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    • 2. 发明授权
    • PHEMT structure having recessed ohmic contact and method for fabricating same
    • 具有凹陷欧姆接触的PHEMT结构及其制造方法
    • US07550785B1
    • 2009-06-23
    • US11293348
    • 2005-12-02
    • Jerod F. MasonDylan C. Bartle
    • Jerod F. MasonDylan C. Bartle
    • H01L29/08
    • H01L29/41766H01L29/205H01L29/452H01L29/66462H01L29/7787
    • According to an exemplary embodiment, a PHEMT (pseudomorphic high electron mobility transistor) structure includes a conductive channel layer. The PHEMT structure further includes at least one doped layer situated over the conductive channel layer. The at least one doped layer can include a heavily doped layer situated over a lightly doped layer. The PHEMT structure further includes a recessed ohmic contact situated on the conductive channel layer, where the recessed ohmic contact is situated in a source/drain region of the PHEMT structure, and where the recessed ohmic contact extends below the at least one doped layer. According to this exemplary embodiment, the recessed ohmic contact is bonded to the conductive channel layer. The recessed ohmic contact is situated adjacent to the at least one doped layer. The PHEMT structure further includes a spacer layer situated between the at least one doped layer and the conductive channel layer.
    • 根据示例性实施例,PHEMT(伪晶体高电子迁移率晶体管)结构包括导电沟道层。 PHEMT结构还包括位于导电沟道层上方的至少一个掺杂层。 所述至少一个掺杂层可以包括位于轻掺杂层上的重掺杂层。 PHEMT结构还包括位于导电沟道层上的凹陷欧姆接触,其中凹陷欧姆接触位于PHEMT结构的源极/漏极区域中,并且其中凹陷欧姆接触延伸到至少一个掺杂层下方。 根据该示例性实施例,凹入的欧姆接触被接合到导电沟道层。 凹陷的欧姆接触位于至少一个掺杂层附近。 PHEMT结构还包括位于至少一个掺杂层和导电沟道层之间的间隔层。
    • 8. 发明授权
    • Method for fabricating a recessed ohmic contact for a PHEMT structure
    • 制造用于PHEMT结构的凹陷欧姆接触的方法
    • US07678629B1
    • 2010-03-16
    • US11827001
    • 2007-07-09
    • Jerod F. MasonDylan C. Bartle
    • Jerod F. MasonDylan C. Bartle
    • H01L21/338
    • H01L29/41766H01L29/205H01L29/452H01L29/66462H01L29/7787
    • According to an exemplary embodiment, a PHEMT (pseudomorphic high electron mobility transistor) structure includes a conductive channel layer. The PHEMT structure further includes at least one doped layer situated over the conductive channel layer. The at least one doped layer can include a heavily doped layer situated over a lightly doped layer. The PHEMT structure further includes a recessed ohmic contact situated on the conductive channel layer, where the recessed ohmic contact is situated in a source/drain region of the PHEMT structure, and where the recessed ohmic contact extends below the at least one doped layer. According to this exemplary embodiment, the recessed ohmic contact is bonded to the conductive channel layer. The recessed ohmic contact is situated adjacent to the at least one doped layer. The PHEMT structure further includes a spacer layer situated between the at least one doped layer and the conductive channel layer.
    • 根据示例性实施例,PHEMT(伪晶体高电子迁移率晶体管)结构包括导电沟道层。 PHEMT结构还包括位于导电沟道层上方的至少一个掺杂层。 所述至少一个掺杂层可以包括位于轻掺杂层上的重掺杂层。 PHEMT结构还包括位于导电沟道层上的凹陷欧姆接触,其中凹陷欧姆接触位于PHEMT结构的源极/漏极区域中,并且其中凹陷欧姆接触延伸到至少一个掺杂层下方。 根据该示例性实施例,凹入的欧姆接触被接合到导电沟道层。 凹陷的欧姆接触位于至少一个掺杂层附近。 PHEMT结构还包括位于至少一个掺杂层和导电沟道层之间的间隔层。