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    • 5. 发明申请
    • METHOD FOR MANUFACTURING SILICON CARBIDE SCHOTTKY BARRIER DIODE
    • 制造碳化硅肖特基二极管的方法
    • US20130115758A1
    • 2013-05-09
    • US13372931
    • 2012-02-14
    • Kyoung Kook HongJong Seok Lee
    • Kyoung Kook HongJong Seok Lee
    • H01L21/20
    • H01L29/872H01L21/046H01L21/0495H01L29/1608H01L29/6606
    • The present invention provides a method for manufacturing a silicon carbide Schottky barrier diode. In the method, an n− epitaxial layer is deposited on an n+ substrate. A sacrificial oxide film is formed on the n− epitaxial layer by heat treatment, and then a portion where a composite oxide film is to be formed is exposed by etching. Nitrogen is implanted into the n− epitaxial layer and the sacrificial oxide film using nitrogen plasma. A silicon nitride is deposited on the n− epitaxial layer and the sacrificial oxide film. The silicon nitride is thermally oxidized to form a composite oxide film. An oxide film in a portion where a Schottky metal is to be deposited is etched, and then the Schottky metal is deposited, thereby forming a silicon carbide Schottky barrier diode.
    • 本发明提供一种制造碳化硅肖特基势垒二极管的方法。 在该方法中,在n +衬底上沉积n-外延层。 通过热处理在n外延层上形成牺牲氧化膜,然后通过蚀刻暴露要形成复合氧化物膜的部分。 使用氮等离子体将氮注入到n外延层和牺牲氧化膜中。 氮化硅沉积在n外延层和牺牲氧化膜上。 氮化硅被热氧化以形成复合氧化膜。 对要沉积肖特金属的部分中的氧化膜进行蚀刻,然后沉积肖特基金属,从而形成碳化硅肖特基势垒二极管。