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1. 发明申请

WO2018053750A1 INTEGRATED CIRCUIT PACKAGE WITH GLASS SPACER 审中-公开
标题翻译：带玻璃间隔件的集成电路封装
公开(公告)号：WO2018053750A1
公开(公告)日：2018-03-29
申请号：PCT/CN2016/099714
申请日：2016-09-22
申请人： INTEL CORPORATION , GUO, Mao , KIM, Hyoung Il , SHE, Yong , GOGINENI, Sireesha
发明人： GUO, Mao , KIM, Hyoung Il , SHE, Yong , GOGINENI, Sireesha
IPC分类号： H01L23/28
摘要： Apparatuses, systems and methods associated with integrated circuit (IC) package design are disclosed herein. In embodiments, an IC package may include a first die and a second die. The IC package may include a spacer located between the first die and the second die, the spacer includes glass, and a molding compound that at least partially encompasses the first die, the second die, and the spacer. Other embodiments may be described and/or claimed.
摘要翻译：本文公开了与集成电路（IC）封装设计相关联的设备，系统和方法。在实施例中，IC封装可以包括第一管芯和第二管芯。 IC封装可以包括位于第一管芯和第二管芯之间的间隔物，间隔物包括玻璃以及至少部分地包围第一管芯，第二管芯和间隔物的模塑料。其他实施例可以被描述和/或要求保护。

2. 发明申请

WO2019132933A1 MULTI-DIE, VERTICAL-WIRE PACKAGE-IN-PACKAGE APPARATUS, AND METHODS OF MAKING SAME 审中-公开
公开(公告)号：WO2019132933A1
公开(公告)日：2019-07-04
申请号：PCT/US2017/068780
申请日：2017-12-28
申请人： INTEL CORPORATION , KIM, Hyoung IL , PON, Florence R. , XU, Yi Elyn
发明人： KIM, Hyoung IL , PON, Florence R. , XU, Yi Elyn
IPC分类号： H01L25/07 , H01L23/00 , H01L27/11524 , H01L23/495
摘要： A vertical-wire package-in-package includes at least two memory-die stacks that form respective memory modules that are stacked vertically on a bond-wire board. Each memory die in the memory-die stack includes a vertical bond wire that emerges from a matrix for connection. The matrix encloses the memory-die stack, the spacer, and a redistribution layer. At least two memory modules are assembled in a vertical-wire package-in-package.

3. 发明申请

WO2018063188A1 COMPACT WIREBONDING IN STACKED-CHIP SYSTEM IN PACKAGE, AND METHODS OF MAKING SAME 审中-公开
标题翻译：包装中的堆叠芯片系统中的紧凑型WIREBONDING及其制造方法
公开(公告)号：WO2018063188A1
公开(公告)日：2018-04-05
申请号：PCT/US2016/054144
申请日：2016-09-28
申请人： INTEL CORPORATION , SHOJAIE, Saeed , KIM, Hyoung IL Andrew , KHALAF, Bilal , LAI, Min-Tih Ted
发明人： SHOJAIE, Saeed , KIM, Hyoung IL Andrew , KHALAF, Bilal , LAI, Min-Tih Ted
IPC分类号： H01L23/00 , H01L25/065 , H01L23/495
摘要： A bond-wire system including a wire bond that is deflected above a dielectric ridge at a die edge. The deflected wire bond allows for both a lowered Z-profile and a reduced X-Y footprint. The bond-wire system may include a stacked-die configuration where a stacked die is wire bonded and the stacked-die bond wire is deflected above a dielectric ridge at the stacked die edge.
摘要翻译：包括在芯片边缘处在电介质脊上方偏转的引线键合的键合线系统。偏转的引线键合允许降低Z形轮廓和减小X-Y足迹。该键合线系统可以包括堆叠裸片配置，其中堆叠裸片被引线键合并且堆叠裸片键合引线在堆叠裸片边缘处的电介质脊上方偏转。

