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1. 发明申请

WO2006000621A1 ENHANCING STABILITY AND REDUCING TEMPERATURE FACTOR IN A MICROMECHANICAL DEVICE 审中-公开
标题翻译：增强稳定性和降低微生物装置中的温度因子
公开(公告)号：WO2006000621A1
公开(公告)日：2006-01-05
申请号：PCT/FI2005/000285
申请日：2005-06-16
申请人： VALTION TEKNILLINEN TUTKIMUSKESKUS , SEPPÄ, Heikki , KÄRKKÄINEN, Anu , OJA, Aarne
发明人： SEPPÄ, Heikki , KÄRKKÄINEN, Anu , OJA, Aarne
IPC分类号： B81B5/00
CPC分类号： G01P15/125 , G01P1/006 , G01P21/00
摘要： The publication discloses a method for improving stability in a micromechanical sensor, which comprises a part that is arranged to move and a fixed electrode, in such a way that a built-in voltage (U bi ) is associated with the sensor. The stability of the sensor is improved by connecting to the sensor a direct-current voltage (U dc ) that at least partly compensates for the built-in voltage (U bi ) The publication also describes a method for reducing temperature dependence in a micromechanical component, which has a temperature coefficient (β) deriving from the temperature fluctuation of its mechanical properties. In this case, a direct-current voltage (U dc ) is connected in series with the built-in voltage (U bi ) of the component and the magnitude of the direct-current voltage is selected in such a way that the effect of the temperature fluctuation of the built-in voltage (U bi ) at least partly compensates for the effect that the temperature fluctuation of the mechanical properties of the component have on the quantity given by the component.
摘要翻译：该出版物公开了一种用于提高微机械传感器的稳定性的方法，该微机械传感器包括被布置成移动的部分和固定电极，使得内置电压（U SUB）与其相关联与传感器。传感器的稳定性通过将传感器连接至至少部分地补偿内置电压（U SUB）的直流电压（U SUB）来提高，该出版物还描述了一种降低微机械部件中的温度依赖性的方法，其具有源自其机械性能的温度波动的温度系数（ß）。在这种情况下，直流电压（U SUB DC）与组件的内置电压（U SUB）成串联连接，直流电压以这样的方式选择电流电压，使得内置电压（U SUB）的温度波动的影响至少部分地补偿了这样的效果：组件具有由组件给出的数量。

2. 发明申请

WO2010112676A1 A CASING OF A SENSOR MEASURING OSCILLATIONS, AND A SENSOR FOR MEASURING OSCILLATIONS 审中-公开
标题翻译：传感器测量振荡的示意图和用于测量振荡的传感器
公开(公告)号：WO2010112676A1
公开(公告)日：2010-10-07
申请号：PCT/FI2010/050247
申请日：2010-03-29
申请人： VALTION TEKNILLINEN TUTKIMUSKESKUS , SILLANPÄÄ, Teuvo , KÄRKKÄINEN, Anu , PEKKO, Panu
发明人： SILLANPÄÄ, Teuvo , KÄRKKÄINEN, Anu , PEKKO, Panu
IPC分类号： B81C1/00 , B81B7/00 , H03H9/05 , H01L23/04 , H01L21/02 , B06B1/00
CPC分类号： G01H11/00 , B81B7/0064 , B81B2201/0285 , B81B2207/092 , B81B2207/095
摘要： Oscillations are measured by an electromechanical sensor having a first surface with a groove (502) therein to separate a kinetic mass part (503) and a frame part (504) from each other. A casing encloses a sensor chip (112) and a circuit element (113, 322) for detecting a phenomenon occurring as the kinetic mass part moves. The sensor chip (112) is attached to an inner surface (506, 706) of the casing at the frame part side of the groove. The first surface (501) of the sensor chip, the inner surface (506, 706) of the casing, and the attachment (507, 707) of the sensor chip define a closed space into which the groove (502) opens.
摘要翻译：振荡由具有第一表面的机电传感器测量，第一表面具有凹槽（502），以将动力学部件（503）和框架部分（504）彼此分离。壳体包围传感器芯片（112）和电路元件（113,322），用于检测动力部件移动时发生的现象。传感器芯片（112）在槽的框架部分侧附接到壳体的内表面（506,706）。传感器芯片的第一表面（501），壳体的内表面（506,706）和传感器芯片的附件（507,707）限定了凹槽（502）打开的封闭空间。

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