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1. 发明专利

CA1231464A METHOD AND APPARATUS OF FORMING THICK FILM CIRCUITS 未知
公开(公告)号：CA1231464A
公开(公告)日：1988-01-12
申请号：CA461027
申请日：1984-08-15
申请人： MAEDA YUKIO , KUDO SHINICHI
发明人： MAEDA YUKIO , KUDO SHINICHI
IPC分类号： H05K3/10 , H01L21/70 , H05K3/12 , H01L49/02
摘要： Disclosed is a method and apparatus for forming patterns in a thick film circuit or the like to be used when forming elements such as conductors and resistors on a thick film circuit board. The pattern forming apparatus comprises a writing head for storing paste to form patterns, and the writing head lowers and approaches an arbitrary point in close proximity to the board of a thick film circuit and, while in the same state, moves laterally to another arbitrary point along the surface of the board, and then ascends to be separated from the board. The paste in the writing head is pressurized to be forced out of the head before the writing head begins to move laterally such that the paste is immediately applied on the board when the writing head begins to move laterally. This pressurization of the paste is stopped before the writing head finishes its lateral movement, so that the extrusion of the paste may be stopped the moment the writing head finishes the lateral movement. As a result, blurring or blotting at the beginning and ending part of the pattern writing may be prevented, so that patterns may be formed at high speed and with high precision.

2. 发明申请

WO1996035755A1 CURABLE RESIN COMPOSITION 审中-公开
标题翻译：可固化树脂组合物
公开(公告)号：WO1996035755A1
公开(公告)日：1996-11-14
申请号：PCT/JP1996001212
申请日：1996-05-08
申请人： DAINIPPON INK AND CHEMICALS, INC. , KOMAZAKI, Shigeru , KUDO, Shinichi , OOKA, Masataka
发明人： DAINIPPON INK AND CHEMICALS, INC.
IPC分类号： C08L83/10
CPC分类号： C09D183/10 , C08G18/12 , C08G18/8074 , C08G18/8158 , C08G77/42 , C08G77/442 , C09D175/04 , C08G18/289 , C08G18/62
摘要： A curable resin composition useful for automobile top coating, architectural exterior wall coating, heat resistant coating, adhesive, ink, impregnant for fabrics and papers, surface treatment and so on. This composition comprises a resin prepared by condensing a polymer having both hydrolyzable silyl groups and specific functional groups other than hydrolyzable silyl groups with a specific polysiloxane, and a compound reactive with the functional groups of the resin. The composition can give cured coating films particularly excellent in endurance (such as retention of gloss and water repellency under weathering), acid resistance and mar resistance.
摘要翻译：用于汽车顶涂，建筑外墙涂料，耐热涂料，粘合剂，油墨，织物和纸浸渍剂，表面处理等的可固化树脂组合物。该组合物包括通过将具有可水解甲硅烷基的聚合物和除水解性甲硅烷基以外的特定官能团与具有特定聚硅氧烷的聚合物和与该树脂的官能团反应的化合物缩合制备的树脂。该组合物可以得到特别优异的耐久性（如耐候性下保持光泽和防水性），耐酸性和耐擦伤性的固化涂膜。

3. 发明申请

WO1985005005A1 METHOD AND APPARATUS FOR DRAWING THICK-FILM CIRCUITS 审中-公开
标题翻译：用于绘制薄膜电路的方法和装置
公开(公告)号：WO1985005005A1
公开(公告)日：1985-11-07
申请号：PCT/JP1985000199
申请日：1985-04-15
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. , MAEDA, Yukio , KUDO, Shinichi , SAEKI, Keiji
发明人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
IPC分类号： H05K03/12
CPC分类号： H05K3/1241 , H05K2203/0126
摘要： A method of and apparatus for drawing a thick-film circuit on a substrate (2) by bringing a drawing nozzle (1), which has a paste-discharging port at the free end thereof, near the substrate (2) on which a thick-film circuit is to be drawn, and discharging paste from the discharge port onto the substrate (2) while moving the nozzle (1) relatively thereto. If the discharge rate of the paste is controlled in accordance with the relative speed of linear motion of the drawing nozzle (1) to the substrate (2), fluctuations of the thickness and width of the film which occur due to variations in this speed can be prevented, so that a highly accurate thick-film circuit can be formed rapidly.

4. 发明申请

WO1990006041A1 METHOD OF AND APPARATUS FOR DRAWING THICK-FILM 审中-公开
标题翻译：用于绘制薄膜的方法和装置
公开(公告)号：WO1990006041A1
公开(公告)日：1990-05-31
申请号：PCT/JP1985000198
申请日：1985-04-15
申请人： SAEKI, Keiji , KUDO, Shinichi , NAKATSUJI, Hachiro
IPC分类号： H05K03/12
CPC分类号： H05K3/1241 , H01L21/705 , H05K2203/0126
摘要： A method of and an apparatus for drawing a thick-film circuit on a substrate (2) by discharging paste from a nozzle (1), which has a discharge port, onto the substrate (2). Every time a predetermined length of drawing interruption time has elapsed, the paste is discharged from the tank (6) to make waste drawing on a waste drawing element (11). Thus, the clogging of the discharge port of the tank (6) with the paste is prevented, and the operation efficiency and productivity can thereby be improved.

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