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热词
    • 2. 发明授权
    • Method of bonding a metal by solder
    • 通过焊料接合金属的方法
    • US5305948A
    • 1994-04-26
    • US67599
    • 1993-05-27
    • Yoshio YoshikawaYoshiaki InoueTeruo TakeuchiKazuo Fujinami
    • Yoshio YoshikawaYoshiaki InoueTeruo TakeuchiKazuo Fujinami
    • B23K1/20B23K35/36H05K3/34B23K35/363B23K35/38H01L21/50H01L21/54
    • B23K1/203B23K35/3612B23K35/3616H05K3/3489Y10T29/49146
    • The solder bonding is conducted by applying a postflux, which contains halogen compounds in the ratio of 0.2% or less as the amount of halogen, over a metal surface, which is the portion to be bonded by solder, of a member including metal accommodated in a gas-impermeable container in a hermetically sealed manner together with a rust-proof agent packet. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including the metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas co-exists with the material including the metal member, and the use of the flux containing a small amount of halogen easily enables good bonding properties of the solder. Accordingly, it is unnecessary to remove the flux by organic halogen based solvents after the solder bonding, the cleaning steps may be simplified and cost reduction may be promoted.
    • 通过在包含金属的部件的金属表面(作为焊料粘合的部分)上施加包含卤素化合物的比例为0.2%以下的卤素的后通量进行焊接, 一个不透气的容器与防锈剂包一起以密封的方式。 本发明的方法以非常简单的方式以低成本,通过将包含金属的构件保持在其中不存在氧,水分或腐蚀性物质的还原气氛中,并以 该还原气体与包括金属构件的材料共存,并且使用含有少量卤素的助熔剂容易实现焊料的良好的接合性能。 因此,在焊接后不需要通过有机卤素系溶剂去除焊剂,可以简化清洗工序,降低成本。