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1. 发明授权

US07401549B2 Arrangement for transferring information/structures to wafers 有权
标题翻译：将信息/结构转移到晶圆的安排
公开(公告)号：US07401549B2
公开(公告)日：2008-07-22
申请号：US10802618
申请日：2004-03-17
申请人： Jens Staecker , Uwe Bruch , Heiko Hommen
发明人： Jens Staecker , Uwe Bruch , Heiko Hommen
IPC分类号： B41F19/02
CPC分类号： B82Y10/00 , B81C99/009 , B82Y40/00 , G03F7/0002 , G03F9/00 , H01L21/0271
摘要： An arrangement for transferring information/structures to wafers uses a stamp on which the information/structures to be transferred have been applied as elevated structures. The wafer is fixed on a chuck and is provided with a plastically deformable auxiliary patterning layer. In various implementations, the dimensions of the stamp approximately correspond to those of the wafer, the stamp is provided with the elevated structures essentially over the whole area, and/or the stamp and the wafer are in each case provided with mutually assigned pairs of alignment marks in such a way that the stamp can be positioned in a predetermined position on the wafer by means of an infrared positioning system and can be pressed into the plastically deformable auxiliary patterning layer.
摘要翻译：用于将信息/结构传送到晶片的布置使用将要传送的信息/结构作为升高结构应用的印记。将晶片固定在卡盘上并且设置有可塑性变形的辅助图案形成层。在各种实施方式中，印模的尺寸大致对应于晶片的尺寸，印模具有基本上在整个区域上的升高的结构，和/或印模和晶片在每种情况下都具有相互分配的对准对标记以这样的方式使得印模可以通过红外定位系统定位在晶片上的预定位置，并且可以被压入可塑性变形的辅助图案形成层中。

2. 发明申请

US20090168034A1 Methods and Apparatus of Manufacturing a Semiconductor Device 审中-公开
标题翻译：制造半导体器件的方法和装置
公开(公告)号：US20090168034A1
公开(公告)日：2009-07-02
申请号：US11966978
申请日：2007-12-28
申请人： Jens Staecker , Patrick Lomtscher
发明人： Jens Staecker , Patrick Lomtscher
IPC分类号： G03B27/42
CPC分类号： G03F7/70633
摘要： Methods and apparatus of manufacturing a semiconductor device are provided. Embodiments regard producing a first pattern in a first layer of a semiconductor substrate, producing a second pattern in a second layer of the semiconductor substrate, and matching the first pattern and the second pattern. The matching includes determining a mismatch between the first pattern and the second pattern that would occur without the matching and precorrecting the mismatch in the first layer.
摘要翻译：提供制造半导体器件的方法和装置。实施例涉及在半导体衬底的第一层中产生第一图案，在半导体衬底的第二层中产生第二图案，并且匹配第一图案和第二图案。匹配包括确定在不匹配和预校正第一层中的不匹配的情况下将发生的第一图案和第二图案之间的不匹配。

3. 发明申请

US20080079920A1 Wafer exposure device and method 审中-公开
标题翻译：晶圆曝光装置及方法
公开(公告)号：US20080079920A1
公开(公告)日：2008-04-03
申请号：US11541400
申请日：2006-09-29
申请人： Heiko Hommen , Norman Birnstein , Karl Schumacher , Jens Staecker
发明人： Heiko Hommen , Norman Birnstein , Karl Schumacher , Jens Staecker
IPC分类号： G03B27/52
CPC分类号： G03F7/7085 , G03F9/7026 , G03F9/7088 , H01L21/681
摘要： A wafer exposure device includes a wafer stage. An optical exposure system exposes a wafer on the wafer stage. A sensor block measures a distance to a wafer provided on the wafer stage. The sensor block includes a plurality of height level sensors. Each height level sensor measures and outputs height level values. The wafer exposure device compares with one another the measured height level values outputted by respective height level sensors. The wafer exposure device calculates individual sensor position offset values to be attributed to the individual height level sensors. The wafer exposure device corrects the measured height level values output by the respective height level sensors using the calculated sensor position offset values of the respective height level sensor.
摘要翻译：晶片曝光装置包括晶片台。光学曝光系统在晶片台上露出晶片。传感器块测量到设置在晶片台上的晶片的距离。传感器块包括多个高度水平传感器。每个高度传感器测量并输出高度值。晶片曝光装置将相应的高度电平传感器输出的测量高度电平值彼此进行比较。晶片曝光装置计算归因于各个高度传感器的各个传感器位置偏移值。晶片曝光装置使用计算出的相应高度传感器的传感器位置偏移值来校正由各个高度传感器输出的测量高度值。

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