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    • 2. 发明授权
    • Flexible circuit board interconnect having low thermal conductivity
    • 具有低导热性的柔性电路板互连
    • US4509095A
    • 1985-04-02
    • US356069
    • 1982-03-08
    • John Boros
    • John Boros
    • H05K1/02H05K1/09H05K3/00H05K7/20
    • H05K3/4691H01R12/52H05K1/0201H05K1/09H05K2201/062H05K2201/10909
    • The invention is directed to an apparatus adapted for flexible electrical interconnection between first and second rigid circuit systems, the systems being desirably isolated thermally from each other against heat energy tending undesirably to transfer between the systems, comprising in combination, a first flexible electrical conductor extending outwardly of the first circuit system to terminate in a first end, a second flexible electrical conductor extending outwardly of the second circuit system to terminate in a second end, and a third flexible electrical conductor bridging at least the first and second ends to provide the flexible electrical interconnection between the first and second systems and characterized by low thermal conductivity relative to at least one of the first and second conductors to thermally isolate the systems. Also included are methods for providing the flexible electrical interconnection between first and second rigid circuit systems.
    • 本发明涉及一种适于在第一和第二刚性电路系统之间进行柔性电互连的装置,所述系统期望彼此热隔离,以抵抗不期望地在系统之间转移的热能,其包括组合的第一柔性电导体, 在第一电路系统的外部终止于第一端,从第二电路系统向外延伸以终止于第二端的第二柔性电导体,以及至少桥接至少第一端和第二端的第三柔性电导体,以提供柔性 第一和第二系统之间的电互连,并且其特征在于相对于第一和第二导体中的至少一个具有低导热性以热隔离系统。 还包括用于在第一和第二刚性电路系统之间提供柔性电互连的方法。