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1. 发明申请

WO2005084328A2 BURN-IN TESTING APPARATUS AND METHOD 审中-公开
标题翻译：燃烧测试装置和方法
公开(公告)号：WO2005084328A2
公开(公告)日：2005-09-15
申请号：PCT/US2005/006724
申请日：2005-02-28
申请人： WELLS-CTI, LLC , LOPEZ, Christopher, A. , DENHEYER, Brian, J. , KUENSTER, Gordon, B.
发明人： LOPEZ, Christopher, A. , DENHEYER, Brian, J. , KUENSTER, Gordon, B.
IPC分类号： G01K1/02 , G01K1/16 , G01R1/04 , G01R31/02
CPC分类号： G01R1/0458 , G01K1/16
摘要： An integrated circuit (IC) package testing apparatus integrates a temperature sensor (48), heater (or cooler) (44), and controller (42) within a single modular unit (22, 72). The controller (42) is a microprocessor embedded within the modular unit (22, 72) and in communication with the sensor (48) and heater (44). The controller (42) allows a selected testing temperature to be input by a user via a communications link (71) to the controller (42). Each IC package (54) has its testing temperature individually controlled by a controller (42). The module (22) is easily attached and removed from an open-top socket (20) through the use of latches (26) on the testing socket. Many IC packages (54) can be quickly placed and removed from testing sockets (20) when a matrix of sensors (48), heaters (or coolers) (44) and controllers (42) are located on a single top attach plate (72) with the sensors (48) and heaters (or coolers) (44) individually spring-loaded on the top attach plate (72). A temperature sensor (48) includes a sensor (130) positioned within a conductive housing (134) and an insulating material (138) surrounding the housing (134).
摘要翻译：集成电路（IC）封装测试装置将温度传感器（48），加热器（或冷却器）（44）和控制器（42）集成在单个模块单元（22,72）内。控制器（42）是嵌入模块化单元（22,72）内并与传感器（48）和加热器（44）连通的微处理器。控制器（42）允许用户通过控制器（42）的通信链路（71）输入所选择的测试温度。每个IC封装（54）的测试温度由控制器（42）分别控制。模块（22）通过使用测试插座上的闩锁（26）容易地从敞开式插座（20）上拆下。当传感器（48），加热器（或冷却器）（44）和控制器（42）的矩阵位于单个顶部附接板（72）上时，可以将许多IC封装（54）快速放置并从测试插座（20）中移除）与传感器（48）和加热器（或冷却器）（44）分别弹簧加载在顶部附接板（72）上。温度传感器（48）包括定位在导电壳体（134）内的传感器（130）和围绕壳体（134）的绝缘材料（138）。

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