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1. 发明申请

US20090283313A1 SMALL FORM FACTOR MOLDED MEMORY CARD AND A METHOD THEREOF 有权
标题翻译：小形状因子模制记忆卡及其方法
公开(公告)号：US20090283313A1
公开(公告)日：2009-11-19
申请号：US12507771
申请日：2009-07-22
申请人： Ben Wei CHEN , Jin S. WANG , David Hong-Dien CHEN
发明人： Ben Wei CHEN , Jin S. WANG , David Hong-Dien CHEN
IPC分类号： H05K1/18 , H01L21/56
CPC分类号： B29C45/14647 , B29C45/14655 , B29C45/14836 , B29C45/2708 , H01L21/565 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/30107 , H05K1/117 , H05K3/284 , H05K2201/10159 , H05K2201/10689 , H05K2201/10734 , H05K2203/1311 , H05K2203/1316 , H05K2203/304 , H01L2924/00014 , H01L2924/00
摘要： A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is located on the upper surface of the circuit substrate and electrically connected with the circuit layer. The encapsulant covering is formed by using a mold to press encapsulant entering at least one encapsulant inlet provided on at least one side surface of the circuit substrate. The encapsulant covering encapsulates all the above components with only the electric contacts exposed. A trace mark of the encapsulant inlet remaining on the encapsulant covering is then cut to obtain a shape-molding structure of memory card with an smooth and intact outer appearance.
摘要翻译：存储卡的形状模制结构包括电路基板，至少一个芯片和密封剂覆盖物。电路基板的上表面和下表面分别具有电路层和多个电触点。芯片位于电路基板的上表面并与电路层电连接。密封剂覆盖物通过使用模具来挤压进入设置在电路基板的至少一个侧表面上的至少一个密封剂入口的密封剂而形成。密封剂覆盖物仅将电触头暴露在外，将所有上述组件封装起来。然后切割保留在密封剂覆盖物上的密封剂入口的痕迹，以获得具有平滑和完整外观的存储卡的形状模制结构。

2. 外观设计

USD333657S Computer 失效
公开(公告)号：USD333657S
公开(公告)日：1993-03-02
申请号：US628729
申请日：1990-12-14
申请人： Jin S. Wang
设计人： Jin S. Wang

3. 发明授权

US4719383A Piezoelectric shear wave resonator and method of making same 失效
标题翻译：压电剪切波谐振器及其制作方法
公开(公告)号：US4719383A
公开(公告)日：1988-01-12
申请号：US913192
申请日：1986-09-30
申请人： Jin S. Wang , Kenneth M. Lakin , Allen R. Landin
发明人： Jin S. Wang , Kenneth M. Lakin , Allen R. Landin
IPC分类号： C23C14/22 , C23C14/34 , C23C14/35 , H01J37/34 , H01L41/24 , H03H3/02 , H01L41/08
CPC分类号： C23C14/3435 , C23C14/225 , C23C14/35 , H01J37/3408 , H03H3/02
摘要： An acoustic shear wave resonator comprising a piezoelectric film having its C-axis substantially inclined from the film normal such that the shear wave coupling coefficient significantly exceeds the longitudinal wave coupling coefficient, whereby the film is capable of shear wave resonance, and means for exciting said film to resonate. The film is prepared by deposition in a dc planar magnetron sputtering system to which a supplemental electric field is applied. The resonator structure may also include a semiconductor material having a positive temperature coefficient of resonance such that the resonator has a temperature coefficient of resonance approaching 0 ppm/.degree.C.
摘要翻译：一种声剪切波谐振器，其特征在于，包括：压电薄膜，其C轴基本上从膜垂直地倾斜，使得剪切波耦合系数显着超过纵波耦合系数，由此该薄膜能够进行剪切波共振，以及用于激发所述电影引起共鸣。该膜通过在施加补充电场的直流平面磁控溅射系统中沉积来制备。谐振器结构还可以包括具有正温度谐振系数的半导体材料，使得谐振器的谐振温度系数接近0ppm /℃。

