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    • 4. 发明专利
    • Method for encapsulating fine solder metal powders
    • NZ508383A
    • 2003-03-28
    • NZ50838399
    • 1999-06-15
    • JURGEN SCHULZEWALTER PROTSCH
    • PROTSCH WALTERSCHULZE JURGEN
    • B23K35/40B22F1/00B22F1/02B23K35/02B23K35/14B23K35/363H05K3/34
    • A method of encapsulating solder metal powder is disclosed, wherein the powder is provided with a thin polymer protective layer by a polymerization reaction running on the surface of the solder powder, with the following steps: a) producing a suspension of powder and a hydrophobic liquid, b) generating a hydrophobic surface layer on each metal particle by adding a cationic tenside with a chain length of C1 through C20 with continuous stirring to form a brush structure on the hydrophobic layer, c) stirring the mixture of steps a) and b) until formation of a viscous homogeneous mass, d) adding a radically polymerizable monomer to the mass of step c) which forms a thermoplastic polymer with a glass temperature Tg of at least 60 C. below the solidus temperature of the solder powder, e) adding an organic initiator to start an interfacial polymerization reaction with incorporation of the hydrophobic layer of step b) and formation of a protective layer of thermoplastic polymer which has fluxing agent characteristics, f) introducing the mass of step e) into an aqueous preparation with continuous stirring, whereby the preparation contains an emulsifier for suspension stabilization and controlling the polymerization reaction by tempering to 50 to 90 C and maintaining this temperature for at least 120 min, and g) cooling, washing and recovering the encapsulated solder powder of steps e) and f). This method for encapsulating solder metal powders and the microencapsulated metal solder is useful in such a way that the metal powder is reliably protected from external oxidizing influences and the capsule only releases the metal powder as a result of the influence of temperature, without the influence of soldering flux.