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1. 发明授权

US09093736B2 Common mode filter and method for manufacturing the same 有权
标题翻译：共模滤波器及其制造方法
公开(公告)号：US09093736B2
公开(公告)日：2015-07-28
申请号：US13472195
申请日：2012-05-15
申请人： Jin Gu Kim , Jong Yun Lee , Young Do Kweon , Chang Bae Lee , Young Seuck Yoo
发明人： Jin Gu Kim , Jong Yun Lee , Young Do Kweon , Chang Bae Lee , Young Seuck Yoo
IPC分类号： H03H7/01 , H05K3/00 , H01P1/203 , H03H1/00 , H04B3/28 , H03H7/42 , H01F17/00
CPC分类号： H01P1/20345 , H01F17/0013 , H01F2017/0093 , H03H1/0007 , H03H7/427 , H03H2001/0085 , H04B3/28
摘要： Disclosed herein are a common mode filter and a method for manufacturing the same. The common mode filter includes a first insulator sheet; a first circuit layer having a first-layered first coil and a first-layered second coil alternately and separately arranged; a second insulator sheet laminated on the first circuit layer; and a second circuit layer having a second-layered first coil and a second-layered second coil alternately and separately arranged, the second-layered first coil being connected to the first-layered first coil and the second-layered second coil being connected to the first-layered second coil through the plurality of penetration holes.
摘要翻译：这里公开了共模滤波器及其制造方法。共模滤波器包括第一绝缘片; 具有第一层次的第一线圈和第一层次的第二线圈的第一电路层交替且分开布置; 叠层在第一电路层上的第二绝缘片; 并且具有交替且分离布置的具有第二层第一线圈和第二层次线圈的第二电路层，所述第二层第一线圈连接到所述第一层第一线圈，所述第二层第二线圈连接到第一层第二线圈通过多个穿透孔。

2. 发明授权

US08658467B2 Method of manufacturing stacked wafer level package 有权
标题翻译：堆叠晶圆级封装的制造方法
公开(公告)号：US08658467B2
公开(公告)日：2014-02-25
申请号：US12929703
申请日：2011-02-09
申请人： Seung Wook Park , Young Do Kweon , Jin Gu Kim , Ju Pyo Hong , Hee Kon Lee , Hyung Jin Jeon , Yuan Jing Li , Jong Yun Lee
发明人： Seung Wook Park , Young Do Kweon , Jin Gu Kim , Ju Pyo Hong , Hee Kon Lee , Hyung Jin Jeon , Yuan Jing Li , Jong Yun Lee
IPC分类号： H01L21/00
CPC分类号： H01L23/3128 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L23/49816 , H01L23/49827 , H01L23/5384 , H01L23/5389 , H01L24/19 , H01L24/81 , H01L24/83 , H01L2224/05001 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05548 , H01L2224/12105 , H01L2224/16225 , H01L2224/2402 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2224/83851 , H01L2225/1035 , H01L2225/1058 , H01L2924/00011 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/351 , H01L2224/29075 , H01L2924/00014 , H01L2924/00
摘要： A method of manufacturing a stacked wafer level package includes: preparing a substrate; forming a conductive layer on the substrate; forming chip connection pads and internal connection pads on the conductive layer; forming solder balls connected to the internal connection pads; mounting a semiconductor chip on the conductive layer to be connected to the chip connection pads; forming a sealing member to seal the solder balls and the semiconductor chip; separating the substrate from the conductive layer; forming a rearrangement wiring layer by etching the conductive layer; forming an external connection on the rearrangement wiring layer; forming contact holes in the sealing member to expose the solder balls; and stacking an electronic component to be electrically connected to the solder balls exposed through the contact holes.
摘要翻译：层叠晶片级封装的制造方法包括：准备基板; 在所述基板上形成导电层; 在导电层上形成芯片连接焊盘和内部连接焊盘; 形成连接到内部连接焊盘的焊球; 将半导体芯片安装在所述导电层上以连接到所述芯片连接焊盘; 形成密封构件以密封焊球和半导体芯片; 将衬底与导电层分离; 通过蚀刻导电层形成重排布线层; 在所述重排布线层上形成外部连接; 在所述密封构件中形成接触孔以暴露所述焊球; 并且堆叠要电连接到通过接触孔暴露的焊料球的电子部件。

