专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090224438A1 Rapid Prototyping Method and Radiation-Curable Composition for Use Therein 失效
标题翻译：快速成型方法和可用于其中的可辐射组合物
公开(公告)号：US20090224438A1
公开(公告)日：2009-09-10
申请号：US11922747
申请日：2006-06-29
申请人： Jurgen Stampfl , Heinrich Gruber , Helga Lichtenegger , Robert Liska , Robert Infuhr
发明人： Jurgen Stampfl , Heinrich Gruber , Helga Lichtenegger , Robert Liska , Robert Infuhr
IPC分类号： B29C35/08
CPC分类号： C08F2/48 , B29C33/3842 , B29C64/106 , B33Y10/00 , B33Y70/00 , B33Y80/00 , G03F7/0017 , G03F7/0037 , G03F7/027 , G03F7/0755 , G03F7/42 , G03F7/423 , G03F7/425 , G03F7/426
摘要： The invention relates to a method for producing three-dimensional objects, comprising producing a three-dimensional structure by sequential selective curing of layers of a composition curable with visible and/or ultraviolet light into a solid polymeric material by sequential exposure of the individual layers to UV and/or visible light, whereafter a three-dimensional object is produced by use of the three-dimensional structure thus formed, followed by removing the three-dimensional structure from or of the three-dimensional object, characterized in that removing the three-dimensional structure is accomplished by chemically cleaving the polymeric material as well as simultaneously or subsequently dissolving the material in a solvent or mixed solvent and/or melting the material.
摘要翻译：本发明涉及一种用于生产三维物体的方法，包括通过将可见光和/或紫外光固化的组合物的层顺序选择性固化成固体聚合物材料，通过将各层顺次曝光而制备三维结构 UV和/或可见光，然后通过使用如此形成的三维结构产生三维物体，随后从三维物体中去除三维结构，其特征在于，通过化学裂解聚合材料以及同时或随后将材料溶解在溶剂或混合溶剂中和/或熔化材料来实现三维结构。

2. 发明授权

US06242163B1 Shape deposition manufacturing of microscopic ceramic and metallic parts using silicon molds 失效
标题翻译：使用硅模具的微观陶瓷和金属部件的形状沉积制造
公开(公告)号：US06242163B1
公开(公告)日：2001-06-05
申请号：US09387328
申请日：1999-08-31
申请人： Jurgen Stampfl , Alexander Cooper , Rudolf Leitgeb , Yih-Lin Cheng , Friedrich Prinz
发明人： Jurgen Stampfl , Alexander Cooper , Rudolf Leitgeb , Yih-Lin Cheng , Friedrich Prinz
IPC分类号： C23F100
CPC分类号： C23F1/00 , B81C99/0085 , B81C2201/019 , B81C2201/034
摘要： Micro-Mold Shape Deposition Manufacturing (&mgr;-Mold SDM) is a method for fabricating complex, three-dimensional microstructures from layered silicon molds. Silicon wafers are etched using conventional silicon-processing techniques to produce wafers with surface patterns, some of which contain through-etched regions. The wafers are then stacked and bonded together to form a mold, which is filled with part material. In one embodiment, the part material is a ceramic or metallic gelcasting slurry that is poured into the mold and solidified to form a part precursor. The mold is removed, and the precursor is sintered to form the final part. The gelcasting material may also be a polymer or magnetic slurry, in which case sintering is not needed. The mold can also be filled by electroplating a metal into it; if necessary, each layer is filled with metal after being bonded to a previously filled layer. Patterned silicon wafer layers may also be combined with macroscopic wax layers formed by Mold SDM to create macroscopic parts with some microscopic parts or features.
摘要翻译：微模形状沉积制造（mu-Mold SDM）是从分层硅模制造复杂的三维微结构的方法。使用常规的硅处理技术来蚀刻硅晶片以产生具有表面图案的晶片，其中一些具有贯通蚀刻区域。然后将晶片堆叠并结合在一起以形成用部件材料填充的模具。在一个实施例中，部件材料是陶瓷或金属凝胶浇注浆料，其被倒入模具中并固化以形成部件前体。去除模具，并将前体烧结以形成最终部分。凝胶浇铸材料也可以是聚合物或磁性浆料，在这种情况下不需要烧结。模具也可以通过将金属电镀到其中来填充; 如果需要，每层在结合到预先填充的层之后都填充有金属。图案化的硅晶片层还可以与由模具SDM形成的宏观蜡层组合以产生具有一些微观部件或特征的宏观部件。