4. 发明授权

US07989268B2 Small form factor molded memory card and a method thereof 有权
标题翻译：小型造型存储卡及其方法
公开(公告)号：US07989268B2
公开(公告)日：2011-08-02
申请号：US12507771
申请日：2009-07-22
申请人： Ben Wei Chen , Jin S. Wang , David Hong-Dien Chen
发明人： Ben Wei Chen , Jin S. Wang , David Hong-Dien Chen
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L23/02 , H01L23/34 , H01L29/68
CPC分类号： B29C45/14647 , B29C45/14655 , B29C45/14836 , B29C45/2708 , H01L21/565 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/30107 , H05K1/117 , H05K3/284 , H05K2201/10159 , H05K2201/10689 , H05K2201/10734 , H05K2203/1311 , H05K2203/1316 , H05K2203/304 , H01L2924/00014 , H01L2924/00
摘要： A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is located on the upper surface of the circuit substrate and electrically connected with the circuit layer. The encapsulant covering is formed by using a mold to press encapsulant entering at least one encapsulant inlet provided on at least one side surface of the circuit substrate. The encapsulant covering encapsulates all the above components with only the electric contacts exposed. A trace mark of the encapsulant inlet remaining on the encapsulant covering is then cut to obtain a shape-molding structure of memory card with an smooth and intact outer appearance.
摘要翻译：存储卡的形状模制结构包括电路基板，至少一个芯片和密封剂覆盖物。电路基板的上表面和下表面分别具有电路层和多个电触点。芯片位于电路基板的上表面并与电路层电连接。密封剂覆盖物通过使用模具来挤压进入设置在电路基板的至少一个侧表面上的至少一个密封剂入口的密封剂而形成。密封剂覆盖物仅将电触头暴露在外，将所有上述组件封装起来。然后切割保留在密封剂覆盖物上的密封剂入口的痕迹，以获得具有平滑和完整外观的存储卡的形状模制结构。

5. 发明授权

US4640756A Method of making a piezoelectric shear wave resonator 失效
标题翻译：制造压电剪切波谐振器的方法
公开(公告)号：US4640756A
公开(公告)日：1987-02-03
申请号：US736164
申请日：1985-05-20
申请人： Jin S. Wang , Kenneth M. Lakin , Allen R. Landin
发明人： Jin S. Wang , Kenneth M. Lakin , Allen R. Landin
IPC分类号： C23C14/22 , C23C14/34 , C23C14/35 , H01J37/34 , H01L41/24 , H03H3/02 , C23C14/38
CPC分类号： C23C14/3435 , C23C14/225 , C23C14/35 , H01J37/3408 , H01L41/316 , H03H3/02
摘要： An acoustic shear wave resonator comprising a piezoelectric film having its C-axis substantially inclined from the film normal such that the shear wave coupling coefficient significantly exceeds the longitudinal wave coupling coefficient, whereby the film is capable of shear wave resonance, and means for exciting said film to resonate. The film is prepared by deposition in a dc planar magnetron sputtering system to which a supplemental electric field is applied. The resonator structure may also include a semiconductor material having a positive temperature coefficient of resonance such that the resonator has a temperature coefficient of resonance approaching 0 ppm/.degree.C.
摘要翻译：一种声剪切波谐振器，其特征在于，包括：压电薄膜，其C轴基本上从膜垂直地倾斜，使得剪切波耦合系数显着超过纵波耦合系数，由此该薄膜能够进行剪切波共振，以及用于激发所述电影引起共鸣。该膜通过在施加补充电场的直流平面磁控溅射系统中沉积来制备。谐振器结构还可以包括具有正温度谐振系数的半导体材料，使得谐振器的谐振温度系数接近0ppm /℃。

