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    • 3. 发明申请
    • PLASMA CHAMBER HAVING PLASMA SOURCE COIL AND METHOD FOR ETCHING THE WAFER USING THE SAME
    • 具有等离子体源线圈的等离子体室以及使用该方法蚀刻波形的方法
    • WO2006004259A1
    • 2006-01-12
    • PCT/KR2005/000860
    • 2005-03-24
    • ADAPTIVE PLASMA TECHNOLOGY CORPORATIONKIM, Nam-hun
    • KIM, Nam-hun
    • H01L21/3065
    • H01L21/31116H01J37/321
    • A plasma chamber having a plasma source coil includes a chamber body, a plasma source coil, and an edge bushing. The chamber body includes a reaction space, which is limited by a sidewall, a lower exterior wall, and an upper dome, and forms plasma. The plasma source coil arranged on the dome includes M unit coils corresponding to an integer greater than "2". The M unit coils having a predetermined turning number "n" indicative of a positive integer are extended from a center bushing having a predetermined radius at a center part, and are spirally arranged along a circumference of the center bushing, such that the plasma is formed in the reaction space. The edge bushing arranged between the dome of the chamber body and the plasma source coil, and is configured in the form of a cylindrical shape to overlap with an edge of the wafer arranged in the reaction space.
    • 具有等离子体源线圈的等离子体室包括室主体,等离子体源线圈和边缘衬套。 室主体包括由侧壁,下外壁和上圆顶限制的反应空间,并形成等离子体。 布置在圆顶上的等离子体源极线圈包括对应于大于“2”的整数的M个单元线圈。 具有指示正整数的预定转数“M”的M单元线圈从中心部分具有预定半径的中心衬套延伸,并且沿着中心衬套的圆周螺旋地布置,使得等离子体形成 在反应空间。 布置在室主体的圆顶和等离子体源极线圈之间并且被配置成与晶片的边缘重叠的圆柱形形状的边缘衬套布置在反应空间中。
    • 6. 发明申请
    • ADAPTIVELY PLASMA SOURCE AND METHOD OF PROCESSING SEMICONDUCTOR WAFER USING THE SAME
    • 适应性等离子体源及其使用半导体波长的方法
    • WO2006031010A1
    • 2006-03-23
    • PCT/KR2005/001585
    • 2005-05-27
    • ADAPTIVE PLASMA TECHNOLOGY CORPORATIONKIM, Nam-hun
    • KIM, Nam-hun
    • H01L21/3065
    • H01L21/3065H01J37/32009H01J37/32082H01L21/308H05H1/46
    • An adaptive plasma source, and a method for processing a semiconductor wafer using the same are disclosed. The adaptive plasma source comprises a first planar hushing equipped at an upper center of a reaction chamber defining a reaction space for processing a semiconductor wafer so as to face a planar electrode equipped at a lower portion of the reaction chamber, and a coil assembly spirally extending from the first bushing at an upper portion of the reaction chamber and surrounding the first bushing. The adaptive plasma source allows an etching process to be performed by freely controlling etching characteristics of a coupled plasma source and an inductively coupled plasma source according to a method for processing a semiconductor wafer which will be performed, thereby enabling the etching process having different conditions to be performed in a single apparatus.
    • 公开了一种自适应等离子体源以及使用其的半导体晶片的处理方法。 自适应等离子体源包括:在反应室的上部中心处配备的第一平面冲洗,其限定用于处理半导体晶片的反应空间,以面对设置在反应室的下部的平面电极;以及螺旋形延伸的线圈组件 从第一衬套在反应室的上部并围绕第一衬套。 自适应等离子体源允许通过根据用于处理将要执行的半导体晶片的方法的方法自由地控制耦合等离子体源和电感耦合等离子体源的蚀刻特性来执行蚀刻处理,由此使得具有不同条件的蚀刻工艺 在单个装置中执行。
    • 8. 发明申请
    • ADAPTIVELY PLASMA SOURCE FOR GENERATING UNIFORM PLASMA
    • 用于产生均匀等离子体的适应性等离子体源
    • WO2005025281A1
    • 2005-03-17
    • PCT/KR2004/002282
    • 2004-09-08
    • ADAPTIVE PLASMA TECHNOLOGY CORPORATIONKIM, Nam-Hun
    • KIM, Nam-Hun
    • H05H1/46
    • H01J37/321H05H1/46
    • There is provided an adaptive plasma source, which is arranged at an upper portion of a reaction chamber having a reaction space to form plasma and is supplied with RF (radio frequency) power from an external RF power source to form an electric field inside the reaction space. The adaptive plasma source includes a conductive bushing and at least two unit coils. The bushing is coupled to the RF power source and arranged at an upper central portion of the reaction chamber. The at least two unit coils are branched from the bushing and surround the bushing in a spiral shape and have the number of turns equal to a x (b/m), where a and b are positive integers and m is the number of the unit coils.
    • 提供了一种自适应等离子体源,其被布置在具有反应空间的反应室的上部以形成等离子体,并且从外部RF电源提供RF(射频)功率以在反应中形成电场 空间。 自适应等离子体源包括导电衬套和至少两个单元线圈。 衬套连接到RF电源并且布置在反应室的上部中心部分。 至少两个单元线圈从衬套分支并围绕套管以螺旋形状并且具有等于ax(b / m)的匝数,其中a和b是正整数,m是单位线圈的数量 。