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1. 发明授权

US06172590B2 Over-voltage protection device and method for making same 失效
标题翻译：过电压保护装置及其制作方法
公开(公告)号：US06172590B2
公开(公告)日：2001-01-09
申请号：US08941917
申请日：1997-10-01
申请人： Karen P. Shrier , Gerald R. Behling , James B. Intrater , Mike Olla , Jimmie D. Felps , Kailash C. Joshi
发明人： Karen P. Shrier , Gerald R. Behling , James B. Intrater , Mike Olla , Jimmie D. Felps , Kailash C. Joshi
IPC分类号： H01C710
CPC分类号： H01L23/62 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A mass-producible, cost-effective discrete electrical protection device utilizing a precision gap between two electrically conductive members attached to an electrically insulating substrate to provide over-voltage protection to an electrical device. In one aspect, the electrical protection device is a surface mountable device. In another aspect, the device has through-holes for accommodating leads on an electrical connector. Methods are provided also for making the electrical protection device.
摘要翻译：一种大规模生产的，具有成本效益的离散电气保护装置，其利用连接到电绝缘基板的两个导电构件之间的精密间隙来向电气装置提供过电压保护。在一个方面，电气保护装置是可表面安装的装置。在另一方面，该装置具有用于在电连接器上容纳引线的通孔。还提供了用于制造电气保护装置的方法。

2. 发明授权

US4180863A Magnetic domain device modular assembly 失效
标题翻译：磁畴器件模块化组装
公开(公告)号：US4180863A
公开(公告)日：1979-12-25
申请号：US920927
申请日：1978-06-30
申请人： Kailash C. Joshi
发明人： Kailash C. Joshi
IPC分类号： G11C11/14 , G11C19/08 , G11C5/04
CPC分类号： G11C19/085
摘要： Plural groups of one or more magnetic domain devices each are mounted in an array on the circuitized surface of a common substrate. A rectangular pattern of slots is provided in the substrate around each group. Each group is encompassed through the slots by the turns of the inner and outer orthogonal solenoids of its own exlusive rotational magnetic field drive system and permanent magnet bias field closed structure. Each device has a pattern of I/O pads located on its undersurface which are bonded to a corresponding pattern of terminal pads which are part of the circuitized surface of the substrate. The interconnecting signal lines to the terminal pads of the substrate pass through one or more of the four intersection corners formed between the slots of the rectangular pattern. Preferably, the substrate also accommodates integrated circuit modules and/or other components mounted thereon which are associated with the drive, sense and other support circuitry for the magnetic domain devices.
摘要翻译：多个一个或多个磁畴器件各自以阵列的形式安装在公共衬底的电路化表面上。在每个组周围的基板中设置有矩形的槽形图案。每个组通过其自身的外部旋转磁场驱动系统的内外正交螺线管和永磁偏置磁场闭合结构的匝而穿过狭槽。每个器件具有位于其下表面上的I / O焊盘的图案，其连接到作为衬底的电路化表面的一部分的端子焊盘的相应图案。到衬底的端子焊盘的互连信号线穿过形成在矩形图案的槽之间的四个交叉角中的一个或多个。优选地，衬底还容纳安装在其上的集成电路模块和/或与磁畴器件的驱动，感测和其他支持电路相关联的其它部件。

