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1. 发明授权

US09019498B2 Method for inspecting defects, inspected wafer or semiconductor device manufactured using the same, method for quality control of wafers or semiconductor devices and defect inspecting apparatus 有权
标题翻译：用于检查缺陷的方法，使用其制造的检查晶片或半导体器件，晶片或半导体器件的质量控制方法和缺陷检查装置
公开(公告)号：US09019498B2
公开(公告)日：2015-04-28
申请号：US13510769
申请日：2010-11-19
申请人： Kazufumi Sakai , Kazuhiro Nonaka , Shinsuke Yamaguchi
发明人： Kazufumi Sakai , Kazuhiro Nonaka , Shinsuke Yamaguchi
IPC分类号： G01J4/00 , G01N21/95 , G01N21/21 , H01L21/66
CPC分类号： G01N21/9505 , G01L1/241 , G01N21/21 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Light from a light source device is polarized through a polarizer and is caused to impinge obliquely onto an object to be inspected. The resulting scattered light is received by a CCD imaging device having an element for separating scattered polarized light disposed in a dark field. Component light intensities are worked out for an obtained P-polarized component image and an obtained S-polarized component image and a polarization direction is determined as a ratio of them. The component light intensities and the polarization directions are determined from images obtained by imaging of the light scattering entities in a state where static stress is not applied to the object to the inspected and in a state where static load is applied thereto so as to generate tensional stress on the side irradiated by light. The component light intensities and the polarization directions are compared with predetermined threshold values.
摘要翻译：来自光源装置的光通过偏振片偏振，并被倾斜地撞击到被检查物体上。所得到的散射光由具有用于分离设置在暗场中的散射偏振光的元件的CCD成像装置接收。对于获得的P偏振分量图像计算分量光强度，并且将所获得的S偏振分量图像和偏振方向确定为它们的比率。分量光强度和偏振方向由静态应力未被施加到被检查物体的状态下的光散射体成像得到的图像和静电负荷施加到其上的状态确定，从而产生张力在光线照射的一侧的应力。将分量光强度和偏振方向与预定阈值进行比较。

2. 发明授权

US08599379B2 Method for inspecting defects and defect inspecting apparatus 有权
标题翻译：缺陷检查方法和缺陷检查装置
公开(公告)号：US08599379B2
公开(公告)日：2013-12-03
申请号：US12993389
申请日：2009-05-22
申请人： Kazufumi Sakai , Kazuhiro Nonaka
发明人： Kazufumi Sakai , Kazuhiro Nonaka
IPC分类号： G01J4/00 , G01N21/00
CPC分类号： G01N21/9505 , G01N21/94 , G01N21/9501 , G01N29/2418 , G01N2021/4792 , G01N2021/8848 , G01N2021/8896 , G06T7/001 , G06T2207/30148 , H01L22/12
摘要： Light from a light source device (4) is polarized through a polarizer (5) and is caused to impinge obliquely on an object (W) to be inspected. The resulting scattered light (SB) is received by a CCD imaging device (7) having an element (9) for separating scattered light disposed in a dark field. Component light intensities are worked out for an obtained P-polarized component image and an obtained S-polarized component image and a polarization direction is determined as a ratio of them. The component light intensities and the polarization directions are determined from images obtained by imaging of the light scattering entities in a state where stress is applied to the object to be inspected and in a state where stress is not applied thereto. The component light intensities and the polarization directions are compared with predetermined threshold values. As a result, defects in the inspection object, such as internal deposits or cavity defects, foreign matter or scratches on the surface or cracks in the surface layer can be detected with high precision and the defects can be classified by identifying the type of the defect.
摘要翻译：来自光源装置（4）的光通过偏振器（5）偏振，并被倾斜地撞击在被检查物体（W）上。得到的散射光（SB）由CCD成像装置（7）接收，CCD成像装置（7）具有用于分离设置在暗场中的散射光的元件（9）。对于获得的P偏振分量图像计算分量光强度，并且将所获得的S偏振分量图像和偏振方向确定为它们的比率。分量光强度和偏振方向由通过在对被检测物体施加应力的状态下和在不施加应力的状态下对光散射体进行成像而获得的图像确定。将分量光强度和偏振方向与预定阈值进行比较。结果，可以高精度地检测检查对象中的缺陷，例如内部沉积物或空腔缺陷，表面上的异物或划痕或表面层的裂纹，并且可以通过识别缺陷的类型来分类缺陷。