3. 发明申请

US20130071300A1 BILLS-ONLY STERILIZER 审中-公开
标题翻译： BILLS-onlyly杀菌剂
公开(公告)号：US20130071300A1
公开(公告)日：2013-03-21
申请号：US13616491
申请日：2012-09-14
申请人： Jong-Yun LEE
发明人： Jong-Yun LEE
IPC分类号： A61L2/08 , A61L2/16
CPC分类号： A61L2/085 , A61L2/22
摘要： The present invention generally relates to a bills-only sterilizer capable of sterilizing a little bills, and more particularly, to a bills-only sterilizer that can cause the bills under sterilization to be spaced more efficiently and enhance the efficiency of sterilization maximally. The bills-only sterilizer comprises a door opened and closed to insert bills into main body case and pull bills out of the main body case, a sterilizing chamber for sterilizing bills, the sterilizing chamber including a holding means and a sterilizing means, the holding means capable of holding bills therein when the door is opened, a blowing means under the sterilizing chamber, the blooding means blowing wind upwards, thereby causing bills to be spaced, an exhausting means formed back face of the main body case, the exhausting means connected to the sterilizing chamber and the exhausting means going through to the outside of the main body case.
摘要翻译：本发明一般涉及能够对少量纸币进行杀菌的仅纸币消毒器，更具体地，涉及能够使灭菌纸币更有效地间隔并且最大限度地提高灭菌效率的仅纸币消毒器。仅纸币灭菌器包括打开和关闭的门以将钞票插入主体外壳并将纸币从主体外壳中拉出，用于消毒纸币的灭菌室，所述灭菌室包括保持装置和灭菌装置，所述保持装置当门打开时能够保持纸币，在灭菌室下方具有吹风装置，吹风装置向上吹风，从而使纸币间隔开，排出装置形成在主体壳体的背面，排气装置连接到灭菌室和排气装置通过主体壳体的外部。

4. 发明授权

US07663250B2 Wafer level package and manufacturing method thereof 失效
标题翻译：晶圆级封装及其制造方法
公开(公告)号：US07663250B2
公开(公告)日：2010-02-16
申请号：US12230793
申请日：2008-09-04
申请人： Hyung Jin Jeon , Sung Yi , Jong Yun Lee , Young Do Kweon , Jong Hwan Baek
发明人： Hyung Jin Jeon , Sung Yi , Jong Yun Lee , Young Do Kweon , Jong Hwan Baek
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/12 , H01L24/11 , H01L2224/0231 , H01L2224/0239 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/13099 , H01L2224/13139 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/014 , H01L2924/30105 , H01L2924/351 , H01L2924/00 , H01L2924/00014
摘要： A wafer level package and a manufacturing method thereof capable of reducing stress between an under bump metal and a bump. The wafer level package includes a substrate provided with a plurality of chip pads on a top surface; a first passivation layer to expose the chip pads; vias connected to the chip pads by passing through the first passivation layer; a metal wiring layer formed on the first passivation layer and connected to the vias; an under bump metal formed on the first passivation layer to be connected to the metal wiring layer and having a buffer pattern separated through a trench on a center; a second passivation layer formed on the first passivation layer to expose the under bump metal; a first bump formed on the buffer pattern; and a second bump filling the trench and formed on the first bump and the under bump metal.
摘要翻译：一种晶片级封装及其制造方法，能够减少凸块之间的应力。晶片级封装包括在顶表面上设置有多个芯片焊盘的衬底; 第一钝化层以暴露所述芯片焊盘; 通过穿过第一钝化层连接到芯片焊盘的通孔; 形成在所述第一钝化层上并连接到所述通孔的金属布线层; 形成在所述第一钝化层上以连接到所述金属布线层并且具有通过中心的沟槽分离的缓冲图案的下凸块金属; 形成在所述第一钝化层上以暴露所述下凸块金属的第二钝化层; 形成在缓冲图案上的第一凸起; 以及填充所述沟槽并形成在所述第一凸块和所述下凸块金属上的第二凸块。

