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    • 1. 发明申请
    • VACUUM PROCESSING APPARATUS AND PROCESSING METHOD USING THE SAME
    • 真空加工装置及其加工方法
    • US20120160164A1
    • 2012-06-28
    • US13325108
    • 2011-12-14
    • Kazuhiro KAMEYAMA
    • Kazuhiro KAMEYAMA
    • C23C16/52
    • C23C14/568C23C14/54
    • A vacuum processing apparatus includes: a process chamber capable of reducing a pressure; a transport unit, provided in the process chamber, for transporting a plurality of substrates; a gas supply unit for supplying a gas to process the substrates in the process chamber; a substrate processing unit for processing the substrates placed on the transport unit; a detection unit for detecting a substrate interval between adjacent substrates out of the plurality of substrates; and a control unit for controlling, based on the substrate interval detected by the detection unit, a supply amount of the gas to be supplied by the gas supply unit.
    • 真空处理装置包括:能够降低压力的处理室; 传送单元,设置在所述处理室中,用于传送多个基板; 用于提供气体以处理处理室中的基板的气体供应单元; 基板处理单元,用于处理放置在所述输送单元上的基板; 检测单元,用于检测所述多个基板中的相邻基板之间的基板间隔; 以及控制单元,用于基于由检测单元检测到的基板间隔,控制由气体供给单元供应的气体的供给量。