3. 发明申请

US20100029801A1 LIGHT-CURING SLIPS FOR THE STEREOLITHOGRAPHIC PREPARATION OF DENTAL CERAMICS 有权
标题翻译：牙科陶瓷的立体定向光固化滑块
公开(公告)号：US20100029801A1
公开(公告)日：2010-02-04
申请号：US12394452
申请日：2009-02-27
申请人： Norbert MOSZNER , Wolfgang WACHTER , Christoph APPERT , Volker M. RHEINBERGER , Robert LISKA , Jurgen STAMPFL , Johannes PATZER
发明人： Norbert MOSZNER , Wolfgang WACHTER , Christoph APPERT , Volker M. RHEINBERGER , Robert LISKA , Jurgen STAMPFL , Johannes PATZER
IPC分类号： C08F2/46
CPC分类号： A61L27/46 , A61C13/0013 , A61K6/0215 , A61K6/024 , A61K6/025 , A61K6/0273 , B33Y70/00 , B33Y80/00 , C04B35/111 , C04B35/486 , C04B35/6263 , C04B35/6264 , C04B35/632 , C04B35/63488 , C04B35/638 , C04B2235/3224 , C04B2235/3225 , C04B2235/3246 , C04B2235/3262 , C04B2235/3272 , C04B2235/3287 , C04B2235/441 , C04B2235/449 , C04B2235/6026 , C04B2235/6562 , C04B2235/77 , C04B2235/96 , C04B2235/9661 , G03F7/0037 , G03F7/0047 , G03F7/027
摘要： Slip based on a polyreactive binder, polymerization initiator and filler, which contains (A) 5-65 wt.-% polymerizable binder, (B) 0.001-1.0 wt.-% photoinitiator and (C) 35-90 wt.-% surface-modified ceramic and/or glass ceramic particles relative to the overall mass of the slip, and process for the preparation of ceramic mouldings by rapid prototyping processes using the slip.
摘要翻译：基于聚反应性粘合剂，聚合引发剂和填料，其含有（A）5-65重量％可聚合粘合剂，（B）0.001-1.0重量％光引发剂和（C）35-90重量％表面改性的陶瓷和/或玻璃陶瓷颗粒相对于滑移的总体质量，以及通过使用滑移的快速成型方法制备陶瓷模制品的方法。

4. 发明授权

US06531036B1 Fabrication of micron-sized parts from conductive materials by silicon electric-discharge machining 失效
标题翻译：通过硅放电加工从导电材料制造微米级零件
公开(公告)号：US06531036B1
公开(公告)日：2003-03-11
申请号：US09383113
申请日：1999-08-25
申请人： Rudolf Leitgeb , Jurgen Stampfl , Yih-Lin Cheng , Friedrich Prinz
发明人： Rudolf Leitgeb , Jurgen Stampfl , Yih-Lin Cheng , Friedrich Prinz
IPC分类号： H01L2100
CPC分类号： B23H1/04 , B23H9/00 , B81C99/0085 , H01F41/34
摘要： A method for fabricating sub-millimeter sized parts uses electrodes created from patterned silicon wafers for electric-discharge machining (EDM), in which an electric discharge is generated between a patterned electrode and a conductive workpiece. Workpiece material corresponding to the electrode pattern is removed by electroerosion, and the remaining workpiece contains the desired part. Electrodes are formed by etching stepped patterns in silicon wafers and depositing a thin metallic layer on the wafer. The resulting electrode is used in an EDM machine, and an inverse pattern is produced in the part. Alternately, the silicon wafer pattern is filled by a metal to produce a metal electrode with an inverse pattern. The wafer is removed from the metal, and the metal is used in an EDM machine. The resulting part has the same pattern as the silicon wafer used to create the metal electrode. The metal can be electroplated into the wafer pattern, in which case copper may be used, or metal powder can be hot-pressed into the wafer. Hot pressed electrodes are preferably a mixture of silver and tungsten. The present method is adaptable to highly parallel manufacturing, and can be fully automated using a CAD/CAM system with added process-specific extensions.
摘要翻译：用于制造亚毫米尺寸部件的方法使用由图案化硅晶片产生的放电加工（EDM）的电极，其中在图案化电极和导电工件之间产生放电。对应于电极图案的工件材料通过电蚀去除，剩余的工件包含所需部分。电极通过在硅晶片中蚀刻阶梯图案并在薄片上沉积薄金属层而形成。所得电极用于电火花加工机，在该部件中产生反向图案。或者，硅晶片图案由金属填充以产生具有相反图案的金属电极。将晶片从金属上除去，并将金属用于EDM机器中。所得部分具有与用于形成金属电极的硅晶片相同的图案。金属可以电镀到晶片图案中，在这种情况下可以使用铜，或者可以将金属粉末热压到晶片中。热压电极优选为银和钨的混合物。本方法适用于高度并行的制造，并且可以使用具有附加的处理特定扩展的CAD / CAM系统进行全自动化。