5. 发明授权

US07632709B2 Method of manufacturing wafer level package 失效
公开(公告)号：US07632709B2
公开(公告)日：2009-12-15
申请号：US12149106
申请日：2008-04-25
申请人： Hyung-Jin Jeon , Sung Yi , Young-Do Kweon , Jong-Yun Lee , Joon-Seok Kang , Seung-Wook Park
发明人： Hyung-Jin Jeon , Sung Yi , Young-Do Kweon , Jong-Yun Lee , Joon-Seok Kang , Seung-Wook Park
IPC分类号： H01L21/00
CPC分类号： H01L23/3114 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/24 , H01L24/27 , H01L24/82 , H01L2221/68372 , H01L2224/0231 , H01L2224/0401 , H01L2224/16 , H01L2224/24227 , H01L2224/274 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01059 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15153 , H01L2924/1517
摘要： A method of manufacturing a wafer level package is disclosed. The method may include stacking an insulation layer over a wafer substrate; processing a via hole in the insulation layer; forming a seed layer over the insulation layer; forming a plating resist, which is in a corresponding relationship with a redistribution pattern, over the seed layer; forming the redistribution pattern, which includes a terminal for external contact, by electroplating; and coupling a conductive ball to the terminal. As multiple redistribution layers can be formed using inexpensive PCB processes, the manufacturing costs can be reduced, and the stability and efficiency of the process can be increased.

6. 发明授权

US07442398B2 Phytase produced from Citrobacter braakii 有权
标题翻译：柠檬酸杆菌生产的植酸酶
公开(公告)号：US07442398B2
公开(公告)日：2008-10-28
申请号：US10550758
申请日：2004-03-25
申请人： Young Ok Kim , Han Woo Kim , Jeong Ho Lee , Kyung Kil Kim , Jong Yun Lee , In Soo Kong
发明人： Young Ok Kim , Han Woo Kim , Jeong Ho Lee , Kyung Kil Kim , Jong Yun Lee , In Soo Kong
IPC分类号： A23L1/36 , C12N9/16 , C12P19/30 , C12P21/06 , C07H21/02 , C07H21/04 , A23C9/121
CPC分类号： C12N9/16 , A23K20/189
摘要： The present invention relates to phytase enzyme, a gene encoding the enzyme, and a Citrobacter sp. producing the enzyme. Particularly, the present invention relates to the phytase enzyme produced from Citrobacter sp. having (a) molecular weight of 47 kDa, (b) optimal pH of 3.5-4.5, (c) optimal temperature of 45-55° C., (d) a substrates phytate, p-nitrophenyl phosphate, tetrasodium pyrophosphate, ATP or ADP, (e) Michaelis constant of 0.3-0.5 mM utilizing phytate as substrate, and (f) high resistance to protease such as pepsin, trypsin, papain, elastase or pancreatin. The present invention also relates to the gene coding the phytase enzyme and the Citrobacter braakii producing the enzyme. The phytase enzyme and the Citrobacter braakii producing the enzyme of the present invention can be used in manufacturing a feed of monogastrics as feed additive and in recovering a specific decomposition product of phytate at low price.
摘要翻译：本发明涉及植酸酶，编码酶的基因和柠檬酸杆菌属。产生酶。特别地，本发明涉及由柠檬酸杆菌属（Citrobacter sp。）生产的植酸酶。（a）分子量为47kDa，（b）最佳pH为3.5-4.5，（c）最适温度为45-55℃，（d）底物植酸盐，磷酸对硝基苯酯，焦磷酸四钠，ATP或 ADP，（e）利用植酸盐作为底物的0.3-0.5mM的米氏常数，和（f）对蛋白酶如胃蛋白酶，胰蛋白酶，木瓜蛋白酶，弹性蛋白酶或胰酶的高抗性。本发明还涉及编码植酸酶的基因和产生该酶的柠檬酸杆菌（Citrobacter braakii）。产生本发明酶的植酸酶和柠檬酸杆菌可用于制造作为饲料添加剂的单胃饲料的饲料，并以低价回收植酸盐的特定分解产物。

