plate (31) whose top surface (31a) serves as a mounting surface on which a plate-like sample (W) is placed, a supporting plate (32), an electrostatic-adsorption inner electrode (25), and an insulating layer (33). The electrostatic-adsorption inner electrode (25) is made of a composite sintered body containing an insulating ceramic and silicon carbide, while having a volumetric resistance of not less than 1.0×10−1 Ωcm but not more than 1.0×108 Ωcm.
摘要翻译：一种静电吸盘装置，其能够通过提高施加到等离子体处理装置时等离子体中的电场强度的面内均匀性，而对平面状样品进行具有高面内均匀性的等离子体处理。具体公开了一种静电卡盘装置（21），包括静电卡盘部（22），作为高频发生电极的金属基部（23）和绝缘板（24）。静电吸盘部（22）由电极板（31）构成，电介质板（31）的顶面（31a）作为其上放置有板状样品（W）的安装面，支撑板（32）吸附内电极（25）和绝缘层（33）。静电吸附内部电极（25）由含有绝缘陶瓷和碳化硅的复合烧结体构成，体积电阻为1.0×10 -1Ω〜1.0×10 8Ω·cm以上。

6. 发明申请

US20080062610A1 ELECTROSTATIC CHUCK DEVICE 审中-公开
标题翻译：静电切割装置
公开(公告)号：US20080062610A1
公开(公告)日：2008-03-13
申请号：US11835560
申请日：2007-08-08
申请人： Shinji HIMORI , Shoichiro MATSUYAMA , Atsushi MATSUURA , Hiroshi INAZUMACHI , Mamoru KOSAKAI , Yukio MIURA , Keigo MAKI
发明人： Shinji HIMORI , Shoichiro MATSUYAMA , Atsushi MATSUURA , Hiroshi INAZUMACHI , Mamoru KOSAKAI , Yukio MIURA , Keigo MAKI
IPC分类号： H01L21/683
CPC分类号： H01L21/6833
摘要： An electrostatic chuck device includes: an electrostatic chuck section including a substrate, which has a main surface serving as a mounting surface on which a plate-like sample is mounted and an electrostatic-adsorption inner electrode built therein, and a power supply terminal for applying a DC voltage to the electrostatic-adsorption inner electrode; and a metal base section that is fixed to the other main surface of the electrostatic chuck section so as to be incorporated into a body and that serves as a high frequency generating electrode. Here, the volume resistivity of the electrostatic-adsorption inner electrode is in the range of 1.0×10−1Ωcm to 1.0×108 Ωcm.
摘要翻译：静电吸盘装置包括：静电吸盘部，其具有基板，其具有作为安装有板状试样的安装面的主面和内置有静电吸附内部电极的基板，以及用于施加电力的端子到静电吸附内部电极的DC电压; 以及固定在静电卡盘部的另一个主面上的金属基部，以结合到主体中并作为高频发生电极。这里，静电吸附内部电极的体积电阻率在1.0×10 -1Ω〜1.0×10 8Ωm的范围内。

7. 发明申请

US20050098120A1 Susceptor device 有权
标题翻译：受体装置
公开(公告)号：US20050098120A1
公开(公告)日：2005-05-12
申请号：US10633928
申请日：2003-08-04
申请人： Keigo Maki
发明人： Keigo Maki
IPC分类号： H01L21/3065 , C23C16/00 , H01L21/00 , H01L21/205 , H01L21/68 , H01L21/683
CPC分类号： H01L21/67109 , H01L21/67103 , H01L21/6831
摘要： A susceptor device comprises a base body, an electrostatic absorbing inner electrode which is disposed on a bottom surface b of the base body, a power supplying terminal, an insulating sprayed layer which coats the electrostatic absorbing inner electrode and a connecting section for the power supplying terminal and the electrostatic absorbing inner electrode, and a temperature controlling section. The insulating sprayed layer and the temperature controlling section are attached together unitarily via the bonding agent layer. The flange c of the base body fits to a notched section a of the temperature controlling section such that the electrostatic absorbing inner electrode, insulating sprayed layer, and the bonding agent layer should be sealed from thereoutside. It is possible to form a thin supporting plate and improve controllability for temperature on the plate sample and transparency for the plasma.
摘要翻译：感受器装置包括基体，设置在基体的底面b上的静电吸收内部电极，供电端子，涂覆静电吸收内部电极的绝缘喷涂层和用于供电的连接部端子和静电吸收内部电极以及温度控制部。绝缘喷涂层和温度控制部分通过粘合剂层一体地连接在一起。基体的凸缘c与温度控制部的切口部分a相配合，使得静电吸收内电极，绝缘喷涂层和粘合剂层应从其外侧密封。可以形成薄的支撑板，并提高板样品的温度和等离子体的透明度。

