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1. 发明授权

US5368950A Water-soluble, film-forming inorganic compounds, fireproof and fire-resistance composites and fire-resistance, flexible, sheet composite covering materials formed by the use of the compounds, and fire-resistance-covering process 失效
标题翻译：水溶性，成膜无机化合物，耐火和耐火复合材料和耐火性，通过使用化合物形成的柔性，片状复合材料覆盖材料和耐火覆盖工艺
公开(公告)号：US5368950A
公开(公告)日：1994-11-29
申请号：US66223
申请日：1993-05-25
申请人： Naoto Kokuta , Kenji Kokuta , Katsuhiro Kokuta , Hiroshi Kokuta
发明人： Naoto Kokuta , Kenji Kokuta , Katsuhiro Kokuta , Hiroshi Kokuta
IPC分类号： B32B7/12 , C04B12/00 , C04B28/00 , C04B41/50 , C09D1/00 , C09J1/00 , B32B9/04 , C01B35/10 , C09D5/16 , C09K21/02
CPC分类号： C04B41/009 , B32B7/12 , C04B12/00 , C04B28/00 , C04B41/5076 , C09D1/00 , C09J1/00 , C04B2111/00525 , C04B2111/50
摘要： Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.
摘要翻译：比重为1.1以上且能够在常温或加热下成膜的水溶性成膜无机化合物。该化合物是通过金属，碱金属的氢氧化物与氢氟酸或硼酸及其盐或其次磺酸盐的反应形成的。水溶性成膜无机化合物在耐火，耐热，隔热性方面优异，也具有防锈性。该化合物可用作由金属，木材等制成的防火和耐热分层复合材料中的耐热粘合剂。还提供了涂有这些化合物层的材料的方法。

2. 发明申请

US20050075410A1 Inorganic dissolution accelerator making metal or inorganic substance water-soluble 审中-公开
标题翻译：无机溶解促进剂使金属或无机物质溶于水
公开(公告)号：US20050075410A1
公开(公告)日：2005-04-07
申请号：US10467277
申请日：2002-02-08
申请人： Hiroshi Kokuta , Katsuhiro Kokuta , Hideaki Uchida , Kenji Kokuta , Naoto Kokuta
发明人： Hiroshi Kokuta , Katsuhiro Kokuta , Hideaki Uchida , Kenji Kokuta , Naoto Kokuta
IPC分类号： C04B22/08 , C04B28/00 , C04B28/04 , C04B40/00 , C09K21/02 , C09K21/14 , C08G18/00
CPC分类号： C09K21/14 , C04B28/006 , C04B28/04 , C04B28/06 , C04B28/26 , C04B40/0039 , C04B2103/10 , C04B2111/28 , C09K21/02 , Y02P40/165 , C04B22/0013 , C04B22/10 , C04B22/126 , C04B22/165 , C04B40/0263 , C04B24/02 , C04B24/282 , C04B38/02 , C04B40/0218 , C04B2103/63
摘要： The invention provides an inorganic dissolution accelerator used for obtaining a water-soluble inorganic compound(s), high in concentration and containing a large solid content, which accelerator is prepared by making one or more compounds selected from fluorides, mineral acids, mineral “ous” acids and salts thereof, and boric acid compounds, all either natural or synthetic, coexist with an alkali metal and/or substance containing an alkaline metal, and is able to transform metals and inorganic substances present in water, either natural or synthetic, containing as the main component silicon Si, aluminum Al, and/or boron B, into amorphous highly water-soluble inorganic compounds having the solubilities equal to, or larger than those well known in the art.
摘要翻译：本发明提供一种无机溶解促进剂，用于获得高浓度且含有大量固体含量的水溶性无机化合物，该促进剂通过制备一种或多种选自氟化物，无机酸，矿物质的化合物天然或合成的酸及其盐及硼酸化合物与碱金属和碱金属的碱金属和/或物质共存，能够转化天然或合成的水中存在的金属和无机物质，其含有作为主要组分硅Si，铝Al和/或硼B，成为具有等于或大于本领域公知的溶解度的无定形高度水溶性无机化合物。

3. 发明授权

US5049316A Water-soluble, film-forming inorganic compounds, fireproof and fire-resistant composites and fire-resistant, flexible, sheet composite covering materials formed by the use of the compounds, and process for preparing fire-resistant coverings 失效
标题翻译：水溶性，成膜无机化合物，耐火和耐火复合材料以及使用该化合物形成的耐火，柔性，片状复合材料覆盖材料，以及制备耐火覆盖层的方法
公开(公告)号：US5049316A
公开(公告)日：1991-09-17
申请号：US365112
申请日：1989-06-12
申请人： Naoto Kokuta , Kenji Kokuta , Katsuhiro Kokuta , Hiroshi Kokuta
发明人： Naoto Kokuta , Kenji Kokuta , Katsuhiro Kokuta , Hiroshi Kokuta
IPC分类号： B32B7/12 , C04B12/00 , C04B28/00 , C04B41/50 , C09D1/00 , C09J1/00
CPC分类号： C04B41/009 , B32B7/12 , C04B12/00 , C04B28/00 , C04B41/5076 , C09D1/00 , C09J1/00 , C04B2111/00525 , C04B2111/50
摘要： Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.

