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    • 2. 发明授权
    • Feeding structure for cavity resonators
    • 腔谐振器的馈电结构
    • US08884716B2
    • 2014-11-11
    • US13360183
    • 2012-01-27
    • Joo-Young ChoiStefan KochThomas Merkle
    • Joo-Young ChoiStefan KochThomas Merkle
    • H01P5/107
    • H01P5/107
    • A feeding structure including a carrier substrate, a top conductor plane of a cavity formed in the carrier substrate, a feedline substrate covering the top conductor plane, a signal conductor of a feedline, the signal conductor being formed in or on the feedline substrate opposite the top conductor plane, a via probe connected to the signal conductor and leading through the feedline substrate and the top conductor plane into the cavity, a ring-shaped aperture formed in the top conductor plane around the via probe, and at least one slot-shaped aperture formed in the top conductor plane starting at the ring-shaped aperture and leading away from the via probe.
    • 一种馈送结构,包括载体衬底,形成在载体衬底中的空腔的顶部导体平面,覆盖顶部导体平面的馈线衬底,馈线的信号导体,信号导体形成在馈线衬底上或与衬底相对的馈线衬底上 顶导体平面,连接到信号导体并通过馈线基板并且顶部导体平面进入空腔的通孔探针,形成在通孔探针周围的顶部导体平面中的环形孔,以及至少一个槽形 孔形成在顶部导体平面中,从环形孔开始并远离通孔探针。
    • 3. 发明申请
    • FEEDING STRUCTURE FOR CAVITY RESONATORS
    • CAVITY谐振器的进给结构
    • US20120206219A1
    • 2012-08-16
    • US13360183
    • 2012-01-27
    • Joo-Young CHOIStefan KochThomas Merkle
    • Joo-Young CHOIStefan KochThomas Merkle
    • H01P7/06H01P5/103
    • H01P5/107
    • The present invention relates to a feeding structure for coupling a feedline to a cavity. To increase the coupling, which can contribute to achieving a broad bandwidth, a feeding structure is proposed comprising a carrier substrate, a top conductor plane of a cavity formed in said carrier substrate, a feedline substrate covering said top conductor plane, a signal conductor of a feedline, said signal conductor being formed in or on said feedline substrate opposite said top conductor plane, a via probe connected to said signal conductor and leading through said feedline substrate and said top conductor plane into said cavity, a ring-shaped aperture formed in said top conductor plane around said via probe, and at least one slot-shaped aperture formed in said top conductor plane starting at said ring-shaped aperture and leading away from said via probe.
    • 本发明涉及用于将馈线连接到空腔的馈送结构。 为了增加有助于实现宽带宽的耦合,提出了一种馈电结构,其包括载体衬底,形成在所述载体衬底中的空腔的顶部导体平面,覆盖所述顶部导体平面的馈线衬底, 馈线,所述信号导体形成在与所述顶导体平面相对的所述馈线衬底中或上,所述信号导体连接到所述信号导体并通过所述馈线衬底和所述顶导体平面进入所述空腔中的通孔探针, 围绕所述通孔探针的所述顶部导体平面以及形成在所述顶部导体平面中的至少一个狭槽形孔,从所述环形孔开始并远离所述通孔探针。