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    • 1. 发明申请
    • WOOD TREATMENT COMPOSITION AND METHOD OF USE
    • 木材处理组合物及其使用方法
    • WO2003013806A1
    • 2003-02-20
    • PCT/US2002/025132
    • 2002-08-08
    • DOW GLOBAL TECHNOLOGIES INC.HERBERT, Kenneth, H.KELLEY, David, C.MONCLA, Brad, M.WILLIAMSON, Michelle
    • HERBERT, Kenneth, H.KELLEY, David, C.MONCLA, Brad, M.WILLIAMSON, Michelle
    • B27K3/34
    • B27K3/46B27K3/15B27K3/50C08L33/08C08L97/02Y10T428/31989
    • A wood treatment composition for the preservation of wood comprises a mixture of creosote and a polymer which is miscible with the creosote at about 200°F. and does not substantially phase-separate when the wood treatment composition is under ambient conditions. The polymer may include, but is not limited to, ethylene vinyl acetate copolymers, ethylene methyl acrylate copolymers, ethylene ethyl acrylate copolymers, ethylene butyl acrylate copolymers, ethylene acrylic acid copolymers, ethylene methacrylic acid copolymers, ethylene methyl methacrylic acid copolymers, ethylene styrene interpolymers, styrene acrylic acid copolymers, styrene methacrylic acid copolymers, styrene methyl acrylate copolymers, styrene butadiene styrene block copolymers, styrene ethylene butylene styrene block copolymers, or a blend thereof. Preferably, the creosote is present in an amount of at least 50 percent by weight of the composition. Such compositions can be used to treat wood surfaces to prolong the service life of the wood.
    • 用于保存木材的木材处理组合物包括杂酚油和聚合物的混合物,其在约200°F下可与杂酚油混溶,并且当木材处理组合物在环境条件下时基本上不会相分离。 聚合物可以包括但不限于乙烯乙酸乙烯酯共聚物,乙烯丙烯酸甲酯共​​聚物,乙烯丙烯酸乙酯共聚物,乙烯丙烯酸丁酯共聚物,乙烯丙烯酸共聚物,乙烯甲基丙烯酸共聚物,乙烯甲基丙烯酸共聚物,乙烯苯乙烯共聚物 ,苯乙烯丙烯酸共聚物,苯乙烯甲基丙烯酸共聚物,苯乙烯丙烯酸甲酯共​​聚物,苯乙烯丁二烯苯乙烯嵌段共聚物,苯乙烯乙烯丁烯苯乙烯嵌段共聚物或其共混物。 优选地,杂酚油以组合物的至少50重量%的量存在。 这些组合物可用于处理木材表面以延长木材的使用寿命。
    • 6. 发明申请
    • DIELECTRIC HEATING OF THERMOPLASTIC COMPOSITIONS
    • 热塑性组合物的介电加热
    • WO2002088229A1
    • 2002-11-07
    • PCT/US2002/012021
    • 2002-04-17
    • DOW GLOBAL TECHNOLOGIES, INC.BEULICH, InkenKELLEY, David, C.BUTLER, Thomas, I.
    • BEULICH, InkenKELLEY, David, C.BUTLER, Thomas, I.
    • C08J5/00
    • C08K3/34C08L23/02C08L23/06C08L23/08C08L23/0838C08L23/0853C08L23/10C08L23/12C08L2666/04
    • A HF responsive composition is described comprising (A) a molecular sieve material, and (B) at least one interpolymer comprising (i) polymer units derived from at least one aliphatic olefin monomer having from 2 to 20 carbon atoms; and (ii) polymer units derived from (a) at least one vinyl or vinylidene aromatic monomer, or (b) from at least one sterically hindered aliphatic or cycloaliphatic vinyl or vinylidene monomer, or (c) from a combination of at least one vinyl or vinylidene aromatic monomer and at least one sterically hindered aliphatic or cycloaliphatic vinyl or vinylidene monomer, and optionally (d) polymer units derived from at least one ethylenically unsatured polymerizable monomer other than that derived from (a), (b) or (c). The HF responsive composition of the invention can be heated in a dielectric heating process and is useful, for example, to make articles of manufacture which are formed or assembled using HF welding technology.
    • 描述了HF响应组合物,其包含(A)分子筛材料和(B)至少一种共聚体,其包含(i)衍生自至少一种具有2至20个碳原子的脂族烯烃单体的聚合物单元; 和(ii)衍生自(a)至少一种乙烯基或亚乙烯基芳族单体或(b)至少一种空间位阻脂族或脂环族乙烯基或亚乙烯基单体的聚合物单元,或(c)至少一种乙烯基或亚乙烯基芳族单体的组合 或亚乙烯基芳族单体和至少一种空间位阻脂族或脂环族乙烯基或亚乙烯基单体,以及任选地(d)衍生自除(a),(b)或(c)所衍生的至少一种烯键式不可聚合单体的聚合物单元, 。 本发明的HF响应性组合物可以在电介质加热过程中加热,并且可用于例如制造使用HF焊接技术形成或组装的制品。