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    • 2. 发明申请
    • LOW-PROFILE MEMS THERMAL PRINTHEAD DIE HAVING BACKSIDE ELECTRICAL CONNECTIONS
    • 低配置型微电子热敏打印机具有背面电气连接
    • WO2012106661A2
    • 2012-08-09
    • PCT/US2012/023862
    • 2012-02-03
    • KATEEVA, INC.GOLDA, DariuszKIM, Hyeun-SuGASSEND, Valerie
    • GOLDA, DariuszKIM, Hyeun-SuGASSEND, Valerie
    • B41J2/32H01L51/56
    • B41J2/3359B41J2/335B81C1/00309H01L2924/0002H01L2924/00
    • A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.
    • 热打印头芯片由作为MEMS器件的SOI结构形成。 模具具有印刷表面,掩埋氧化物层和与印刷表面相对的安装表面。 在打印表面上形成多个墨水输送部位,每个部位都具有墨水接收和墨水分配结构。 在每个结构附近形成欧姆加热器,并且在安装表面上形成凸块下金属化(UBM)焊盘,并与欧姆加热器电连接,使得由油墨传送部位接收的电和由 欧姆加热器可以通过升华被输送到基板。 可以通过芯片的厚度形成贯通硅通孔(TSV)插头,并通过掩埋氧化层从欧姆加热器电耦合到UBM焊盘。 互连金属层可以将欧姆加热器连接到UBM焊盘和TSV插头。
    • 5. 发明申请
    • LOW-PROFILE MEMS THERMAL PRINTHEAD DIE HAVING BACKSIDE ELECTRICAL CONNECTIONS
    • 低配置型微电子热敏打印机背面电气连接
    • WO2012106661A3
    • 2013-01-31
    • PCT/US2012023862
    • 2012-02-03
    • KATEEVA INCGOLDA DARIUSZKIM HYEUN-SUGASSEND VALERIE
    • GOLDA DARIUSZKIM HYEUN-SUGASSEND VALERIE
    • B41J2/32H01L51/56
    • B41J2/3359B41J2/335B81C1/00309H01L2924/0002H01L2924/00
    • A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.
    • 热打印头芯片由作为MEMS器件的SOI结构形成。 模具具有印刷表面,掩埋氧化物层和与印刷表面相对的安装表面。 在打印表面上形成多个墨水输送部位,每个部位都具有墨水接收和墨水分配结构。 在每个结构附近形成欧姆加热器,并且在安装表面上形成凸块下金属化(UBM)焊盘,并与欧姆加热器电连接,使得由油墨传送部位接收的电和由 欧姆加热器可以通过升华被输送到基板。 可以通过芯片的厚度形成贯通硅通孔(TSV)插头,并通过掩埋氧化层从欧姆加热器电耦合到UBM焊盘。 互连金属层可以将欧姆加热器连接到UBM焊盘和TSV插头。