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1. 发明授权

US07049051B2 Process for forming and acoustically connecting structures on a substrate 有权
标题翻译：用于在基底上形成和声学连接结构的方法
公开(公告)号：US07049051B2
公开(公告)日：2006-05-23
申请号：US10349618
申请日：2003-01-23
申请人： Kaigham J. Gabriel , Xu Zhu
发明人： Kaigham J. Gabriel , Xu Zhu
IPC分类号： G03C5/00
CPC分类号： B81C1/00158 , A61K8/0208 , A61K2800/33 , A61K2800/58 , A61K2800/72 , A61K2800/75 , A61K2800/94 , B81B2201/0257 , H04R19/005
摘要： The present invention describes a processes that builds an acoustic cavity, a chamber, and vent openings for acoustically connecting the chamber with the acoustic cavity. The dry etch processes may include reactive ion etches, which include traditional parallel plate RIE dry etch processes, advanced deep and inductively coupled plasma RIE processes. Three embodiments for connecting the chamber to the cavity from the top side of the substrate, e.g. by using pilot openings formed using at least a portion of the mesh as an etch mask, by forming the vent openings using at least a portion of the mesh as an etch mask, or by having the chamber intersect the vent openings as the chamber is being formed, illustrate how the disclosed process may be modified. By forming the cavity on the back side of the substrate, the depth of the vent holes is decreased. Additionally, using at least a portion of the micro-machined mesh as an etch mask for the vent holes makes the process self-aligning.
摘要翻译：本发明描述了构建声腔，腔室和用于将腔室与声腔声学连接的通气孔的方法。干蚀刻工艺可以包括反应离子蚀刻，其包括传统的平行板RIE干蚀刻工艺，先进的深度和电感耦合等离子体RIE工艺。用于将腔室从衬底的顶侧连接到空腔的三个实施例，例如，通过使用使用网的至少一部分形成的导向开口作为蚀刻掩模，通过使用网状物的至少一部分作为蚀刻掩模形成通气孔，或者当腔室与腔室相交时，使腔室与通气孔相交形成，说明如何修改公开的过程。通过在基板的背面形成空腔，通气孔的深度减小。此外，使用至少一部分微机加工的网格作为通气孔的蚀刻掩模使得该工艺自对准。

2. 发明授权

US06584468B1 Method and apparatus to retrieve information from a network 有权
标题翻译：从网络检索信息的方法和装置
公开(公告)号：US06584468B1
公开(公告)日：2003-06-24
申请号：US09675594
申请日：2000-09-29
申请人： Kaigham J. Gabriel , Evan M. Indianer , Christopher M. Umbel , Joel Lenhart
发明人： Kaigham J. Gabriel , Evan M. Indianer , Christopher M. Umbel , Joel Lenhart
IPC分类号： G06F1730
CPC分类号： G06F17/30864 , Y10S707/99935
摘要： A method and apparatus to index network information is described. A network is searched for files of information relevant to people and resources in a particular field using a search list of weighted links to said files. The information is parsed into content and additional links to additional files. The content is weighted and copied to memory (such as a database). A determination is made as to whether the additional links are relevant to the people and resources in the given technical field. Those additional links that are relevant are weighted using a predetermined weighting algorithm. The relevant additional weighted links are copied to the search list. This process continues until an ending condition occurs.
摘要翻译：描述了一种索引网络信息的方法和装置。使用对所述文件的加权链接的搜索列表，在特定字段中搜索与人和资源相关的信息的文件。该信息被分析成内容和附加文件的附加链接。内容被加权并复制到内存（如数据库）。确定附加链接是否与给定技术领域的人员和资源相关。使用预定的加权算法来加权相关的附加链接。相关的附加加权链接被复制到搜索列表。该过程持续到结束条件发生。