3. 发明申请

US20120262715A1 METHOD FOR INSPECTING DEFECTS, INSPECTED WAFER OR SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME, METHOD FOR QUALITY CONTROL OF WAFERS OR SEMICONDUCTOR DEVICES AND DEFECT INSPECTING APPARATUS 有权
标题翻译：用于检查缺陷的方法，使用其制造的检查的半导体器件或半导体器件，用于质量控制的半导体器件和半导体器件的方法和缺陷检查器件
公开(公告)号：US20120262715A1
公开(公告)日：2012-10-18
申请号：US13510769
申请日：2010-11-19
申请人： Kazufumi Sakai , Kazuhiro Nonaka , Shinsuke Yamaguchi
发明人： Kazufumi Sakai , Kazuhiro Nonaka , Shinsuke Yamaguchi
IPC分类号： G01N21/956
CPC分类号： G01N21/9505 , G01L1/241 , G01N21/21 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Light from a light source device is polarized through a polarizer and is caused to impinge obliquely onto an object to be inspected. The resulting scattered light is received by a CCD imaging device having an element for separating scattered polarized light disposed in a dark field. Component light intensities are worked out for an obtained P-polarized component image and an obtained S-polarized component image and a polarization direction is determined as a ratio of them. The component light intensities and the polarization directions are determined from images obtained by imaging of the light scattering entities in a state where static stress is not applied to the object to the inspected and in a state where static load is applied thereto so as to generate tensional stress on the side irradiated by light. The component light intensities and the polarization directions are compared with predetermined threshold values.
摘要翻译：来自光源装置的光通过偏振片偏振，并被倾斜地撞击到被检查物体上。所得到的散射光由具有用于分离设置在暗场中的散射偏振光的元件的CCD成像装置接收。对于获得的P偏振分量图像计算分量光强度，并且将所获得的S偏振分量图像和偏振方向确定为它们的比率。分量光强度和偏振方向由静态应力未被施加到检查对象的状态下的光散射体成像得到的图像和静电负荷施加到其上的状态来确定，以产生张力在光线照射的一侧的应力。将分量光强度和偏振方向与预定阈值进行比较。

4. 发明申请

US20110069313A1 METHOD FOR INSPECTING DEFECTS AND DEFECT INSPECTING APPARATUS 有权
标题翻译：检查缺陷和缺陷检查装置的方法
公开(公告)号：US20110069313A1
公开(公告)日：2011-03-24
申请号：US12993389
申请日：2009-05-22
申请人： Kazufumi Sakai , Kazuhiro Nonaka
发明人： Kazufumi Sakai , Kazuhiro Nonaka
IPC分类号： G01N21/956
CPC分类号： G01N21/9505 , G01N21/94 , G01N21/9501 , G01N29/2418 , G01N2021/4792 , G01N2021/8848 , G01N2021/8896 , G06T7/001 , G06T2207/30148 , H01L22/12
摘要： Light from a light source device (4) is polarized through a polarizer (5) and is caused to impinge obliquely on an object (W) to be inspected. The resulting scattered light (SB) is received by a CCD imaging device (7) having an element (9) for separating scattered light disposed in a dark field. Component light intensities are worked out for an obtained P-polarized component image and an obtained S-polarized component image and a polarization direction is determined as a ratio of them. The component light intensities and the polarization directions are determined from images obtained by imaging of the light scattering entities in a state where stress is applied to the object to be inspected and in a state where stress is not applied thereto. The component light intensities and the polarization directions are compared with predetermined threshold values. As a result, defects in the inspection object, such as internal deposits or cavity defects, foreign matter or scratches on the surface or cracks in the surface layer can be detected with high precision and the defects can be classified by identifying the type of the defect.
摘要翻译：来自光源装置（4）的光通过偏振器（5）偏振，并被倾斜地撞击在被检查物体（W）上。得到的散射光（SB）由CCD成像装置（7）接收，CCD成像装置（7）具有用于分离设置在暗场中的散射光的元件（9）。对于获得的P偏振分量图像计算分量光强度，并且将所获得的S偏振分量图像和偏振方向确定为它们的比率。分量光强度和偏振方向由通过在对被检测物体施加应力的状态下和在不施加应力的状态下对光散射体进行成像而获得的图像确定。将分量光强度和偏振方向与预定阈值进行比较。结果，可以高精度地检测检查对象中的缺陷，例如内部沉积物或空腔缺陷，表面上的异物或划痕或表面层的裂纹，并且可以通过识别缺陷的类型来分类缺陷。

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