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    • 1. 发明专利
    • Improvements in or relating to the testing and grading of electric fuseheads
    • GB813400A
    • 1959-05-13
    • GB987456
    • 1956-03-29
    • JOHN DONALDSON PEARSONNEIL HERBERTCHARLES REIDJOHN BAYNE MORRISONICI LTD
    • 813,400. Assemblingand testing electric fuseheads. PEARSON, J. D., HERBERT, N., REID, C., MORRISON, B., and IMPERIAL CHEMICAL INDUSTRIES Ltd. Nov. 23, 1957 [March 29, 1956], No. 9874/56. Class 9 (1) Fuseheads comprising two electrodes 3, 3 1 cemented to opposite surfaces of an insulating layer 5 and soldered to a bridge wire are constructed as in Specification 748,675 and graded according to their electrical resistance by the apparatus of Fig. 4, which determines the resistance and directs the tested fuseheads along selected paths according to the resistance. When a comb of fuseheads has been formed it is fed to a reciprocating guillotine 7 which cuts through the electrode 3 into the insulating material 5, partially severing each fusehead. A guide 9 then bends the partly severed fusehead out of the plane of the comb and the resistance is recorded by a device 10. After this a guide 11 bends the fusehead back into line and a reciprocating guillotine 12 severs the fusehead from the comb. The cycle of operations is controlled by a motor-driven cam-shaft (not shown). The combs 14 are placed in slots in a magazine 15, which slides between guides 16 until a sprocket wheel 17 contacts the lowermost comb and feeds it into a guide block 18, sprocket wheels 19, 20, 21 being used to index the comb for each operation. In the first operating position the fusehead rests on an anvil 22 below a knife 23 adjustable in a slide 24. After the knife has cut through electrode 3, a frusto-conical roller 26 attached to sprocket 20 depresses the fusehead, so that electrode 3 is insulated from the remaining fuse-heads in the comb. The fusehead moves to the third position where electrode 3 1 forms a contact between block 18 and a shoe 27, while electrode 3 bridges hinged contacts 28, 29 controlled by springs 30, 31 respectively. The contacts 18, 27, 28, 29 are connected to an alternating current bridge measuring circuit 32 which is adapted to energize a relay 33 or 34 for a resistance range (a) or (b) respectively, e.g. 0.9-1.3 ohms or 1.3-1.6 ohms. If the resistance is below or above both ranges neither relay is energized. Near the end of the fusehead's stay In the third position, a switch 35 closes and if the fuse-head's resistance is in one of the selected ranges the appropriate relay is energized and in turn energizes one coil of a relay 36 or 37. The closing of switch 35 closes a switch 38 to energize the second coil of relay 36 or 37, whereupon switch 35 opens and isolates the relays 33, 34. The relays 36, 37 energize solenoids 39, 40 respectively. These solenoids are connected by linkage to a conduit 41, so that if solenoid 39 is energized the conduit is pivoted about its lower end to allow the severed fusehead to pass into a box 42. Similarly solenoid 40 moves the conduit so that the fusehead passes into a box 43, and when neither solenoid is energized the springs 44 hold the conduit in its mean position, so that rejected fuseheads pass into box 45. After switch 35 opens the fusehead is moved to the fourth position where an anvil 46 guides the fusehead back into alignment with the comb and a knife 47 mounted in slide 24 severs the fusehead, which then falls through funnel 48 into the appropriate box. The waste stub of the comb is fed by sprocket wheel 21 to a receptacle (not shown).
    • 3. 发明申请
    • Hermetically Sealed Glass Package and Method of Manufacture
    • 密封玻璃包装和制造方法
    • US20100126898A1
    • 2010-05-27
    • US11992370
    • 2006-11-27
    • Keith James BeckenStephan Lvovich LogunovAiyu ZhangJohn Bayne
    • Keith James BeckenStephan Lvovich LogunovAiyu ZhangJohn Bayne
    • B65D90/00C03B23/20
    • B65B7/00C03C27/06H01L21/50H01L51/5246
    • A method for manufacturing a hermetically sealed package is provided, the method comprising the steps of: using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates and further comprising: directing the laser to enter the frit pattern, then to trace the frit pattern, then to retrace a portion of the frit pattern, and then to exit the frit pattern; and selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal; then increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to heat the frit to form a hermetic seal; and then decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to heat the frit to form a hermetic seal before the laser exits the frit pattern.
