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1. 发明申请

WO1992016017A1 CLEANING LIQUID FOR SEMICONDUCTOR SUBSTRATE 审中-公开
标题翻译：用于半导体衬底的清洁液
公开(公告)号：WO1992016017A1
公开(公告)日：1992-09-17
申请号：PCT/JP1992000219
申请日：1992-02-28
申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC. , SUGIHARA, Yasuo , TANAKA, Kazushige , KAWAKAMI, Michiya
发明人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
IPC分类号： H01L21/304
CPC分类号： H01L21/02052 , C01B15/037
摘要： Metallic impurities are prevented from adhering to the surface of a semiconductor substrate when the substrate is cleaned with a basic aqueous solution of hydrogen peroxide. The cleaning liquid contains a chelating agent having at least two phosponic acid groups. Even when the cleaning liquid is contaminated by the metallic impurities, since they are prevented from adhering to the surface of the substrate, the characteristic of the semiconductor device made of the substrate is stabilized.

2. 发明申请

WO1991011021A1 HIGH-TEMPERATURE HIGH-PRESSURE WASHING METHOD AND WASHING APPARATUS 审中-公开
标题翻译：高温高压洗涤方法和洗衣设备
公开(公告)号：WO1991011021A1
公开(公告)日：1991-07-25
申请号：PCT/JP1991000002
申请日：1991-01-07
申请人： OHMI, Tadahiro , KAWAKAMI, Michiya , YAGI, Yasuyuki , OHWADA, Tohru , TAKAHARA, Yasushi
IPC分类号： H01L21/304
CPC分类号： H01L21/02052 , B08B3/02 , H01L21/6704 , H01L21/67051 , H01L21/6715 , Y10S134/902 , Y10S239/19
摘要： A method and an apparatus for high-temperature high-pressure washing employed in the step of washing in the electronic industries such as chiefly semi-conductor industries and in the industries of optical devices. The high-temperature high-pressure washing apparatus has a compression-feed pump, a heating device, nozzles and piping, to spout high-temperature high-pressure water from nozzles onto materials to be washed. The apparatus has the function of spouting very pure water having high temperature and high pressure from the nozzle, onto the materials to be washed. The very pure water used has a resistivity greater than 17.0 MΦ.cm at 25 °C.

3. 发明申请

WO1990000155A1 ULTRA-PURE WATER SUPPLY PIPING ARRANGEMENT APPARATUS 审中-公开
标题翻译：超纯水管道布置装置
公开(公告)号：WO1990000155A1
公开(公告)日：1990-01-11
申请号：PCT/JP1989000648
申请日：1989-06-29
申请人： OHMI, Tadahiro , KAWAKAMI, Michiya , SHIBATA, Tadashi , UMEDA, Masaru
IPC分类号： C02F01/00
CPC分类号： B01D61/22 , C02F1/006 , C02F1/32 , C02F1/444 , Y10S210/90
摘要： In a ultra-pure water supply piping arrangement apparatus including a circulation water tank (502) for storing primary pure water from a primary pure water production apparatus, a pump (503) for pressure-feeding the primary pure water from the circulation water tank, a return pipe (510) one of the ends of which is connected to a final purifier for purifying the primary pure water from the pump to ultra-pure water, a plurality of connection pipes (513 ∩ 515) to one end of which the other end of the return pipe is connected, branch pipes (516 ∩ 518) connected between the intermediate portions of the connection pipes and a ultra-pure water using apparatus and having branch valves (516 ∩ 518) for adjusting the feed water quantity and a return pipe (512) connected to the other end of each connection pipe and the circulation water tank, the present invention provides a piping arrangement apparatus which includes means for controlling the output of the pump by detecting the pressure of water passing through the return pipe so as to keep the pressure of passing water constant and supply always a predetermined quantity of ultra-pure water to the ultra-pure water using apparatus, which can prevent backflow from the return pipe to the ultra-pure water using apparatus and which can always supply stably the ultra-pure water having ultra-high purity.

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