6. 发明授权

US07601563B2 Small form factor molded memory card and a method thereof 有权
标题翻译：小型造型存储卡及其方法
公开(公告)号：US07601563B2
公开(公告)日：2009-10-13
申请号：US11624615
申请日：2007-01-18
申请人： Ben Wei Chen , Jin S. Wang , David Hong-Dien Chen
发明人： Ben Wei Chen , Jin S. Wang , David Hong-Dien Chen
IPC分类号： H01L21/50 , H01L21/48 , H01L21/44 , H01L23/02 , H01L23/34 , H01L29/68
CPC分类号： B29C45/14647 , B29C45/14655 , B29C45/14836 , B29C45/2708 , H01L21/565 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/30107 , H05K1/117 , H05K3/284 , H05K2201/10159 , H05K2201/10689 , H05K2201/10734 , H05K2203/1311 , H05K2203/1316 , H05K2203/304 , H01L2924/00014 , H01L2924/00
摘要： A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is located on the upper surface of the circuit substrate and electrically connected with the circuit layer. The encapsulant covering is formed by using a mold to press encapsulant entering at least one encapsulant inlet provided on at least one side surface of the circuit substrate. The encapsulant covering encapsulates all the above components with only the electric contacts exposed. A trace mark of the encapsulant inlet remaining on the encapsulant covering is then cut to obtain a shape-molding structure of memory card with an smooth and intact outer appearance.
摘要翻译：存储卡的形状模制结构包括电路基板，至少一个芯片和密封剂覆盖物。电路基板的上表面和下表面分别具有电路层和多个电触点。芯片位于电路基板的上表面并与电路层电连接。密封剂覆盖物通过使用模具来挤压进入设置在电路基板的至少一个侧表面上的至少一个密封剂入口的密封剂而形成。密封剂覆盖物仅将电触头暴露在外，将所有上述组件封装起来。然后切割保留在密封剂覆盖物上的密封剂入口的痕迹，以获得具有平滑和完整外观的存储卡的形状模制结构。

7. 发明授权

US5547077A Compact disk display and storage package 失效
标题翻译：紧凑型磁盘显示和存储包
公开(公告)号：US5547077A
公开(公告)日：1996-08-20
申请号：US386750
申请日：1995-02-10
申请人： Jin S. Wang
发明人： Jin S. Wang
IPC分类号： B65D85/57 , G11B33/04
CPC分类号： B65D85/548 , G11B33/0461
摘要： A package for the storage and display of products such as video game cartridges and compact disks. The package consists of an elongated strip of transparent flexible plastic or similar material having a series of pockets or pouches attached to the the strip. The package may be hung from a hole at one end of the strip to display the contents of each of the pockets, the pockets all opening upwards towards the end of the strip from which the package is hung. The strip includes hinging portions between the pockets so that the cartridges or disks in the pockets can be folded together, in a zig-zag or accordion fashion to form a compact stack. When folded into a stack, a flap at one end of the strip may be folded over one side of the stack and fastened to the other end of the strip so as to hold the cartridges or disks in place in the stack, but at the same time allowing the side of the stack opposite to the flap to be opened so that the cartridges or disks can be examined one at a time, in a manner similar to opening a book, one page at a time.
摘要翻译：用于存储和显示视频游戏盒和光盘等产品的包装。该包装由细长的透明柔性塑料条或类似材料组成，其具有连接到条带上的一系列袋或袋。包装可以从条的一端的孔悬挂以显示每个袋的内容物，所述袋全部朝向从包装悬挂的带的端部朝上开口。该条带包括凹穴之间的铰接部分，使得口袋中的墨盒或圆盘可以以锯齿形或手风琴的方式折叠在一起以形成紧凑的叠层。当折叠成堆叠时，条带的一端处的折片可以折叠在堆叠的一侧上并且紧固到条带的另一端，以便将盒或盘保持在堆叠中的适当位置，但是在相同的位置允许打开与折板相对的堆叠的一侧的时间，使得可以以类似于打开书籍的方式一次一个地检查盒或盘，一次一页。

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