8. 发明授权

US08284538B2 Electrostatic chuck device 有权
标题翻译：静电吸盘装置
公开(公告)号：US08284538B2
公开(公告)日：2012-10-09
申请号：US11835743
申请日：2007-08-08
申请人： Shinji Himori , Shoichiro Matsuyama , Atsushi Matsuura , Hiroshi Inazumachi , Mamoru Kosakai , Yukio Miura , Keigo Maki
发明人： Shinji Himori , Shoichiro Matsuyama , Atsushi Matsuura , Hiroshi Inazumachi , Mamoru Kosakai , Yukio Miura , Keigo Maki
IPC分类号： H01L21/687
CPC分类号： H01L21/6833
摘要： An electrostatic chuck device includes an electrostatic chuck section, a metal base section, and a dielectric plate. The electrostatic chuck section has a substrate, a main surface of which serves as a mounting surface for a plate-like sample, an electrostatic-adsorption inner electrode built in the substrate, and a power supply terminal for applying a DC voltage to the electrostatic-adsorption inner electrode. Here, a dielectric plate is fixed to a concave portion formed in the metal base section. The dielectric plate and the electrostatic chuck section are adhesively bonded to each other with an insulating adhesive bonding layer interposed therebetween. The dielectric plate and the concave portion are adhesively bonded to each other with a conductive adhesive bonding layer interposed therebetween, the volume resistivity of which is 1.0×10−2 Ωcm or less.
摘要翻译：静电吸盘装置包括静电吸盘部，金属基部和电介质板。静电吸盘部具有基板，其主面作为板状试样的安装面，内置于基板的静电吸附内部电极，以及向静电吸引部施加直流电压的电源端子，吸附内电极。这里，电介质板被固定到形成在金属基部中的凹部。电介质板和静电卡盘部分之间插入绝缘粘合剂粘合层彼此粘合。电介质板和凹部之间以导电性粘合剂层粘合地结合，其体积电阻率为1.0×10-2＆OHgr·cm以下。

9. 发明授权

US08264813B2 Electrostatic chuck device 有权
标题翻译：静电吸盘装置
公开(公告)号：US08264813B2
公开(公告)日：2012-09-11
申请号：US12310094
申请日：2007-08-01
申请人： Hiroshi Inazumachi , Mamoru Kosakai , Yukio Miura , Keigo Maki
发明人： Hiroshi Inazumachi , Mamoru Kosakai , Yukio Miura , Keigo Maki
IPC分类号： H02H1/00
CPC分类号： H01L21/6833 , H02N13/00 , Y10T279/23
摘要： An electrostatic chuck device which enables to perform a plasma process having high in-plane uniformity to a plane-like sample by improving the in-plane uniformity of the electric field intensity in a plasma when applied to a plasma processing apparatus. Specifically disclosed is an electrostatic chuck device (21) including an electrostatic chuck section (22), a metal base section (23) serving as a high-frequency generating electrode, and an insulating plate (24). The electrostatic chuck section (22) is composed of a dielectric plate (31) whose top surface (31a) serves as a mounting surface on which a plate-like sample (W) is placed, a supporting plate (32), an electrostatic-adsorption inner electrode (25), and an insulating layer (33). The electrostatic-adsorption inner electrode (25) is made of a composite sintered body containing an insulating ceramic and silicon carbide, while having a volumetric resistance of not less than 1.0×10−1 Ωcm but not more than 1.0×108 Ωcm.
摘要翻译：一种静电吸盘装置，其能够通过提高施加到等离子体处理装置时等离子体中的电场强度的面内均匀性，而对平面状样品进行具有高面内均匀性的等离子体处理。具体公开了一种静电卡盘装置（21），包括静电卡盘部（22），作为高频发生电极的金属基部（23）和绝缘板（24）。静电吸盘部（22）由电极板（31）构成，电介质板（31）的顶面（31a）作为其上放置有板状样品（W）的安装面，支撑板（32）吸附内电极（25）和绝缘层（33）。静电吸附内部电极（25）由含有绝缘陶瓷和碳化硅的复合烧结体构成，体积电阻为1.0×10 -1以上且OHgr cm以上且1.0×10 8Ω以下。厘米。

10. 发明申请

US20080316721A1 ELECTRODE STRUCTURE BODY AND METHOD OF FORMING THE SAME, ELECTRONIC COMPONENT, AND MOUNTING SUBSTRATE 审中-公开
标题翻译：电极结构体及其形成方法，电子部件和安装基板
公开(公告)号：US20080316721A1
公开(公告)日：2008-12-25
申请号：US12112481
申请日：2008-04-30
申请人： Keigo MAKI
发明人： Keigo MAKI
IPC分类号： H05K7/06 , H01B5/00 , H01R43/00
CPC分类号： H05K3/244 , H01L23/498 , H01L23/49816 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05023 , H01L2224/0508 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05573 , H01L2224/05644 , H01L2224/05655 , H01L2224/16 , H01L2224/81192 , H01L2224/81801 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H05K3/06 , H05K3/3463 , H05K2203/0361 , H05K2203/043 , H05K2203/1105 , Y10T29/49224 , H01L2924/00014
摘要： An electrode structure body of the present invention is composed of a metal electrode, and a solder alloy layer (a tin/nickel alloy layer) formed on a surface of the metal electrode. The solder alloy layer is obtained by reflow-heating the solder layer formed on the metal electrode and then removing the solder layer. This electrode structure body can be applied to an external connection electrode of an electronic component or a mounting substrate.
摘要翻译：本发明的电极结构体由在金属电极的表面上形成的金属电极和焊锡合金层（锡/镍合金层）构成。焊料合金层通过对形成在金属电极上的焊料层进行回流加热，然后除去焊料层而获得。该电极结构体可以应用于电子部件或安装基板的外部连接电极。

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