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1. 发明授权

US5118370A LSI chip and method of producing same 失效
标题翻译： LSI芯片及其制造方法
公开(公告)号：US5118370A
公开(公告)日：1992-06-02
申请号：US673241
申请日：1991-03-18
申请人： Kazuhito Ozawa
发明人： Kazuhito Ozawa
IPC分类号： B23K20/10 , H01L21/56 , H01L21/60 , H01L21/607 , H01L23/485
CPC分类号： H01L24/81 , B23K20/10 , H01L21/563 , H01L24/10 , H01L24/13 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/16238 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L24/45 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/181 , Y10T156/107 , Y10T29/49144 , Y10T29/49213
摘要： An LSI chip has Al bumps transferred from an Al-containing foil and formed thereon by ultrasonic bonding. The LSI chip is thereafter mounted on a circuit board by an adhesive containing fine metallic particles dispersed or arranged uniformly, an insulative adhesive with high fluidity or ultrasonic bonding.
摘要翻译： LSI芯片具有从含Al箔转移并通过超声波接合形成在其上的Al凸块。然后，通过包含均匀分散或均匀分布的金属微粒的粘合剂，高流动性或超声波接合的绝缘粘合剂将LSI芯片安装在电路板上。

2. 发明授权

US4973036A Sheet handling apparatus provided for a copying machine 失效
标题翻译：为复印机提供的纸张处理装置
公开(公告)号：US4973036A
公开(公告)日：1990-11-27
申请号：US310602
申请日：1989-02-14
申请人： Hiroki Yamashita , Keichi Kinoshita , Kazuhito Ozawa , Wataru Kurahashi , Katsuya Yasuda
发明人： Hiroki Yamashita , Keichi Kinoshita , Kazuhito Ozawa , Wataru Kurahashi , Katsuya Yasuda
IPC分类号： B41K3/00 , B42C1/12 , B65H37/04 , G03G15/00
CPC分类号： G03G15/6541 , B41K3/00 , B42C1/12 , B65H37/04 , G03G15/6582 , G03G2215/00426 , G03G2215/00793 , G03G2215/00827 , G03G2215/0089
摘要： A sheet handling apparatus comprising a stapling tray for receiving sheets ejected from a copying machine and a stamp for stamping on the sheets in the stapling tray, wherein the surface of the stapling tray facing the stamp is made of soft and elastic material to reduce friction. The sheets are selectively stapled or stapled and stamped, and the stamping operation is performed after the stapling operation. Further, the sheet handling apparatus comprises an ejection tray for receiving sheets ejected for the copying machine, an elevate block for elevating and lowering the ejection tray, a linking mechanism for actuating the stamp to stamp on the sheets in connection with the movement of the ejection tray driven by the elevate block.
摘要翻译：一种片材处理装置，包括用于接收从复印机排出的片材的装订托盘和用于在装订托盘中的片材上冲压的印模，其中，所述装订托盘面对印模的表面由柔软和弹性材料制成以减少摩擦。片材被选择性地装订或装订和冲压，并且在装订操作之后进行冲压操作。此外，片材处理装置包括用于接收为复印机排出的片材的排出托盘，用于升降排出托盘的提升块，用于致动印章的连接机构，以与印刷件的移动相关联托盘由升高块驱动。

3. 发明授权

US4955132A Method for mounting a semiconductor chip 失效
标题翻译：半导体芯片的安装方法
公开(公告)号：US4955132A
公开(公告)日：1990-09-11
申请号：US271256
申请日：1988-11-15
申请人： Kazuhito Ozawa
发明人： Kazuhito Ozawa
IPC分类号： H01L21/60 , H05K1/09 , H05K1/18 , H05K3/28 , H05K3/32 , H05K3/34
CPC分类号： H01L24/83 , H01L24/29 , H01L24/32 , H01L24/81 , H05K3/323 , H05K3/3452 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/80903 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/0781 , H01L2924/07811 , H01L2924/12042 , H05K1/095 , H05K1/181 , H05K2201/10636 , H05K2201/10674 , H05K2203/0191 , H05K2203/1453 , H05K3/281 , Y02P70/611 , Y10T29/49144
摘要： A method for mounting a semiconductor chip on a circuit board is provided that comprises forming a wiring pattern, which is to be connected with electrodes of the semiconductor chip, on the circuit board; attaching an insulating film, which has at least one hole that fits the shape of the electrodes of the semiconductor chip, to the top of the wiring pattern and the exposed portion of the circuit board; filling the hole formed in the insulating film with a conductor; and placing the semiconductor chip on the insulating film, so that the electrodes of the semiconductor chip are connected electrically with the wiring pattern on the circuit board through the conductor.
摘要翻译：提供了一种在电路板上安装半导体芯片的方法，包括在电路板上形成与半导体芯片的电极连接的布线图案; 将具有与半导体芯片的电极的形状适配的至少一个孔的绝缘膜附着到布线图案的顶部和电路板的露出部分; 用导体填充形成在绝缘膜中的孔; 并且将半导体芯片放置在绝缘膜上，使得半导体芯片的电极通过导体与电路板上的布线图案电连接。