3. 发明授权

US4864824A Thin film shape memory alloy and method for producing 失效
标题翻译：薄膜形状记忆合金及其制造方法
公开(公告)号：US4864824A
公开(公告)日：1989-09-12
申请号：US265176
申请日：1988-10-31
申请人： Kaigham J. Gabriel , Mehran Mehregany , James A. Walker
发明人： Kaigham J. Gabriel , Mehran Mehregany , James A. Walker
IPC分类号： F03G7/06 , G02B6/35 , H01H1/00 , H01H61/01
CPC分类号： G02B6/3576 , F03G7/065 , G02B6/3508 , G02B6/3552 , G02B6/358 , H01H1/0036 , H01H2061/006 , H01H2061/0122 , H01H61/0107
摘要： An actuator including a device made of thin film shape memory material mounted to a substrate. The thin film device is deformed from its original shape. Thereafter, the device is heated to restore the device to its original shape. Motion of the device occurs in the deforming and restoring steps, which is used to produce some form of work result.
摘要翻译：一种致动器，包括安装到基板上的由薄膜形状记忆材料制成的装置。薄膜装置从原来的形状变形。此后，将该装置加热以将装置恢复到其原始形状。设备的运动发生在变形和恢复步骤中，用于产生某种形式的工作结果。

4. 发明授权

US07640805B2 Proof-mass with supporting structure on integrated circuit-MEMS platform 有权
标题翻译：在集成电路MEMS平台上具有支撑结构的质量
公开(公告)号：US07640805B2
公开(公告)日：2010-01-05
申请号：US11640345
申请日：2006-12-18
申请人： Brett M. Diamond , Matthew A. Zeleznik , Jan E. Vandemeer , Kaigham J. Gabriel
发明人： Brett M. Diamond , Matthew A. Zeleznik , Jan E. Vandemeer , Kaigham J. Gabriel
IPC分类号： G01P15/125
CPC分类号： B81C1/00246 , B81C2203/0742
摘要： Provided is a micro-electromechanical-system (MEMS) device including a substrate; at least one semiconductor layer provided on the substrate; a circuit region including at least one chip containing drive/sense circuitry, the circuit region provided on the at least one semiconductor layer; a support structure attached to the substrate; at least one elastic device attached to the support structure; a proof-mass suspended by the at least one elastic device and free to move in at least one of the x-, y-, and z-directions; at least one top electrode provided on the at least one elastic device; and at least one bottom electrode located beneath the at least one elastic device such that an initial capacitance is generated between the at least one top and bottom electrodes, wherein the drive/sense circuitry, proof-mass, supporting structure, and the at least one top and bottom electrodes are fabricated on the at least one semiconductor layer.
摘要翻译：提供了一种包括基板的微机电系统（MEMS）装置; 设置在所述基板上的至少一个半导体层; 电路区域，包括至少一个包含驱动/感测电路的芯片，所述电路区域设置在所述至少一个半导体层上; 附着在基板上的支撑结构; 连接到所述支撑结构的至少一个弹性装置; 由所述至少一个弹性装置悬挂的自由移动的x，y和z方向中的至少一个; 设置在所述至少一个弹性装置上的至少一个顶部电极; 以及位于所述至少一个弹性装置下方的至少一个底部电极，使得在所述至少一个顶部和底部电极之间产生初始电容，其中所述驱动/感测电路，证明质量，支撑结构和所述至少一个在至少一个半导体层上制造顶部和底部电极。

5. 发明申请

US20080142914A1 Proof-mass with supporting structure on integrated circuit-MEMS platform and method of fabricating the same 有权
标题翻译：集成电路MEMS平台上的支撑结构的证明质量及其制造方法
公开(公告)号：US20080142914A1
公开(公告)日：2008-06-19
申请号：US11640345
申请日：2006-12-18
申请人： Brett M. Diamond , Matthew A. Zeleznik , Jan E. Vandemeer , Kaigham J. Gabriel
发明人： Brett M. Diamond , Matthew A. Zeleznik , Jan E. Vandemeer , Kaigham J. Gabriel
IPC分类号： H01L29/84
CPC分类号： B81C1/00246 , B81C2203/0742
摘要： Provided is a micro-electromechanical-system (MEMS) device including a substrate; at least one semiconductor layer provided on the substrate; a circuit region including at least one chip containing drive/sense circuitry, the circuit region provided on the at least one semiconductor layer; a support structure attached to the substrate; at least one elastic device attached to the support structure; a proof-mass suspended by the at least one elastic device and free to move in at least one of the x-, y-, and z-directions; at least one top electrode provided on the at least one elastic device; and at least one bottom electrode located beneath the at least one elastic device such that an initial capacitance is generated between the at least one top and bottom electrodes, wherein the drive/sense circuitry, proof-mass, supporting structure, and the at least one top and bottom electrodes are fabricated on the at least one semiconductor layer.
摘要翻译：提供了一种包括基板的微机电系统（MEMS）装置; 设置在所述基板上的至少一个半导体层; 电路区域，包括至少一个包含驱动/感测电路的芯片，所述电路区域设置在所述至少一个半导体层上; 附着在基板上的支撑结构; 连接到所述支撑结构的至少一个弹性装置; 由所述至少一个弹性装置悬挂的自由移动的x，y和z方向中的至少一个; 设置在所述至少一个弹性装置上的至少一个顶部电极; 以及位于所述至少一个弹性装置下方的至少一个底部电极，使得在所述至少一个顶部和底部电极之间产生初始电容，其中所述驱动/感测电路，证明质量，支撑结构和所述至少一个在至少一个半导体层上制造顶部和底部电极。