7. 发明申请

US20070136746A1 User context based dynamic service combination system and method 审中-公开
标题翻译：基于用户环境的动态服务组合系统和方法
公开(公告)号：US20070136746A1
公开(公告)日：2007-06-14
申请号：US11635580
申请日：2006-12-08
申请人： Jung-Sook Bae , Kyung-Sook Kim , Gyung-Chul Shin , Jae-Ho Kim , Seong-Im Yoon , Jong-Yun Lee , Sun-Young Lee , Byoung-Cheol Shin
发明人： Jung-Sook Bae , Kyung-Sook Kim , Gyung-Chul Shin , Jae-Ho Kim , Seong-Im Yoon , Jong-Yun Lee , Sun-Young Lee , Byoung-Cheol Shin
IPC分类号： H04N7/025 , G06F13/00 , H04N7/10 , G06F3/00 , H04N5/445
CPC分类号： H04N7/17318 , G06Q10/06 , G06Q50/32 , H04N21/25866 , H04N21/25891 , H04N21/42202 , H04N21/44213 , H04N21/6582
摘要： A dynamic service combination system and service provision method using user's context information are provided. a service may be dynamically provided and a new service may be combined to be provided to a service user using the user's context information. In addition, a new ontology may be configured by finding a new knowledge through AI engine's data mining, and thus a success rate of the service provision may be increased, and a dynamic service provision may be achieved.
摘要翻译：提供了一种使用用户上下文信息的动态服务组合系统和服务提供方法。可以动态地提供服务，并且可以将新服务组合以使用用户的上下文信息提供给服务用户。另外，可以通过AI引擎的数据挖掘找到新的知识来配置新的本体，从而可以提高服务提供的成功率，并且可以实现动态服务提供。

8. 发明授权

US08172319B2 Active headrest apparatus for vehicle and actuator thereof 有权
标题翻译：用于车辆的主动头枕装置及其致动器
公开(公告)号：US08172319B2
公开(公告)日：2012-05-08
申请号：US12510700
申请日：2009-07-28
申请人： Sang Do Park , Hak Gyun Kim , Dong Woo Jeong , Gil Ju Kim , Bong Ku Kim , Jun Yeol Heo , Jong Kweon Pyun , Sang Nam Park , Jong Yun Lee , In Ho Lee
发明人： Sang Do Park , Hak Gyun Kim , Dong Woo Jeong , Gil Ju Kim , Bong Ku Kim , Jun Yeol Heo , Jong Kweon Pyun , Sang Nam Park , Jong Yun Lee , In Ho Lee
IPC分类号： B60N2/42
CPC分类号： B60N2/888
摘要： An actuator of an active headrest apparatus for a vehicle, which is operably connected to a headrest assembly and selectively allows a headrest of the headrest assembly to pop out forwards when a vehicle collision occurs, may include a housing installed on a seatback frame and formed with a guide groove, an operating plate elastically supported over the housing, an operating bracket arranged between the housing and the operating plate and having a guide projection slidably inserted into the guide groove of the housing, and an operating wire unit connecting the operating bracket with the headrest assembly, wherein the operating wire unit includes an operating wire and an operating wire retainer to slidably receive the operating wire therein.
摘要翻译：一种用于车辆的主动头枕装置的致动器，其可操作地连接到头枕组件，并且当发生车辆碰撞时可选择性地允许头枕组件的头枕向前弹出，可包括安装在座椅靠背框架上并形成有引导槽，弹性地支撑在壳体上的操作板，布置在壳体和操作板之间并具有可滑动地插入壳体的引导槽中的引导突起的操作支架，以及将操作支架与头枕组件，其中操作线单元包括操作线和操作线保持器，以可滑动地容纳操作线。

