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1. 发明授权

US5574074A Foamable organic polymer composition and production of foamed article 失效
标题翻译：可发泡有机聚合物组合物和泡沫制品的生产
公开(公告)号：US5574074A
公开(公告)日：1996-11-12
申请号：US197884
申请日：1994-02-17
申请人： Toshihiro Zushi , Takashi Higashikubo , Tamotsu Kaide , Takuma Takai , Makoto Wada , Kaneharu Suga
发明人： Toshihiro Zushi , Takashi Higashikubo , Tamotsu Kaide , Takuma Takai , Makoto Wada , Kaneharu Suga
IPC分类号： C08J9/04 , C08J9/12 , H01B3/44 , C08J9/10
CPC分类号： C08J9/122 , C08J9/04 , H01B3/441 , C08J2323/02
摘要： A foamable organic composition comprising a compound foamable to 50% or more comprising an organic polymer and a chemical foaming agent, and, as a physical foaming agent, at least one member selected from the group consisting of rare gases and carbon dioxide; and a method for producing a foamed article having a high expansion ratio by using said composition. According to the present invention, a foamed article having a uniform and fine foam structure and a high expansion ratio of not less than 75% (which is as high as when freon gas is used) can be obtained without causing environmental problems such as depletion of the ozon layer. When applied, in particular, to a foamed layer for an insulated conductor, such as foam-insulated electric wire which is required to have high performance insulation and is occasionally installed under severe conditions, the composition of the present invention advantageously provides an insulated conductor with no potential buckling.
摘要翻译：一种可发泡的有机组合物，其包含可发泡至50％或更多的包含有机聚合物和化学发泡剂的化合物，以及作为物理发泡剂的至少一种选自稀有气体和二氧化碳的组分; 以及通过使用所述组合物制造具有高膨胀率的发泡制品的方法。根据本发明，可以获得具有均匀且细小的泡沫结构和高膨胀率不小于75％（与使用氟利昂气体时相同的高膨胀率）的发泡制品，而不会造成环境问题，如消耗臭氧层。尤其适用于要求具有高性能绝缘性且偶尔在恶劣条件下安装的绝缘导体如泡沫绝缘电线的发泡层时，本发明的组合物有利地提供了一种具有没有潜在的屈曲。

2. 发明授权

US5180754A Polymer composition for foam molding 失效
标题翻译：泡沫成型用聚合物组合物
公开(公告)号：US5180754A
公开(公告)日：1993-01-19
申请号：US713218
申请日：1991-06-11
申请人： Yukio Morita , Toshihiro Zushi , Nobuyoshi Matsuda , Kaneharu Suga , Takuma Takai
发明人： Yukio Morita , Toshihiro Zushi , Nobuyoshi Matsuda , Kaneharu Suga , Takuma Takai
IPC分类号： C08J9/00
CPC分类号： C08J9/0066 , C08J2323/02 , Y10S521/908
摘要： Polymer compositions for molding in the presence of a foaming agent which comprise at least a polyolefin resin as a base resin and low polarity boron compound powder which is not decomposed at a foaming temperature, such as boron nitride powder as a nucleator. Polymer compositions of the invention are useful for formation of a foamed insulating layer on a conductive material by way of foam molding. By using said polymer composition, a foamed insulating layer excellent in insulation properties which has small dielectric loss factor, tan .delta., at high frequency and high extent of foaming of not less than 70% can be obtained.
摘要翻译：在发泡剂存在下成型的聚合物组合物，该发泡剂至少包含作为基础树脂的聚烯烃树脂和在发泡温度下不分解的低极性硼化合物粉末，例如作为成核剂的氮化硼粉末。本发明的聚合物组合物可用于通过泡沫模塑在导电材料上形成发泡绝缘层。通过使用所述聚合物组合物，可以获得绝缘性能优异的具有小于70％的介电损耗因子，tanδ，高频率和高发泡程度的发泡绝缘层。

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