3. 发明授权

US06657532B1 Single and multi layer variable voltage protection devices and method of making same 有权
标题翻译：单层和多层可变电压保护装置及其制作方法
公开(公告)号：US06657532B1
公开(公告)日：2003-12-02
申请号：US09139309
申请日：1998-08-24
申请人： Karen P. Shrier , Gerald R. Behling , James B. Intrater , Kailash C. Joshi , William W. Alston, Jr.
发明人： Karen P. Shrier , Gerald R. Behling , James B. Intrater , Kailash C. Joshi , William W. Alston, Jr.
IPC分类号： H01C710
CPC分类号： H01C7/10 , H01C7/105 , H01C7/12
摘要： Disclosed is a variable voltage protection device for electronic devices which in one aspect comprises a thin layer of neat dielectric polymer or glass positioned between a ground plane and an electrical conductor for overvoltage protection, wherein the neat polymer or glass layer does not include the presence of conductive or semiconductive particles. Also disclosed is the combination of the neat dielectric polymer or glass thin layer positioned on a conventional variable voltage protection material comprising a binder containing conductive or semiconductive particles. A multi-layer variable voltage protection component is disclosed comprising three layers of overvoltage protection material wherein the outer two layers contain a lower percentage of conductive or semiconductive particles and wherein the inner layer contains a higher percentage of conductive or semiconductive particles. The multi-layer component can optionally be used in combination with the neat dielectric polymer or glass layer and can optionally have interposed metal layers. A method is disclosed for dispersing insulative particles and conductive or semiconductive particles in a binder using a volatile solvent for dispersement of the insulative particles and the conductive or semiconductive particles before mixing with the binder.
摘要翻译：公开了一种用于电子设备的可变电压保护装置，其一方面包括位于接地平面和用于过电压保护的电导体之间的纯介电聚合物或玻璃的薄层，其中纯聚合物或玻璃层不包括导电或半导体颗粒。还公开了位于常规可变电压保护材料上的纯介电聚合物或玻璃薄层的组合，其包含含有导电或半导体颗粒的粘合剂。公开了一种多层可变电压保护组件，其包括三层过电压保护材料，其中外两层含有较低百分比的导电或半导电颗粒，并且其中内层含有较高百分比的导电或半导电颗粒。多层组分可以任选地与纯介电聚合物或玻璃层组合使用，并且可以任选地具有插入的金属层。公开了一种用于在粘合剂混合之前使用用于分散绝缘颗粒和导电或半导电颗粒的挥发性溶剂将绝缘颗粒和导电或半导电颗粒分散在粘合剂中的方法。

4. 发明授权

US4179802A Studded chip attachment process 失效
标题翻译：镶嵌芯片附件工艺
公开(公告)号：US4179802A
公开(公告)日：1979-12-25
申请号：US890445
申请日：1978-03-27
申请人： Kailash C. Joshi , Ronald N. Spaight
发明人： Kailash C. Joshi , Ronald N. Spaight
IPC分类号： H05K3/34 , H01L21/60 , H01L21/768 , H01L21/822 , H01L23/485 , H01L23/522 , H01L23/538 , H01L27/04 , H01L39/00
CPC分类号： H01L24/13 , H01L24/11 , H01L24/81 , H01L2224/13099 , H01L2224/13147 , H01L2224/81801 , H01L2924/0001 , H01L2924/00013 , H01L2924/01005 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01078 , H01L2924/014 , H01L2924/14 , Y10S505/923 , Y10S505/927 , Y10T29/49126 , Y10T29/49149 , Y10T29/49156
摘要： A plurality of metal studs are plated on a chip carrier surface in a pattern to match a terminal metal footprint on a chip to be joined. The studs are of sufficient height to permit flux cleaning, if necessary. After the studs are in place, the chip is aligned with the carrier and attached thereto, the chip pads containing a small amount of solder to provide the connecting joints. The carrier and chip are made of materials having nearly equal thermal expansion characteristics.
摘要翻译：将多个金属螺柱以图案电镀在芯片载体表面上以匹配要连接的芯片上的端子金属覆盖区。如果需要，螺柱具有足够的高度以允许焊剂清洁。在螺柱就位之后，芯片与载体对准并附接到其上，芯片焊盘包含少量焊料以提供连接接头。载体和芯片由具有几乎相等的热膨胀特性的材料制成。

5. 发明授权

US06542065B2 Variable voltage protection structures and method for making same 失效
公开(公告)号：US06542065B2
公开(公告)日：2003-04-01
申请号：US09828883
申请日：2001-04-10
申请人： Karen P. Shrier , Gerald R. Behling , Kailash C. Joshi , William W. Alston, Jr.
发明人： Karen P. Shrier , Gerald R. Behling , Kailash C. Joshi , William W. Alston, Jr.
IPC分类号： H01C710
CPC分类号： H05K1/0257 , H01C7/105 , H01L2224/48091 , H01L2224/49171 , H05K1/0259 , H05K1/167 , H05K3/429 , H05K2201/0738 , H01L2924/00014
摘要： A variable voltage protection component in accordance with this invention comprises a reinforcing layer of insulating material having a substantially constant thickness embedded in a voltage variable material. With this configuration, the reinforcing layer defines a uniform thickness for the variable voltage protection component that is resist to compressive forces that may cause a reduction in the clamp voltage or a short in the voltage variable material. In addition, the variable voltage protection component can be attached to a compressible ground plane to form a variable voltage protection device. Methods are provided for making the variable voltage protection component and device.