4. 发明申请

WO2011025253A3 BLUETOOTH COMMUNICATION METHOD AND TERMINAL ADOPTING SAME 审中-公开
标题翻译：蓝牙通信方法和终端采用
公开(公告)号：WO2011025253A3
公开(公告)日：2011-07-14
申请号：PCT/KR2010005688
申请日：2010-08-25
申请人： SAMSUNG ELECTRONICS CO LTD , KIM BO-MIN , PARK MIN-KYU , PARK YONG-GOOK , KANG TAE-YOUNG , KIM SEONG-WOON , KIM HYOUNG-IL
发明人： KIM BO-MIN , PARK MIN-KYU , PARK YONG-GOOK , KANG TAE-YOUNG , KIM SEONG-WOON , KIM HYOUNG-IL
IPC分类号： H04B7/24 , H04W88/02
CPC分类号： H04W8/005 , G06F1/1694 , G06F3/017 , H04M1/7253 , H04M2250/02 , H04M2250/64 , H04W84/18
摘要： Provided are a Bluetooth communication method and a terminal adopting same. According to the Bluetooth communication method of the present invention, a terminal transmits data to an external terminal by means of Bluetooth communication when a motion is detected in a Bluetooth stand-by mode. Consequently, data transmission/reception between two terminals is more easily performed by enabling a user to input a motion into a terminal.
摘要翻译：提供了蓝牙通信方法和采用它的终端。根据本发明的蓝牙通信方法，当以蓝牙待机模式检测到运动时，终端通过蓝牙通信将数据发送到外部终端。因此，通过使用户能够将运动输入到终端中，可以更容易地实现两个终端之间的数据发送/接收。

5. 发明授权

KR102191328B1 AI를 이용한 다축 로봇형 자동 분체시스템 有权
公开(公告)号：KR102191328B1
公开(公告)日：2020-12-15
申请号：KR20200029555
申请日：2020-03-10
申请人： KIM HYOUNG IL
发明人： KIM HYOUNG IL
IPC分类号： B05B13/04 , B05B7/14 , B05B13/02 , B05B15/70 , B25J5/04 , B25J9/10 , B25J9/12 , B25J11/00 , B25J15/00
摘要： 게시된내용은체인컨베이어를따라부스내에직선이동되는행거에안착된피도장체에도장간격을유지하여이동되는스프레이건모듈에의해분체도장하기위한, AI를이용한다축로봇형자동분체시스템에관한것으로, 본명세서의일 실시예에따른 AI를이용한다축로봇형자동분체시스템은부스내에형성되고, 체인컨베이어에고정되어상기부스내에직선이동되는행거에안착된피도장체를다축구동되어이동되는스프레이건모듈에의해도장하기위한, AI를이용한다축로봇형자동분체시스템에적용되고, 상기피도장체이동방향과동일방향으로가이드레일이전후측에대향되게형성되는본체; 상기본체일측에장착되는제1,2구동부에의해상기가이드레일을따라좌우방향으로슬라이딩이동되는제1,2슬라이더유닛; 상기제1,2슬라이더유닛에장착되는제3,4구동부에의해상기제1,2슬라이더유닛을따라전후방향으로슬라이딩이동되는제3,4슬라이더유닛; 상기제3,4슬라이더유닛에장착되는제5,6구동부에의해상기제3,4슬라이더유닛을따라상하방향으로슬라이딩이동되고, 선단에다관절형태의병렬형제1,2스프레이건모듈이회동가능하게장착되는제5,6슬라이더유닛; 상기체인컨베이어를따라임의속도로직선이동되는상기피도장체에대해임의의도장간격을유지하여상기제1스프레이건모듈을좌우, 전후및 상하방향으로이동시켜상기피도장체의외측면및 평면을분체도장하되, 상기체인컨베이어를따라임의속도로계속직선이동되는상기피도장체에대해상기제2스프레이건모듈을임의의도장간격을유지하여좌우, 전후및 상하방향으로이동시켜상기피도장체의외측면및 평면을재 분체도장하기위한제어부;를구비하는것을특징으로하는 AI를이용한다축로봇형자동분체시스템을제공한다.

6. 发明申请

WO2010128796A3 DEVICE AND METHOD FOR AUTOMATIC CALL SENDING AND RECEIVING DEPENDENT ON POSTURE OF MOBILE PHONE USER 审中-公开
标题翻译：用于自动呼叫发送和接收移动电话用户的手段的设备和方法
公开(公告)号：WO2010128796A3
公开(公告)日：2011-02-17
申请号：PCT/KR2010002848
申请日：2010-05-04
申请人： SAMSUNG ELECTRONICS CO LTD , KIM HYOUNG-IL , PARK TAE-JUN
发明人： KIM HYOUNG-IL , PARK TAE-JUN
IPC分类号： H04B1/40 , G06F3/01 , H04W76/02
CPC分类号： H04M1/72563 , G06F1/1694 , H04M1/72519 , H04M2250/12 , H04W68/00
摘要： The present invention relates to a call receiving method which recognizes the posture of the mobile phone user, comprising the steps of: detecting the call receiving signal; detecting the movement of the mobile phone towards the user's ear using a posture detecting sensor when said call receiving signal is detected; and connecting the call when detecting said movement.
摘要翻译：本发明涉及一种识别移动电话用户的姿势的呼叫接收方法，包括以下步骤：检测呼叫接收信号; 当检测到所述呼叫接收信号时，使用姿态检测传感器检测移动电话向用户耳朵的移动; 并且当检测到所述移动时连接呼叫。

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