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    • 7. 发明授权
    • Zero clock skew computer module
    • 零时钟偏移计算机模块
    • US06591372B1
    • 2003-07-08
    • US09392599
    • 1999-09-09
    • John Nerl
    • John Nerl
    • G06F110
    • G06F1/10
    • The length of the phase lock feedback path of the phase lock loop chip (PLL chip) is adjusted so that the timing of clock pulses at computer chips is measured relative to the arrival time of a clock pulse at the computer board clock pin. This adjustment of the length of the phase lock loop accounts for the length of the trace from the computer board clock pin to the PLL clock input pin. This adjustment of the length of the phase lock loop removes uncertainty between vendors in the arrival time of clock pulses at the computer chips, relative to arrival time of clock pulses at the computer board clock pin. A system designer then has control of the arrival time of a pulse at a computer chip clock pin by adjustment of the arrival time of the clock pulse at the computer board clock pin, and no variation is introduced between vendors who adopt the invention in their design of computer boards.
    • 调整锁相环芯片(PLL芯片)的锁相反馈路径的长度,以便相对于计算机板时钟引脚上的时钟脉冲的到达时间测量计算机芯片的时钟脉冲定时。 锁相环长度的这种调整是从电脑板时钟引脚到PLL时钟输入引脚的走线长度。 相对于计算机板时钟引脚上的时钟脉冲的到达时间,锁相环长度的这种调整在计算机芯片上的时钟脉冲到达时间消除了供应商之间的不确定性。 然后,系统设计者通过调整计算机板时钟引脚上的时钟脉冲的到达时间来控制脉冲到计算机芯片时钟引脚的到达时间,并且在其设计中采用本发明的供应商之间没有引入变化 的电脑板。
    • 8. 发明授权
    • Printed circuit board having a well structure accommodating one or more
capacitor components
    • 具有容纳一个或多个电容器部件的阱结构的印刷电路板
    • US6043987A
    • 2000-03-28
    • US918248
    • 1997-08-25
    • Paul M. GoodwinJohn Nerl
    • Paul M. GoodwinJohn Nerl
    • H05K1/18
    • H05K1/183
    • Printed Circuit Board fabrication costs are decreased, and device placement densities are increased by the use of well structures designed for receiving components such as capacitors on portions of the PCB directly beneath integrated circuit packages having very low vertical profiles. With such an arrangement it is possible to use newer low profile packages and still place a capacitor under the integrated circuit package for reduced area consumption and improved inductance and circuit cycle times. Further advantages of the present arrangement include a reduction in the number of vias that need to be drilled in the PCB to make capacitor attachments, a consequent improvement in PCB inductance and parasitic capacitance, and improved electrical properties for voltage reference planes and routing layers.
    • 印刷电路板制造成本降低,并且通过使用设计用于在具有非常低的垂直轮廓的集成电路封装下方的PCB的部分上接收诸如电容器的部件的阱结构来增加器件放置密度。 通过这样的布置,可以使用较新的薄型封装,并且还将电容器放置在集成电路封装下,以减少面积消耗,并改善电感和电路循环时间。 本发明的另外的优点包括减少在PCB中需要钻孔以形成电容器附件的通孔的数量,随之而来的PCB电感和寄生电容的改善以及电压参考平面和布线层的改善的电性能。