6. 发明授权

US06310752B1 Variable voltage protection structures and method for making same 失效
标题翻译：可变电压保护结构及其制作方法
公开(公告)号：US06310752B1
公开(公告)日：2001-10-30
申请号：US08790250
申请日：1997-01-28
申请人： Karen P. Shrier , Gerald R. Behling , Kailash C. Joshi , William W. Alston, Jr.
发明人： Karen P. Shrier , Gerald R. Behling , Kailash C. Joshi , William W. Alston, Jr.
IPC分类号： H02H900
CPC分类号： H05K1/0257 , H01C7/105 , H01L2224/48091 , H01L2224/49171 , H05K1/0259 , H05K1/167 , H05K3/429 , H05K2201/0738 , H01L2924/00014
摘要： A variable voltage protection component in accordance with this invention comprises a reinforcing layer of insulating material having a substantially constant thickness embedded in a voltage variable material. With this configuration, the reinforcing layer defines a uniform thickness for the variable voltage protection component that is resist to compressive forces that may cause a reduction in the clamp voltage or a short in the voltage variable material. In addition, the variable voltage protection component can be attached to a compressible grounding plane to form a variable voltage protection device. Methods are provided for making the variable voltage protection component and device.
摘要翻译：根据本发明的可变电压保护部件包括具有嵌入电压可变材料中的基本恒定厚度的绝缘材料的加强层。利用这种构造，增强层限定了用于可变电压保护部件的均匀的厚度，其抗压缩力可能导致钳位电压的降低或电压可变材料的短路。另外，可变电压保护元件可以附接到可压缩的接地平面，形成可变电压保护器件。提供了制作可变电压保护元件和器件的方法。

7. 发明授权

US07049926B2 Single and multi layer variable voltage protection devices and method of making same 有权
公开(公告)号：US07049926B2
公开(公告)日：2006-05-23
申请号：US10702084
申请日：2003-11-06
申请人： Karen P. Shrier , Gerald R. Behling , James B. Intrater , Kailash C. Joshi , William W. Alston, Jr.
发明人： Karen P. Shrier , Gerald R. Behling , James B. Intrater , Kailash C. Joshi , William W. Alston, Jr.
IPC分类号： H01C7/10
CPC分类号： G07B5/02 , G07B1/00
摘要： Disclosed is a variable voltage protection device for electronic devices which in one aspect comprises a thin layer of neat dielectric polymer or glass positioned between a ground plane and an electrical conductor for overvoltage protection, wherein the neat polymer or glass layer does not include the presence of conductive or semiconductive particles. Also disclosed is the combination of the neat dielectric polymer or glass thin layer positioned on a conventional variable voltage protection material comprising a binder containing conductive or semiconductive particles. A multi-layer variable voltage protection component is disclosed comprising three layers of overvoltage protection material wherein the outer two layers contain a lower percentage of conductive or semiconductive particles and wherein the inner layer contains a higher percentage of conductive or semiconductive particles. The multi-layer component can optionally be used in combination with the neat dielectric polymer or glass layer and can optionally have interposed metal layers. A method is disclosed for dispersing insulative particles and conductive or semiconductive particles in a binder using a volatile solvent for dispersement of the insulative particles and the conductive or semiconductive particles before mixing with the binder.