6. 发明授权

US06943448B2 Multi-metal layer MEMS structure and process for making the same 有权
标题翻译：多金属层MEMS结构和制造过程相同
公开(公告)号：US06943448B2
公开(公告)日：2005-09-13
申请号：US10349619
申请日：2003-01-23
申请人： Kaigham J. Gabriel , Xu Zhu
发明人： Kaigham J. Gabriel , Xu Zhu
IPC分类号： B81B3/00 , B81C1/00 , C23F1/00 , H01G4/00 , H01G5/00 , H01G7/00 , H01G9/00 , H01G13/00 , H01H59/00 , H01L23/48 , H01L23/52 , H04R19/00 , H04R19/02 , H04R19/04 , H04R31/00
CPC分类号： B81C1/00158 , B81B2201/018 , B81B2201/0257 , B81C2201/0109 , H01G5/16
摘要： The present invention is directed to a structure comprised of alternating layers of metal and sacrificial material built up using standard CMOS processing techniques, a process for building such a structure, a process for fabricating devices from such a structure, and the devices fabricated from such a structure. In one embodiment, a first metal layer is carried by a substrate. A first sacrificial layer is carried by the first metal layer. A second metal layer is carried by the sacrificial layer. The second metal layer has a portion forming a micro-machined metal mesh. When the portion of the first sacrificial layer in the area of the micro-machined metal mesh is removed, the micro-machined metal mesh is released and suspended above the first metal layer a height determined by the thickness of the first sacrificial layer. The structure may be varied by providing a base layer of sacrificial material between the surface of the substrate and the first metal layer. In that manner, a portion of the first metal layer may form a micro-machined mesh which is released when a portion of the base sacrificial layer in the area of the micro-machined mesh is removed. Additionally, a second layer of sacrificial material and a third metal layer may be provided. A micro-machined mesh may be formed in a portion of the third metal layer. The structure of the present invention may be used to construct variable capacitors, switches and, when certain of the meshes are sealed, microspeakers and microphones.
摘要翻译：本发明涉及由使用标准CMOS处理技术构建的金属和牺牲材料的交替层的结构，用于构建这种结构的工艺，用于从这种结构制造器件的工艺以及由这样的器件制造的器件结构体。在一个实施例中，第一金属层由衬底承载。第一牺牲层由第一金属层承载。第二金属层由牺牲层承载。第二金属层具有形成微加工金属网的部分。当去除微加工金属网的区域中的第一牺牲层的部分时，微加工金属网被释放并悬浮在第一金属层上方的高度由第一牺牲层的厚度确定。可以通过在衬底的表面和第一金属层之间提供牺牲材料的基底层来改变结构。以这种方式，第一金属层的一部分可以形成微机加工的网，其在微加工网的区域中的部分基底牺牲层被去除时释放。另外，可以提供第二层牺牲材料和第三金属层。微加工网可以形成在第三金属层的一部分中。本发明的结构可用于构造可变电容器，开关，并且当确定的网孔被密封时，微型扬声器和麦克风。

7. 发明授权

US4754185A Micro-electrostatic motor 失效
标题翻译：微静电马达
公开(公告)号：US4754185A
公开(公告)日：1988-06-28
申请号：US919789
申请日：1986-10-16
申请人： Kaigham J. Gabriel , Robert K. Prud'Homme , William S. N. Trimmer
发明人： Kaigham J. Gabriel , Robert K. Prud'Homme , William S. N. Trimmer
IPC分类号： H02N11/00 , H02N1/00 , H02N7/00
CPC分类号： H02N1/004
摘要： Miniaturized linear and rotary electrostatic motors. The motors are fabricated by disposing a plurality of conductive lands onto insulating substrates and then filling in the spaces between the lands by deposition of an insulating material. A final layer of insulating material is then disposed over each of the entire surfaces containing the lands to form smooth bearing surfaces. The bearing surfaces of two of these elements are placed in contact. In one embodiment, the natural lubrication of the bearing surfaces aids movement. In another embodiment, a special lubricating film is placed between the substrates. Arrangements are made for maintaining alignment of the contacting elements. The lands are selectively energized in a manner to effect movement of one element with respect to the other.