9. 发明授权

US08704350B2 Stacked wafer level package and method of manufacturing the same 有权
标题翻译：堆叠晶圆级封装及其制造方法
公开(公告)号：US08704350B2
公开(公告)日：2014-04-22
申请号：US12458454
申请日：2009-07-13
申请人： Seung Wook Park , Young Do Kweon , Jin Gu Kim , Ju Pyo Hong , Hee Kon Lee , Hyung Jin Jeon , Jing Li Yuan , Jong Yun Lee
发明人： Seung Wook Park , Young Do Kweon , Jin Gu Kim , Ju Pyo Hong , Hee Kon Lee , Hyung Jin Jeon , Jing Li Yuan , Jong Yun Lee
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/3128 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L23/49816 , H01L23/49827 , H01L23/5384 , H01L23/5389 , H01L24/19 , H01L24/81 , H01L24/83 , H01L2224/05001 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05548 , H01L2224/12105 , H01L2224/16225 , H01L2224/2402 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2224/83851 , H01L2225/1035 , H01L2225/1058 , H01L2924/00011 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/351 , H01L2224/29075 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a stacked wafer level package and a method of manufacturing the same. The stacked wafer level package in accordance with the present invention can improve a misalignment problem generated in a stacking process by performing a semiconductor chip mounting process, a rearrangement wiring layer forming process, the stacking process and so on after previously bonding internal connection means for interconnection between stacked electronic components to a conductive layer for forming a rearrangement wiring layer, thereby improving reliability and yield and reducing manufacturing cost.
摘要翻译：本发明涉及层叠晶片级封装及其制造方法。根据本发明的堆叠晶片级封装可以通过在预先接合用于互连的内部连接装置之后执行半导体芯片安装处理，重排布线层形成处理，堆叠处理等来改善堆叠处理中产生的未对准问题在层叠的电子部件之间形成用于形成重排布线层的导电层，从而提高可靠性和产率，并降低制造成本。

10. 发明申请

US20120295404A1 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：制造半导体封装的方法
公开(公告)号：US20120295404A1
公开(公告)日：2012-11-22
申请号：US13557362
申请日：2012-07-25
申请人： Joon Seok KANG , Young Do KWEON , Seung Wook PARK , Jong Yun LEE , Kyung Seob OH
发明人： Joon Seok KANG , Young Do KWEON , Seung Wook PARK , Jong Yun LEE , Kyung Seob OH
IPC分类号： H01L21/58
CPC分类号： H01L23/5389 , H01L23/49827 , H01L24/24 , H01L24/82 , H01L2224/0231 , H01L2224/24226 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K1/185 , H05K2201/10674 , H05K2203/1469 , H01L2924/00
摘要： A method of manufacturing a semiconductor package, the method including: forming an insulating layer on a board; forming an electrode pattern portion by redistribution plating in order to make a circuit connection on the insulating layer; manufacturing a semiconductor chip by forming a protecting portion on the electrode pattern portion such that a portion of the electrode pattern portion is exposed; and mounting the semiconductor chip on a receiving space of a circuit board and electrically connecting the semiconductor chip to the circuit board.
摘要翻译：一种制造半导体封装的方法，所述方法包括：在板上形成绝缘层; 通过再分布电镀形成电极图案部分，以在绝缘层上形成电路连接; 通过在所述电极图案部分上形成保护部分使得所述电极图案部分的一部分露出而制造半导体芯片; 并将半导体芯片安装在电路板的接收空间上并将半导体芯片电连接到电路板。

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