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    • 1. 发明授权
    • Apparatus for supplying gas used in semiconductor processing
    • 用于供应用于半导体加工的气体的设备
    • US06506255B2
    • 2003-01-14
    • US10059209
    • 2002-01-31
    • Jeong-Ju Kim
    • Jeong-Ju Kim
    • C23C1600
    • C23C16/45565C23C16/45587H01J37/3244H01L21/67017
    • A method and apparatus for uniformly supplying a gas into a chamber through a dispersion head. The gas is introduced through an inlet of the dispersion head, and flows in a flow direction toward a first diffuser arranged in the dispersion head. The gas is diffused a first time within the dispersion head by dispersing the gas along side directions different than the flow direction by contacting the gas and the first diffuser. A portion of the first diffused gas is guided through an outlet of the dispersion head and toward a work piece arranged in a chamber. A remaining portion of the first diffused gas is diffused a second time by contacting the gas and a second diffuser disposed between the first diffuser and the work piece, by dispersing the gas along side directions different than the flow direction. A portion of the twice diffused gas is guided through the outlet of the dispersion head and toward the work piece arranged in the chamber.
    • 一种通过分散头将气体均匀地供应到室中的方法和装置。 气体通过分散头的入口被引入,并且沿流动方向朝配置在分散头中的第一扩散器流动。 通过使气体与第一扩散器接触,通过沿着与流动方向不同的侧方向分散气体,在分散头内分散气体。 第一扩散气体的一部分被引导通过分散头的出口并且朝向布置在腔室中的工件。 第一扩散气体的剩余部分通过使气体与设置在第一扩散器和工件之间的第二扩散器接触,通过沿着与流动方向不同的侧面方向分散气体而第二次扩散。 两次扩散气体的一部分被引导通过分散头的出口并且朝向布置在腔室中的工件。