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    • 1. 发明申请
    • NANO EMISSION DEVICES, INTEGRATED CIRCUITS USING NANO EMISSION DEVICES, AND RELATED METHODS
    • 纳米发射装置,使用纳米发射装置的集成电路及相关方法
    • WO2008051300A3
    • 2008-10-02
    • PCT/US2007009829
    • 2007-04-19
    • KANZEN INCSUMMERS DAVIDBROWN PHIL
    • SUMMERS DAVIDBROWN PHIL
    • H01J1/30
    • H01J21/10B82Y20/00H01L27/0688H01L27/10H01L27/105H01L27/12H01L27/1214
    • Embodiments of the present invention are generally directed towards nano emission devices. Nano emission devices can include, for example, diodes (1200), N-type transistors (100, 200, 250, 500, 600, 900), P-type transistors (250, 300, 500, 600, 800, 900, 1500), and combined N- and P- type nano emission transistors (400). Nano emission devices can include multiple emitters, collectors, gates and the like to form more complex nano emission devices (1600, 1900, 2200). Nano emission devices may be connected together to form various circuits, including for example, logic gates (1402, 1404, 1408), memory cells (1406), amplifiers, and the like. Nano emission devices may be fabricated in two- and three-dimensional integrated circuits (1700, 2300, 2400). Methods of fabricating (700, 750, 1100, 2500, 2600) nano emission devices and electronic circuits are also described.
    • 本发明的实施例一般涉及纳米发射装置。 纳米发射器件可以包括例如二极管(1200),N型晶体管(100,200,250,500,600,900),P型晶体管(250,300,500,600,800,900,1500 )和组合的N-和P-型纳米发射晶体管(400)。 纳米发射装置可以包括多个发射器,收集器,门等,以形成更复杂的纳米发射装置(1600,1900,2200)。 纳米发射器件可以连接在一起以形成各种电路,包括例如逻辑门(1402,1404,1408),存储器单元(1406),放大器等。 纳米发射器件可以制造在二维和三维集成电路(1700,2300,400)中。 还描述了制造(700,750,1100,2500,2600)纳米发射器件和电子电路的方法。