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1. 发明申请

US20060038575A1 Semiconductor device test probe 有权
标题翻译：半导体器件测试探头
公开(公告)号：US20060038575A1
公开(公告)日：2006-02-23
申请号：US11206167
申请日：2005-08-18
申请人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yoshinori Deguchi , Kazunobu Miri
发明人： Megumi Takemoto , Shigeki Maekawa , Yoshihiro Kashiba , Yoshinori Deguchi , Kazunobu Miri
IPC分类号： G01R31/02
CPC分类号： G01R1/06738 , G01R1/06711 , H01L2224/48463 , H01L2924/01037 , H01L2924/01057 , H01L2924/01079
摘要： A semiconductor device test probe having a tip portion for being urged against an electrode pad of an integrated semiconductor device to establish an electrical contact against the electrode pad for testing functions of the semiconductor device. The spherical tip portion has a radius of curvature r expressed by 9t≦r≦35t where r is the radius of curvature of the spherical surface and t is the thickness of the electrode pad. The tip portion may have a first curved surface substantially positioned in the direction of slippage of the probe when the probe is urged against the electrode pad and slipped relative to the electrode pad and a second curved surface opposite to the first curved surface. The first curved surface has a radius of curvature of from 7 μm to 30 μm and larger than that of the second curved surface. The test probe may be manufactured by a method comprising the steps of roughing the tip portion of the curved surface by abrasing by means of electrolyte abrasion or abrasing particles to form a symmetrical spherical curved surface, and finishing the tip portion by sliding it on an abrasive member comprising an elastically deformable thick film fixed to a substrate and having abrasive particles therein or thereon directly or through a metallic film.
摘要翻译：一种半导体器件测试探针，其具有尖端部分，用于抵抗集成半导体器件的电极焊盘，以建立与电极焊盘的电接触，以测试半导体器件的功能。球形尖端部分具有由9t <= r <= 35t表示的曲率半径r，其中r是球面的曲率半径，t是电极焊盘的厚度。尖端部分可以具有基本上位于探头滑动方向上的第一弯曲表面，当探头被推靠在电极垫上并相对于电极焊盘滑动时，第一弯曲表面与第一弯曲表面相对的第二弯曲表面。第一曲面的曲率半径为7μm〜30μm，大于第二曲面的曲率半径。测试探针可以通过以下方法制造，该方法包括以下步骤：通过利用电解质磨损或磨损颗粒进行磨损来粗糙化弯曲表面的尖端部分以形成对称的球形曲面，并且通过将其磨削在磨料上来完成尖端部分其包括固定到基底的可弹性变形的厚膜，其上直接或通过金属膜在其中或其上具有磨料颗粒。

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