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    • 6. 发明申请
    • THERAPEUTIC REGIMEN FOR TREATING CANCER
    • 治疗癌症的治疗方案
    • US20070166284A1
    • 2007-07-19
    • US11695437
    • 2007-04-02
    • Henrik RasmussenKaren Chu
    • Henrik RasmussenKaren Chu
    • A61K48/00C12N15/861
    • A61K35/761A61K38/191C12N2710/10332C12N2710/10341A61K2300/00
    • The invention provides a method for treating cancer in a human comprising administering to the human a dose of a pharmaceutical composition comprising (i) a pharmaceutically acceptable carrier and (ii) an adenoviral vector comprising a nucleic acid sequence encoding TNF-α operably linked to a promoter, wherein the dose comprises about 1×107 to about 4×1012 particle units (pu) of replication-deficient adenoviral vector, at least once in a therapeutic period comprising up to 10 weeks, whereby the cancer in human is treated. The invention further provides a method of treating a human for multiple tumors, wherein the method comprises contacting a first tumor with a dose of the pharmaceutical composition at least once in a therapeutic period comprising up to about 10 weeks, whereby the human is treated for the first tumor and one or more additional tumors.
    • 本发明提供了一种治疗人类癌症的方法,包括向人施用剂量的药物组合物,其包含(i)药学上可接受的载体和(ii)腺病毒载体,其包含编码与α-α可操作地连接的TNF-α的核酸序列 启动子,其中所述剂量包含约1×10 7个至约4×10 12个复制缺陷型腺病毒载体的颗粒单位(pu),在治疗期至少一次包括至多10 周,其中治疗人类的癌症。 本发明进一步提供了治疗多种肿瘤的方法,其中所述方法包括使第一肿瘤与一定剂量的药物组合物在至多约10周的治疗期内至少接触一次,由此将该人治疗为 第一肿瘤和一个或多个另外的肿瘤。
    • 7. 发明授权
    • Method to improve barrier layer adhesion
    • 改善阻隔层粘附性的方法
    • US06797642B1
    • 2004-09-28
    • US10267305
    • 2002-10-08
    • Karen ChuAnil VijayendranMichal Danek
    • Karen ChuAnil VijayendranMichal Danek
    • H01L2131
    • H01L21/76844C23C14/5826C23C16/56H01L21/76805H01L21/76814H01L21/76862
    • The present invention provides a method to improve adhesion of barrier, metal, dielectric interfaces. In the process flow, a first barrier material is formed on a dielectric layer and bombarded with a plasma to effectively push the barrier material into the dielectric interface while leaving a portion of the barrier material over the dielectric. A second barrier material, which may or may not be the same as the first barrier material, is then formed on the remaining first barrier material. Advantageously, the method of the present invention allows the barrier material to be pushed into the dielectric to insure excellent adhesion, which prevents chemical mechanical polishing delamination. Furthermore, the presence of the first barrier material on the sidewalls of via apertures through the dielectric can prevent Cu poisoning from sputtered Cu or CxOy.
    • 本发明提供了改善阻挡层,金属,电介质界面的附着力的方法。 在工艺流程中,第一阻挡材料形成在电介质层上并用等离子体轰击以有效地将阻挡材料推入电介质界面,同时将阻挡材料的一部分留在电介质上。 然后可以在剩余的第一阻挡材料上形成第二阻挡材料,其可以或可以不与第一阻挡材料相同。 有利地,本发明的方法允许阻挡材料被推入电介质以确保优异的粘附性,这防止了化学机械抛光分层。 此外,通过电介质的通孔的侧壁上的第一阻挡材料的存在可以防止溅射的Cu或C x O y的Cu中毒。