4. 发明授权

US4814040A Method of connecting electronic element to base plate 失效
标题翻译：将电子元件连接到基板的方法
公开(公告)号：US4814040A
公开(公告)日：1989-03-21
申请号：US174715
申请日：1988-03-29
申请人： Kazuhito Ozawa
发明人： Kazuhito Ozawa
IPC分类号： H01R13/02 , H01L21/00 , H01R4/04 , H01R11/01 , H01R43/00 , H05K1/09 , H05K3/06 , H05K3/32 , H05K3/36 , C23F1/02 , B44C1/22 , C03C15/00 , C03C25/06
CPC分类号： H01L21/67144 , H01R4/04 , H05K3/323 , H05K1/09 , H05K1/095 , H05K2201/023 , H05K2201/0323 , H05K2201/035 , H05K2203/0522 , H05K2203/0571 , H05K2203/0723 , H05K2203/1189 , H05K3/061 , H05K3/361 , Y10T29/49155
摘要： An electronic element is connected to a base plate provided with a metallic pattern and a conductive resist layer superposed thereon by a thermal compression process with an adhesive layer sandwiched between the element and the base plate. The adhesive layer contains many metallic particles which are larger than the layer thickness of the resist such that these metallic particles penetrate the resist layer and invade the metallic pattern by the thermal compression process.
摘要翻译：电子元件通过热压缩工艺连接到设置有金属图案的基板和与其叠置在一起的导电抗蚀剂层，其中夹在元件和基板之间的粘合剂层。粘合剂层包含大于抗蚀剂层厚度的许多金属颗粒，使得这些金属颗粒穿透抗蚀剂层并通过热压缩过程侵入金属图案。

5. 发明授权

US5083761A Sheet storing apparatus for sheets ejected from a copying machine 失效
标题翻译：用于从复印机排出的纸张的纸张存放装置
公开(公告)号：US5083761A
公开(公告)日：1992-01-28
申请号：US400676
申请日：1989-08-30
申请人： Akiyoshi Johdai , Keichi Kinoshita , Toshio Matsui , Takeshi Yoshikai , Tadashi Maruyama , Kazuhito Ozawa , Hiroki Yamashita
发明人： Akiyoshi Johdai , Keichi Kinoshita , Toshio Matsui , Takeshi Yoshikai , Tadashi Maruyama , Kazuhito Ozawa , Hiroki Yamashita
IPC分类号： B65H29/44 , G03G15/00 , G03G15/23
CPC分类号： G03G15/6552 , B65H29/44 , G03G15/234 , G03G15/6579 , G03G2215/00434 , G03G2215/00438 , G03G2215/0054
摘要： A sheet storing apparatus wherein sheets ejected from a copying machine one after another are stacked in order, and the sheets are supplied to the copying machine again. The apparatus comprises a sheet storing unit wherein sheets are stored, a transporter for transporting sheets to the storing unit, a regulator for preventing sheets supported by a sheet support surface of the storing unit from moving back toward the entrance thereof, a pressure member for pressing each sheet transported to the unit against the support surface and a refeeder for feeding out the stored sheets one by one. Each time a sheet is transported to the unit, the pressure member presses the sheet, whereby the end of the sheet passes through the regulator to be put between the support surface and the regulator. Also, in feeding sheets out of the unit, the pressure member presses the sheet stack against the refeeder. The pressure member has a mechanism for adjusting the pressure on the sheet stack in proportion to the thickness of the stack. Each time a sheet is transported to the unit, the timing of actuating the pressure member is determined, and the position of the pressure member is detected. When it is not detected that the pressure member is in a pressing position within a specified time after a timing signal was generated, a controller judges that a sheet jam has occurred.
摘要翻译：一种片材存储装置，其中依次堆叠从复印机排出的片材，并将片材再次供给到复印机。该装置包括：纸张存储单元，其中存储纸张;输送器，用于将纸张传送到存储单元;调节器，用于防止由存储单元的纸张支撑表面支撑的纸张朝向其入口移回;压力构件，用于按压每个片材相对于支撑表面传送到单元，以及用于逐个地输出存储的片材的再供给器。每次将片材输送到单元时，压力构件按压片材，由此片材的端部通过调节器以放置在支撑表面和调节器之间。此外，在将片材从单元中进给时，压力构件将片材堆叠压靠在再供给器上。压力构件具有与堆叠件的厚度成比例地调节片材堆叠体上的压力的机构。每次将片材输送到单元时，确定致动压力构件的时间，并且检测压力构件的位置。当在定时信号生成之后没有检测到压力构件在规定时间内处于按压位置时，控制器判断已经发生卡纸。