8. 发明授权

US4700541A Shape memory alloy actuator 失效
标题翻译：形状记忆合金执行器
公开(公告)号：US4700541A
公开(公告)日：1987-10-20
申请号：US919788
申请日：1986-10-16
申请人： Kaigham J. Gabriel , William S. N. Trimmer , James A. Walker
发明人： Kaigham J. Gabriel , William S. N. Trimmer , James A. Walker
IPC分类号： G05D3/00 , B25J9/10 , F03G7/06
CPC分类号： B25J9/1085 , F03G7/065 , H01H2061/0122
摘要： An electrically controlled shape memory alloy actuator capable of being miniaturized for use in robotics and other fields. The actuator is made of a shape memory alloy wire which is torsioned end along its longitudinal axis and with its ends constrained against movement. A lever or other suitable element is attached to the wire at a desired point other than at a wire end. A plurality of electrical connections spaced along the wire define a plurality of different sections of the wire. The wire and attached control element is made to rotate by selectively applying voltages to the different sections of the wire to heat the individual sections.
摘要翻译：一种电控形状记忆合金致动器，其能够小型化以用于机器人等领域。致动器由形状记忆合金线制成，其形状记忆合金线沿着其纵向轴线扭转端并且其端部受到阻止运动。杠杆或其他合适的元件在除了末端之外的期望点附接到线。沿着线间隔开的多个电连接限定了线的多个不同部分。通过选择性地向线的不同部分施加电压以加热各个部分，使线和附接的控制元件旋转。

9. 发明授权

US08203190B2 MEMS device including a chip carrier 有权
标题翻译： MEMS器件包括芯片载体
公开(公告)号：US08203190B2
公开(公告)日：2012-06-19
申请号：US12825131
申请日：2010-06-28
申请人： Jason P. Goodelle , Kaigham J. Gabriel
发明人： Jason P. Goodelle , Kaigham J. Gabriel
IPC分类号： H01L23/06 , H01L29/84
CPC分类号： B81C1/00333 , B81B2201/0257 , B81B2207/096 , B81C2203/0109 , H01L2224/48091 , H01L2924/10253 , H01L2924/1461 , H04R1/04 , H04R19/016 , H04R31/006 , H01L2924/00014 , H01L2924/00
摘要： A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded to the chip carrier and encapsulating the MEMS die.
摘要翻译： MEMS器件包括具有从芯片载体的第一表面延伸到第二表面的声学端口的芯片载体，设置在芯片载体上以覆盖芯片载体的第一表面处的声学端口的MEMS管芯，以及壳体结合到芯片载体并封装MEMS管芯。

10. 发明申请

US20070278601A1 MEMS device and method of fabricating the same 有权
标题翻译： MEMS器件及其制造方法
公开(公告)号：US20070278601A1
公开(公告)日：2007-12-06
申请号：US11446398
申请日：2006-06-05
申请人： Jason P. Goodelle , Kaigham J. Gabriel
发明人： Jason P. Goodelle , Kaigham J. Gabriel
IPC分类号： H01L29/84
CPC分类号： B81C1/00333 , B81B2201/0257 , B81B2207/096 , B81C2203/0109 , H01L2224/48091 , H01L2924/10253 , H01L2924/1461 , H04R1/04 , H04R19/016 , H04R31/006 , H01L2924/00014 , H01L2924/00
摘要： A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded to the chip carrier and encapsulating the MEMS die.
摘要翻译： MEMS器件包括具有从芯片载体的第一表面延伸到第二表面的声学端口的芯片载体，设置在芯片载体上以覆盖芯片载体的第一表面处的声学端口的MEMS管芯，以及壳体结合到芯片载体并封装MEMS管芯。

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