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1. 发明授权

US06939209B2 Method and apparatus for global die thinning and polishing of flip-chip packaged integrated circuits 失效
标题翻译：用于倒装芯片封装集成电路的全局模具稀疏和抛光的方法和装置
公开(公告)号：US06939209B2
公开(公告)日：2005-09-06
申请号：US10693310
申请日：2003-10-24
申请人： Chun-Cheng Tsao , John Valliant
发明人： Chun-Cheng Tsao , John Valliant
IPC分类号： B24B1/00 , B24B7/22 , B24B37/04 , B24B49/12
CPC分类号： B24B49/12 , B24B7/228 , B24B37/042
摘要： A reliable, inexpensive “back side” thinning process and apparatus therefor, capable of globally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the packaged die. The flip-chip packaged die is exposed at its backside and mounted on a lapping machine with the backside exposed. The thickness of the die is measured at at least five locations on the die. The lapping machine grinds the exposed surface of the die to a thickness somewhat greater than the target thickness. The exposed surface of the die is polished. The thickness of the die is again measured optically with high accuracy. Based on the thickness data collected, appropriate machine operating parameters for further grinding and polishing of the exposed surface are determined. Further grinding and polishing are performed. These steps are repeated until the target thickness is reached.
摘要翻译：一种可靠，廉价的“背面”稀释方法及其设备，能够将集成电路管芯全局变薄至目标厚度为10微米，并保持至少80％的产量，用于芯片修复和/或故障分析包装模具倒装芯片封装的裸片在其背面露出并安装在背面暴露的研磨机上。模具的厚度在模具上的至少五个位置处被测量。研磨机将模具的暴露表面研磨到稍大于目标厚度的厚度。模具的暴露表面被抛光。再次以高精度光学测量模具的厚度。基于收集的厚度数据，确定用于进一步研磨和抛光暴露表面的合适的机器操作参数。进行进一步研磨和抛光。重复这些步骤，直到达到目标厚度。

2. 发明申请

US20140065070A1 METHODS OF PREPARING TRIAZOLE-CONTAINING RADIOIODINATED COMPOUNDS 审中-公开
标题翻译：制备含三唑类放射性化合物的方法
公开(公告)号：US20140065070A1
公开(公告)日：2014-03-06
申请号：US14012502
申请日：2013-08-28
申请人： John Valliant , Alla Darwish , Stephanie Rathmann , Afaf Genady
发明人： John Valliant , Alla Darwish , Stephanie Rathmann , Afaf Genady
IPC分类号： A61K51/04
CPC分类号： A61K51/0453 , A61K51/0455
摘要： The present application relates to methods of preparing radiohalogenated compounds, to compounds useful in such methods and to radiohalogenated compounds useful for imaging and/or therapy. In particular, the present application relates to methods of preparing radiohalogenated compounds of Formula I, to compounds useful in such methods and to radiohalogenated compounds of Formula I:
摘要翻译：本申请涉及制备放射性卤化化合物，可用于这些方法的化合物和用于成像和/或治疗的放射性卤代化合物的方法。特别地，本申请涉及制备式I的放射性卤代化合物，可用于这些方法的化合物和式I的放射性卤代化合物的方法：

3. 发明授权

US06672947B2 Method for global die thinning and polishing of flip-chip packaged integrated circuits 有权
标题翻译：用于倒装芯片封装集成电路的全局模具稀疏和抛光的方法
公开(公告)号：US06672947B2
公开(公告)日：2004-01-06
申请号：US09924736
申请日：2001-08-07
申请人： Chun-Cheng Tsao , John Valliant
发明人： Chun-Cheng Tsao , John Valliant
IPC分类号： B24B100
CPC分类号： B24B49/12 , B24B7/228 , B24B37/042
摘要： A reliable, inexpensive “back side” thinning process, capable of globally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the packaged die. The flip-chip packaged die is exposed at its backside and mounted on a lapping machine with the backside exposed. The thickness of the die is measured at at least five locations on the die. The lapping machine grinds the exposed surface of the die to a thickness somewhat greater than the target thickness. The exposed surface of the die is polished. The thickness of the die is again measured optically with high accuracy. Based on the thickness data collected, appropriate machine operating parameters for further grinding and polishing of the exposed surface are determined. Further grinding and polishing are performed. These steps are repeated until the target thickness is reached.
摘要翻译：一种可靠，廉价的“背面”稀释工艺，能够将集成电路裸片全局变薄至目标厚度为10微米，并保持至少80％的产量，用于封装芯片的芯片修复和/或故障分析。倒装芯片封装的裸片在其背面露出并安装在背面暴露的研磨机上。模具的厚度在模具上的至少五个位置处被测量。研磨机将模具的暴露表面研磨到稍大于目标厚度的厚度。模具的暴露表面被抛光。再次以高精度光学测量模具的厚度。基于收集的厚度数据，确定用于进一步研磨和抛光暴露表面的合适的机器操作参数。进行进一步研磨和抛光。重复这些步骤，直到达到目标厚度。

