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    • 2. 发明授权
    • Semiconductor devices and methods for manufacturing the same
    • 半导体器件及其制造方法
    • US09165935B2
    • 2015-10-20
    • US13533373
    • 2012-06-26
    • Hyun-Woo ChungJiyoung KimYongchul OhSungkwan ChoiYoosang Hwang
    • Hyun-Woo ChungJiyoung KimYongchul OhSungkwan ChoiYoosang Hwang
    • H01L27/108
    • H01L27/10876H01L27/10823
    • A semiconductor device includes a semiconductor substrate including first trenches defining outer sidewalls of a pair of active pillars and a second trench defining opposing inner sidewalls of the pair of active pillars. The second trench may have a bottom surface located at a higher level than bottom surface of the first trench. Auxiliary conductive lines may be disposed in the first trenches to cover and cross the outer sidewalls of the pair of active pillars. A pair of main conductive lines may be disposed in a pair of recessed regions that are laterally recessed from lower portions of the inner sidewalls of the active pillars into the pair of active pillars. A common impurity region may be disposed in the semiconductor substrate under the second trench. Upper impurity regions may be disposed in upper portions of the active pillars.
    • 半导体器件包括半导体衬底,其包括限定一对有源柱的外侧壁的第一沟槽和限定该对有源柱的相对内侧壁的第二沟槽。 第二沟槽可以具有位于比第一沟槽的底表面更高的水平面的底表面。 辅助导线可以设置在第一沟槽中以覆盖并穿过该对活动柱的外侧壁。 一对主导线可以设置在从活动柱的内侧壁的下部侧向凹入一对活动柱的一对凹陷区域中。 可以在第二沟槽下方的半导体衬底中设置公共杂质区域。 上部杂质区域可以设置在活性支柱的上部。