4. 发明申请

US20070137525A1 Water-soluble inorganic composition, plasticized substance, and foamed inorganic substance 审中-公开
标题翻译：水溶性无机组合物，增塑物质和发泡无机物质
公开(公告)号：US20070137525A1
公开(公告)日：2007-06-21
申请号：US11649289
申请日：2007-01-04
申请人： Hiroshi Kokuta , Katsuhiro Kokuta , Hideaki Uchida , Kenji Kokuta , Naoto Kokuta
发明人： Hiroshi Kokuta , Katsuhiro Kokuta , Hideaki Uchida , Kenji Kokuta , Naoto Kokuta
IPC分类号： C09D1/00 , C09D5/20 , C04B40/00
CPC分类号： C09K21/14 , C04B28/006 , C04B28/04 , C04B28/06 , C04B28/26 , C04B40/0039 , C04B2103/10 , C04B2111/28 , C09K21/02 , Y02P40/165 , C04B22/0013 , C04B22/10 , C04B22/126 , C04B22/165 , C04B40/0263 , C04B24/02 , C04B24/282 , C04B38/02 , C04B40/0218 , C04B2103/63
摘要： A water-soluble inorganic composition obtained by reacting an inorganic dissolution promoter with at least one solute selected from the group consisting of metal silicon, boric acid, and borax at a ratio of the inorganic dissolution promoter to the solute of 1:10 to 1:100 by weight, wherein the inorganic dissolution promoter is obtained by mixing in water (A) at least one compound selected from the group consisting of an alkali metal fluoride, an alkali metal phosphite, an alkali metal sulfite, an Alkali metal nitrite, sulfurous acid, nitrous acid, and phosphorous acid, alkali metal phosphate, alkali metal nitrate, alkali metal sulfate, phosphoric acid, nitric acid, sulfuric acid and (B) at least one alkali metal hydroxide at a ratio of (A):(B) of 1:9 to 4:1 by weight; a plasticized substance; and a foamed inorganic substance are provided. According to the present invention, a homogeneous and high concentration aqueous solution of a water-soluble inorganic composition is provided by homogeneously dissolving water-insoluble metal silicon or a scarcely water-soluble inorganic boron compound in water in an excess amount without causing these inorganic materials to remain at the bottom of the reactor, and a plasticized substance and foamed inorganic substance excelling in processability and handling properties and useful as a civil engineering and construction material are also provided.
摘要翻译：将无机溶解促进剂与选自金属硅，硼酸和硼砂中的至少一种溶质以无机溶解促进剂与溶质的比例为1:10至1：1的反应获得的水溶性无机组合物， 100重量份，其中无机溶解促进剂通过在水（A）中混合至少一种选自碱金属氟化物，碱金属亚磷酸盐，碱金属亚硫酸盐，碱金属亚硝酸盐，亚硫酸，亚硝酸和亚磷酸，碱金属磷酸盐，碱金属硝酸盐，碱金属硫酸盐，磷酸，硝酸，硫酸和（B）至少一种碱金属氢氧化物，其比例为（A）：（B） 1：9至4：1; 增塑物质并提供发泡无机物质。根据本发明，通过将不溶于水的金属硅或几乎不溶于水的无机硼化合物在过量的水中均匀溶解而不引起这些无机材料，提供均匀且高浓度的水溶性无机组合物水溶液保留在反应器的底部，并且还提供了可加工性和操作性优异的增塑物质和发泡无机物质，并且用作土木工程和建筑材料。

5. 发明授权

US5234631A Fireproof or refractory materials containing fire-resistant, water soluble, film-forming inorganic compounds 失效
$Fireproof or refractory materials containing fire-resistant, water soluble, film-forming inorganic compounds$
标题翻译：耐火或耐火材料含有耐火，水溶性，成膜无机化合物
公开(公告)号：US5234631A
公开(公告)日：1993-08-10
申请号：US693480
申请日：1991-04-30
申请人： Naoto Kokuta , Kenji Kokuta , Katsuhiro Kokuta , Hiroshi Kokuta
发明人： Naoto Kokuta , Kenji Kokuta , Katsuhiro Kokuta , Hiroshi Kokuta
IPC分类号： B32B7/12 , C04B12/00 , C04B28/00 , C04B41/50 , C09D1/00 , C09J1/00
CPC分类号： B32B7/12 , C04B28/30 , C04B41/5076 , C09D1/00 , C09J1/00 , C04B2111/00551 , C04B2111/28 , Y02W30/94
摘要： Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.
摘要翻译：比重为1.1以上且能够在常温或加热下成膜的水溶性成膜无机化合物。该化合物是通过金属，碱金属的氢氧化物与氢氟酸或硼酸及其盐或其次磺酸盐的反应形成的。水溶性成膜无机化合物在耐火，耐热，隔热性方面优异，也具有防锈性。该化合物可用作由金属，木材等制成的防火和耐热分层复合材料中的耐热粘合剂。还提供了涂有这些化合物层的材料的方法。

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