6. 发明授权

US4762983A Thin electronic apparatus 失效
标题翻译：薄电子设备
公开(公告)号：US4762983A
公开(公告)日：1988-08-09
申请号：US783465
申请日：1985-10-03
申请人： Yoshinori Oogita , Katsuhide Shino , Kazuhiro Nakao , Kazuhito Ozawa , Shigeki Komaki
发明人： Yoshinori Oogita , Katsuhide Shino , Kazuhiro Nakao , Kazuhito Ozawa , Shigeki Komaki
IPC分类号： G06F15/02 , H01H13/702 , H05K5/00 , H05K5/02 , G06C5/02
CPC分类号： H01H13/702 , H05K5/0017 , H01H2227/01 , H01H2229/028 , H01H2229/03 , H01H2231/05 , Y10T428/2826
摘要： An electronic apparatus comprising a plurality of assembly elements and a heat-sensitive adhesive synthetic resin film tape inserted between the plurality of assembly elements and the heat adhesive synthetic resin tape to integrally bond the elements together into a composite structure which is thin in size and sufficiently elastic to resist bending and twisting.
摘要翻译：一种电子设备，包括多个组装元件和插入在所述多个组件之间的热敏粘合剂合成树脂薄膜带和所述热粘合成树脂带，以将所述元件一体地结合在一起，形成为尺寸小且足够的复合结构弹性抵抗弯曲和扭曲。

7. 发明授权

US4758689A Card-type thin electronic device 失效
标题翻译：卡式薄型电子设备
公开(公告)号：US4758689A
公开(公告)日：1988-07-19
申请号：US893935
申请日：1986-08-06
申请人： Kazuhiro Nakao , Yoshinori Oogita , Shigeki Komaki , Kazuhito Ozawa , Katsuhide Shino
发明人： Kazuhiro Nakao , Yoshinori Oogita , Shigeki Komaki , Kazuhito Ozawa , Katsuhide Shino
IPC分类号： B42D15/10 , G06K19/077 , H05K5/06 , H05K13/04
CPC分类号： G06K19/07745 , H01L2924/0002
摘要： A card-type thin electronic device in which the upper and lower panels are bonded to flanges projecting from a side-wall forming frame between the two panels, while a number of grooves are formed by a half-etching process on the surfaces of both panels bonded against the side-wall forming frame.
摘要翻译：一种卡式薄型电子设备，其中上和下面板结合到从两个面板之间的侧壁形成框架突出的凸缘，同时通过半蚀刻工艺在两个面板的表面上形成多个凹槽粘合在侧壁形成框架上。

8. 发明授权

US4744850A Method for bonding an LSI chip on a wiring base 失效
标题翻译：将LSI芯片接合在布线基板上的方法
公开(公告)号：US4744850A
公开(公告)日：1988-05-17
申请号：US805420
申请日：1985-12-09
申请人： Yoshitugu Imano , Kazuhito Ozawa , Yoshitomo Kitanishi , Katsuhide Shino , Yukihiro Inoue , Yoshinori Oogita , Kazuhiro Nakao , Shigeki Komaki
发明人： Yoshitugu Imano , Kazuhito Ozawa , Yoshitomo Kitanishi , Katsuhide Shino , Yukihiro Inoue , Yoshinori Oogita , Kazuhiro Nakao , Shigeki Komaki
IPC分类号： H05K3/32 , H01B1/22 , H01L21/60 , H01L23/482 , B29C65/02 , B29C65/30 , B29C65/48 , B29C65/54
CPC分类号： H01L23/4828 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/16 , H01L2224/274 , H01L2224/2919 , H01L2224/81801 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/3025 , Y10T156/1062 , Y10T156/1077 , Y10T156/1089
摘要： A method for bonding a LSI chip having terminals on a wiring base having electrodes which comprises the steps of coating a heat sensitive adhesive on the surface of a wafer forming a plurality of LSI chips, sprinkling electrically conductive particles thereon, dopping the electrically conductive particles, scribing the wafer to be divided into each of the LSI chips, positioning each of the terminals of the LSI chip and each of the electrodes of the wiring base face to face, and bonding the LSI chip on the wiring base.
摘要翻译：一种用于在具有电极的布线基底上结合具有端子的LSI芯片的方法，包括以下步骤：在形成多个LSI芯片的晶片的表面上涂布热敏粘合剂，在其上撒上导电颗粒，掺杂导电颗粒，将要分割成每个LSI芯片的晶片划片，将LSI芯片的每个端子和布线基板的每个电极面对面地定位，并将LSI芯片接合在布线基板上。