4. 发明申请

US20120100071A1 SYNTHESIS AND USE OF RADIOLABELLED INSULIN ANALOGUES 审中-公开
标题翻译：合成和使用无限制胰岛素类似物
公开(公告)号：US20120100071A1
公开(公告)日：2012-04-26
申请号：US13375729
申请日：2010-06-07
申请人： John Valliant , Chitra Sundararajan , Katharina Guenther , Travis Besanger
发明人： John Valliant , Chitra Sundararajan , Katharina Guenther , Travis Besanger
IPC分类号： A61K51/08 , A61P5/48 , C07K14/62
CPC分类号： A61K51/08 , A61K38/00 , A61K51/088 , C07K14/62
摘要： A radiolabelled insulin analogue is provided. The analogue comprises a radiolabel linked to an insulin analogue at an amino acid at the terminal end of the B chain of the insulin analogue.
摘要翻译：提供放射性标记的胰岛素类似物。类似物包含与胰岛素类似物的B链末端的氨基酸处的胰岛素类似物连接的放射性标记。

5. 发明申请

US20120053318A1 METHOD OF RADIOLABELING 审中-公开
标题翻译：放射线方法
公开(公告)号：US20120053318A1
公开(公告)日：2012-03-01
申请号：US13223681
申请日：2011-09-01
申请人： Ryan Simms , Karin Stephenson , Darren Weaver , John Valliant
发明人： Ryan Simms , Karin Stephenson , Darren Weaver , John Valliant
IPC分类号： C07K14/62 , C07K7/08 , C07K7/06
CPC分类号： G01N33/534 , A61K51/088 , C07K14/62
摘要： The application describes a method of radiolabeling a molecule comprising reacting the molecule and a radionuclide labeling reagent in an emulsion, such as an oil-in-water emulsion.
摘要翻译：本申请描述了一种放射性标记分子的方法，包括使乳液中的分子和放射性核素标记试剂反应，例如水包油乳液。

6. 发明申请

US20060093552A1 Technetium-and rhenium-bis(heteroaryl) complexes, and methods of use thereof 审中-公开
标题翻译：锝和铼 - 双（杂芳基）络合物及其使用方法
公开(公告)号：US20060093552A1
公开(公告)日：2006-05-04
申请号：US11058394
申请日：2005-02-14
申请人： John Babich , William Eckelman , Kevin Maresca , John Valliant , Jon Zubieta
发明人： John Babich , William Eckelman , Kevin Maresca , John Valliant , Jon Zubieta
IPC分类号： A61K51/00 , C07F5/00
CPC分类号： C07D213/38 , A61K51/0478 , C07F13/00
摘要： One aspect of the invention relates to complexes of technetium (Tc) and rhenium (Re) with various heteroaromatic ligands, e.g., quinolinyl and isoquinolinyl ligands, and their use in fluoresence and radioimaging for a variety of clinical diagnostic applications, as well as radiopharmaceuticals for therapeutic applications. Another aspect of the invention relates to quinolinyl and isoquinolinyl ligands that form a portion of the aforementioned complexes. Methods for the preparation of the technetium and rhenium complexes are also described. Another aspect of the invention relates to quinolinyl and isoquinolinyl ligands based on derivatized lysine, alanine and bis-amino acids for conjugation to small peptides by solid phase synthetic methods. Additionally, the invention relates to methods for imaging regions of a mammal using the complexes of the invention.
摘要翻译：本发明的一个方面涉及锝（Tc）和铼（Re）与各种杂芳族配体的复合物，例如喹啉基和异喹啉基配体，以及它们在用于各种临床诊断应用的荧光和放射成像中的用途，以及用于治疗应用。本发明的另一方面涉及形成上述配合物的一部分的喹啉基和异喹啉基配体。还描述了制备锝和铼络合物的方法。本发明的另一方面涉及基于通过固相合成方法与小肽缀合的衍生化赖氨酸，丙氨酸和双氨基酸的喹啉基和异喹啉基配体。另外，本发明涉及使用本发明复合物成像哺乳动物区域的方法。

7. 发明申请

US20060062725A1 Methods for preparing metal-carborane complexes for radioimaging and radiotherapy 审中-公开
标题翻译：制备用于放射成像和放射治疗的金属 - 碳硼烷配合物的方法
公开(公告)号：US20060062725A1
公开(公告)日：2006-03-23
申请号：US11199359
申请日：2005-08-09
申请人： John Valliant , Oyebola Sogbein
发明人： John Valliant , Oyebola Sogbein
IPC分类号： A61K51/00 , C07F13/00 , C07F5/00
CPC分类号： A61K51/0476 , C07F13/005
摘要： The present invention relates to a method of preparing metal-carborane complexes comprising reacting a salt of the formula: [M(CO)3(Xm)3](1+3m), wherein M is selected from a radioisotope of rhenium (Re), technetium (Tc) and any other radioisotope binding in the same fashion, X is the same of different and is, independently, any suitable ligand and m is the formal charge for ligand X, with a nido-carborane or a closo-carborane in the presence of a hard base. In an embodiment of the invention, the hard base is a source of fluoride. Such a method is useful for preparing complexes suitable for radioimaging and radiotherapy.
摘要翻译：本发明涉及一种制备金属 - 碳硼烷配合物的方法，包括使甲醛的盐反应

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