    • 提供了一种用于制造密封包装的方法,所述方法包括以下步骤:使用激光加热设置在两个基板之间的图案的玻璃料,使得加热的玻璃料形成连接基板的气密密封件,还包括 :引导激光进入玻璃料图案,然后跟踪玻璃料图案,然后回扫玻璃料图案的一部分,然后退出玻璃料图案; 以及选择当激光进入玻璃料图案时的初始激光功率不足以加热玻璃料以形成气密密封; 然后将玻璃料图案的第一部分上的激光功率增加至至少足以加热玻璃料以形成气密密封的目标激光功率; 然后在玻璃料图案的第二部分上降低激光功率,直到激光功率不足以加热玻璃料以在激光器离开玻璃料图案之前形成气密密封。
    • 7. 发明授权
    • Hermetically sealed glass package and method of manufacture
    • 密封玻璃包装及其制造方法
    • US08375744B2
    • 2013-02-19
    • US11992370
    • 2006-11-27
    • Keith James BeckenStephan Lvovich LogunovAiyu ZhangJohn Bayne
    • Keith James BeckenStephan Lvovich LogunovAiyu ZhangJohn Bayne
    • C03B23/20C03B23/24
    • B65B7/00C03C27/06H01L21/50H01L51/5246
    • A method for manufacturing a hermetically sealed package is provided, the method comprising the steps of: using a laser to heat a frit, disposed in a pattern between two substrates, such that the heated frit forms a hermetic seal which connects the substrates and further comprising: directing the laser to enter the frit pattern, then to trace the frit pattern, then to retrace a portion of the frit pattern, and then to exit the frit pattern; and selecting an initial laser power which, when the laser enters the frit pattern, is insufficient to heat the frit to form a hermetic seal; then increasing the laser power over a first section of the frit pattern to a target laser power at least sufficient to heat the frit to form a hermetic seal; and then decreasing the laser power over a second section of the frit pattern until the laser power is insufficient to heat the frit to form a hermetic seal before the laser exits the frit pattern.
    • 提供了一种用于制造密封包装的方法,所述方法包括以下步骤:使用激光加热设置在两个基板之间的图案的玻璃料,使得加热的玻璃料形成连接基板的气密密封件,并且还包括 :引导激光进入玻璃料图案,然后跟踪玻璃料图案,然后回扫玻璃料图案的一部分,然后退出玻璃料图案; 以及选择当激光进入玻璃料图案时的初始激光功率不足以加热玻璃料以形成气密密封; 然后将玻璃料图案的第一部分上的激光功率增加至至少足以加热玻璃料以形成气密密封的目标激光功率; 然后在玻璃料图案的第二部分上降低激光功率,直到激光功率不足以加热玻璃料以在激光器离开玻璃料图案之前形成气密密封。
    • 8. 发明授权
    • Mobile elevator transporter for semi-automatic wafer transfer
    • 用于半自动晶片转移的移动电梯运输机
    • US06685419B2
    • 2004-02-03
    • US09901744
    • 2001-07-10
    • Christopher John Bayne
    • Christopher John Bayne
    • B65G4907
    • H01L21/67781H01L21/67769Y10S414/14
    • A portable assembly allows semiconductor wafer boats to be transported safely from one semiconductor processing device to another semiconductor processing device at low cost using a small amount of the fabrication area without the need for complicated automated systems. The portable assembly includes two hollow bodies, of which one body may be elevated electromechanically to the height of a cantilever oven opening. The elevation may be conducted manually or automatically. The upper body of the assembly contains a rotating drum which further includes four segmented cylinders, which store and queue the wafer boats. The lower body contains a safety shoe locking apparatus which allows the elevator mechanism to be activated only when the assembly is docked in the appropriate location. The assembly also contains storage areas for wafers in progress. The assembly is moved manually on a set of wheels and may be rotated about its axis.
    • 便携式组件允许使用少量的制造区域将半导体晶片舟从一个半导体处理装置安全地运输到另一个半导体处理装置,而不需要复杂的自动化系统。 便携式组件包括两个中空体,其中一个主体可机电地升高到悬臂式烤箱开口的高度。 海拔可以手动或自动进行。 组件的上部主体包括旋转滚筒,该旋转滚筒还包括四个分段的滚筒,其存储和排列晶片舟。 下体包含安全鞋锁定装置,其允许仅当组件对接在适当位置时才启动电梯机构。 组件还包含正在进行晶片的存储区域。 组件在一组轮上手动移动,并且可以围绕其轴线旋转。