9. 发明授权

US06213456B1 Finisher for use with an image forming apparatus 失效
标题翻译：用于成像设备的整理器
公开(公告)号：US06213456B1
公开(公告)日：2001-04-10
申请号：US09002034
申请日：1997-12-31
申请人： Ryo Hirano , Kunihiko Kanou , Tadashi Kobayashi , Masahiro Nonoyama , Kazuhiko Nakatsuka , Shinji Wakamatsu , Kazuhito Ozawa
发明人： Ryo Hirano , Kunihiko Kanou , Tadashi Kobayashi , Masahiro Nonoyama , Kazuhiko Nakatsuka , Shinji Wakamatsu , Kazuhito Ozawa
IPC分类号： B42C1900
CPC分类号： G03G15/6541 , G03G2215/00839 , G03G2215/00869 , G03G2215/00936
摘要： A finisher connected to a copying machine produces a bound booklet by inserting papers from the copying machine into a cover with an adhesive layer of a hot-melt adhesive which is coated on the inner surface of near a spine interconnecting a front board and a back board, and heating the cover and a sheaf of papers, and joining them by adhesion. Thus, the series of operations ranging from the preparation of documents through the bookbinding can be facilitated and expedited.
摘要翻译：连接到复印机的整理器通过将来自复印机的纸张插入到具有涂覆在将前板和背板互连的脊柱的内表面上的热熔粘合剂的粘合剂层的盖上来产生装订的小册子，并加热盖和一捆纸，并通过粘附将它们接合。因此，可以方便和加快从编制文件到装订的一系列操作。

10. 发明授权

US5012298A Sheet transporting apparatus provided for a copying machine 失效
标题翻译：为复印机提供的纸张输送装置
公开(公告)号：US5012298A
公开(公告)日：1991-04-30
申请号：US400727
申请日：1989-08-30
申请人： Akiyoshi Johdai , Kazuhito Ozawa , Toshio Matsui
发明人： Akiyoshi Johdai , Kazuhito Ozawa , Toshio Matsui
IPC分类号： G03G15/00 , G03G15/23
CPC分类号： G03G15/6538 , G03G15/234 , G03G15/6579 , G03G2215/00421 , G03G2215/00438 , G03G2215/00827 , G03G2215/00843
摘要： A sheet transporting apparatus comprising an outlet for sheets, a first path through which sheets ejected from a copying machine are transported in a first direction, to the outlet and in a second direction to be reversed from the outlet, a diverter for diverting the travel of sheets, which is disposed in the vicinity of the outlet and movable between a first position where sheets traveling in the first direction are guided to a handling apparatus attached at the outlet and a second position where sheets are guided to a space between respective outside frames of the transporting apparatus and the handling apparatus, a second path for receiving sheets traveling in the second direction along the first path and transporting the sheets, a storing unit wherein sheets transported through the second path are stored and a refeeding section for feeding sheets stored in the storing unit to the copying machine. In a first mode, the diverter is set to the first position so that sheets ejected from the copying machine are transported to the handling apparatus through the first path. In a second mode, the diverter is set to the second position so that sheets ejected from the copying machine are transported in the first direction, then reversed in the second direction, and finally transported to the sheet storing unit through the second path.
摘要翻译：一种纸张输送装置，包括用于纸张的出口，第一路径，从复印机排出的纸张通过该第一路径沿第一方向被输送到出口，并且在第二方向上从出口向第二方向转移;转向器，其布置在出口附近，并且可以在第一位置和第二位置之间移动，第一位置在第一位置处将沿第一方向行进的片材引导到安装在出口处的处理设备，以及第二位置，其中片材被引导到各个外框架之间的空间传送装置和处理装置，用于接收沿着第一路径在第二方向上行进并传送纸张的纸张的第二路径，其中存储通过第二路径传送的纸张的存储单元和用于馈送存储在纸张中的纸张的再供纸部分存储单元到复印机。在第一模式中，分流器设置在第一位置，使得从复印机排出的纸张通过第一路径被传送到处理装置。在第二模式中，分流器设置在第二位置，使得从复印机排出的纸张沿第一方向传送，然后沿第二方向反转，最后通过第二路径传送到纸张存储单元。

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