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    • 3. 发明授权
    • Through substrate optical imaging device and method
    • 通过基板光学成像装置和方法
    • US08110804B2
    • 2012-02-07
    • US12588504
    • 2009-10-16
    • Taufiq HabibAlex F. SchreinerJon Marson
    • Taufiq HabibAlex F. SchreinerJon Marson
    • G01J5/20
    • G01N21/9501G01N21/9505
    • A through-substrate optical imaging device for through-imaging of translucent work objects, includes a radiation source outputting radiation that will be transmissive through the work object and an imaging system configured for capturing inspection information from the radiation source through the work object. The radiation source is configured such that the radiation impinges on the surface of the work object under various angles of incidence. A method for through-substrate optical imaging of a translucent work object includes irradiating the translucent work object by radiation from a radiation source; capturing inspection information from the radiation source through the translucent work object, the inspection information being captured by an imaging system; and irradiating the translucent work object. The translucent work object is irradiated by radiation which impinges on the surface of the translucent work object under one of various angles of incidence and orientations.
    • 一种用于半透明工件的透射成像的贯穿基板光学成像装置,包括:输出将通过工作对象透射的辐射的辐射源;以及被配置为从所述辐射源通过所述工作对象捕获检查信息的成像系统。 辐射源被配置成使得辐射以不同的入射角射入工作物体的表面上。 半透明工件的透光基板光学成像方法包括通过来自辐射源的辐射照射半透明工件; 从辐射源通过半透明工作对象捕获检查信息,所述检查信息由成像系统捕获; 并照射半透明工件。 半透明加工对象被辐射照射在各种入射角度和取向角之下的半透明加工对象的表面上。
    • 6. 发明申请
    • Through-substrate optical imaging device and method
    • 透光成像装置及方法
    • US20100181483A1
    • 2010-07-22
    • US12588504
    • 2009-10-16
    • Taufiq HabibAlex F. SchreinerJon Marson
    • Taufiq HabibAlex F. SchreinerJon Marson
    • G01N21/88G01N21/01
    • G01N21/9501G01N21/9505
    • A through-substrate optical imaging device for through-imaging of translucent work objects, includes a radiation source outputting radiation that will be transmissive through the work object and an imaging system configured for capturing inspection information from the radiation source through the work object. The radiation source is configured such that the radiation impinges on the surface of the work object under various angles of incidence. A method for through-substrate optical imaging of a translucent work object includes irradiating the translucent work object by radiation from a radiation source; capturing inspection information from the radiation source through the translucent work object, the inspection information being captured by an imaging system; and irradiating the translucent work object. The translucent work object is irradiated by radiation which impinges on the surface of the translucent work object under one of various angles of incidence and orientations.
    • 一种用于半透明工件的透射成像的贯穿基板光学成像装置,包括:输出将通过工作对象透射的辐射的辐射源;以及被配置为从所述辐射源通过所述工作对象捕获检查信息的成像系统。 辐射源被配置成使得辐射以不同的入射角射入工作物体的表面上。 半透明工件的透光基板光学成像方法包括通过来自辐射源的辐射照射半透明工件; 从辐射源通过半透明工作对象捕获检查信息,所述检查信息由成像系统捕获; 并照射半透明工件。 半透明加工对象被辐射照射在各种入射角度和取向角之下的半透明加工对象的表面上。