8. 发明授权

US06239687B1 Variable voltage protection structures and method for making same 失效
标题翻译：可变电压保护结构及其制作方法
公开(公告)号：US06239687B1
公开(公告)日：2001-05-29
申请号：US08943189
申请日：1997-10-03
申请人： Karen P. Shrier , Gerald R. Behling , Kailash C. Joshi , William W. Alston, Jr.
发明人： Karen P. Shrier , Gerald R. Behling , Kailash C. Joshi , William W. Alston, Jr.
IPC分类号： H01C713
CPC分类号： H05K1/0257 , H01C7/105 , H01L2224/48091 , H01L2224/49171 , H05K1/0259 , H05K1/167 , H05K3/429 , H05K2201/0738 , H01L2924/00014
摘要： A variable voltage protection component is provided with a reinforcing layer of insulating material having a substantially constant thickness embedded in a voltage variable material. The reinforcing layer defines a uniform thickness for the variable voltage protection component that is resistant to compressive forces that may cause a reduction in the clamp voltage or a short in the voltage variable material. In addition, the variable voltage protection device component can be attached to a compressible ground plane to form a variable voltage protection device.
摘要翻译：可变电压保护元件设置有嵌入电压可变材料中的具有基本恒定厚度的绝缘材料的增强层。增强层限定了可变电压保护部件的均匀厚度，其抵抗可能导致钳位电压降低或电压可变材料短路的压缩力。此外，可变电压保护装置部件可以附接到可压缩的接地平面，以形成可变电压保护装置。

9. 发明授权

US5807509A Single and multi layer variable voltage protection devices and method of making same 失效
公开(公告)号：US5807509A
公开(公告)日：1998-09-15
申请号：US841475
申请日：1997-04-21
申请人： Karen P. Shrier , Gerald R. Behling , James B. Intrater , Kailash C. Joshi , William W. Alston, Jr.
发明人： Karen P. Shrier , Gerald R. Behling , James B. Intrater , Kailash C. Joshi , William W. Alston, Jr.
IPC分类号： H01C7/10 , H01C7/105 , H01C7/12 , H02H9/04 , H01B1/22
CPC分类号： H01C7/10 , H01C7/105 , H01C7/12
摘要： Disclosed is a variable voltage protection device for electronic devices which in one aspect comprises a thin layer of neat dielectric polymer or glass positioned between a ground plane and an electrical conductor for overvoltage protection, wherein the neat polymer or glass layer does not include the presence of conductive or semiconductive particles. Also disclosed is the combination of the neat dielectric polymer or glass thin layer positioned on a conventional variable voltage protection material comprising a binder containing conductive or semiconductive particles. A multi-layer variable voltage protection component is disclosed comprising three layers of overvoltage protection material wherein the outer two layers contain a lower percentage of conductive or semiconductive particles and wherein the inner layer contains a higher percentage of conductive or semiconductive particles. The multi-layer component can optionally be used in combination with the neat dielectric polymer or glass layer and can optionally have interposed metal layers. A method is disclosed for dispersing insulative particles and conductive or semiconductive particles in a binder using a volatile solvent for dispersement of the insulative particles and the conductive or semiconductive particles before mixing with the binder.

10. 发明授权

US3999004A Multilayer ceramic substrate structure 失效
标题翻译：多层陶瓷基板结构
公开(公告)号：US3999004A
公开(公告)日：1976-12-21
申请号：US509772
申请日：1974-09-27
申请人： Octavio I. Chirino , Joseph Hromek , Kailash C. Joshi , George C. Phillips, Jr.
发明人： Octavio I. Chirino , Joseph Hromek , Kailash C. Joshi , George C. Phillips, Jr.
IPC分类号： H05K3/46 , B32B15/04 , C04B41/88 , H05K1/03 , H05K3/40 , H05K1/04 , H05K1/14
CPC分类号： H05K3/4061 , H05K1/0306 , H05K2201/09509 , H05K2201/09981 , H05K2203/159 , H05K3/4611 , H05K3/4629
摘要： This is a microelectronic multilayer circuit structure having circuit compatibility encapsulated within the circuit package including conductive electrical interconnection means formed by uniquely metallizing the "via" and/or blind interconnection holes within the circuit package. The assembly process provides means of uniformly metallizing the interlayer connecting holes.
摘要翻译：这是具有封装在电路封装内的电路兼容性的微电子多层电路结构，包括通过唯一地金属化电路封装内的“通孔”和/或盲互连孔而形成的导电电互连装置。组装过程提供均匀金属化层间连接孔的手段。

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