5. 发明申请

US20080287565A1 Polymerized Molded Body 失效
标题翻译：聚合成型体
公开(公告)号：US20080287565A1
公开(公告)日：2008-11-20
申请号：US11918513
申请日：2006-04-10
申请人： Robert Liska , Monika Schuster , Jurgen Stampfl , Heinrich Gruber , Franz Varga
发明人： Robert Liska , Monika Schuster , Jurgen Stampfl , Heinrich Gruber , Franz Varga
IPC分类号： A61L27/26 , A61L27/58 , C08F20/54
CPC分类号： A61L27/16 , A61L27/46 , A61L27/48 , A61L27/56 , A61L27/58 , B33Y70/00 , B33Y80/00 , C08F220/18 , C08F220/36 , C08L33/06
摘要： The invention relates to polymerizable compositions which comprise 10-80% by weight of a reactive diluent based on acrylic acid or methacrylic acid derivatives, and 10-50% by weight of a monomer of the indicated chemical formula which is liquid or which can be dissolved in the formulation. The formula may contain amino acid residues or peptide sequences, especially such that are specific of the collagen. These structural elements allow the enzymatic degradation of the polymers of the inventive composition.
摘要翻译：本发明涉及可聚合组合物，其包含10-80重量％的基于丙烯酸或甲基丙烯酸衍生物的反应性稀释剂和10-50重量％所示化学式的单体，其为液体或可溶解的在配方中。该配方可含有氨基酸残基或肽序列，特别是胶原蛋白的特异性。这些结构元件允许本发明组合物的聚合物的酶降解。

6. 发明授权

US07927538B2 Light-curing slips for the stereolithographic preparation of dental ceramics 有权
标题翻译：用于牙科陶瓷立体光刻制备的光固化片
公开(公告)号：US07927538B2
公开(公告)日：2011-04-19
申请号：US12394452
申请日：2009-02-27
申请人： Norbert Moszner , Wolfgang Wachter , Christoph Appert , Volker M. Rheinberger , Robert Liska , Jurgen Stampfl , Johannes Patzer
发明人： Norbert Moszner , Wolfgang Wachter , Christoph Appert , Volker M. Rheinberger , Robert Liska , Jurgen Stampfl , Johannes Patzer
IPC分类号： A61K6/00 , A61C5/00 , C08K9/00 , C08K3/22 , G03F7/00 , B29C35/04
CPC分类号： A61L27/46 , A61C13/0013 , A61K6/0215 , A61K6/024 , A61K6/025 , A61K6/0273 , B33Y70/00 , B33Y80/00 , C04B35/111 , C04B35/486 , C04B35/6263 , C04B35/6264 , C04B35/632 , C04B35/63488 , C04B35/638 , C04B2235/3224 , C04B2235/3225 , C04B2235/3246 , C04B2235/3262 , C04B2235/3272 , C04B2235/3287 , C04B2235/441 , C04B2235/449 , C04B2235/6026 , C04B2235/6562 , C04B2235/77 , C04B2235/96 , C04B2235/9661 , G03F7/0037 , G03F7/0047 , G03F7/027
摘要： Slip based on a polyreactive binder, polymerization initiator and filler, which contains (A) 5-65 wt.-% polymerizable binder, (B) 0.001-1.0 wt.-% photoinitiator and (C) 35-90 wt.-% surface-modified ceramic and/or glass ceramic particles relative to the overall mass of the slip, and process for the preparation of ceramic mouldings by rapid prototyping processes using the slip.
摘要翻译：基于聚反应性粘合剂，聚合引发剂和填料，其含有（A）5-65重量％可聚合粘合剂，（B）0.001-1.0重量％光引发剂和（C）35-90重量％表面改性的陶瓷和/或玻璃陶瓷颗粒相对于滑移的总体质量，以及通过使用滑移的快速成型方法制备陶瓷模制品的方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式