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    • 1. 发明授权
    • Latch-up prevention structure and method for ultra-small high voltage tolerant cell
    • 超小型耐高压电池的锁定防止结构和方法
    • US08823129B2
    • 2014-09-02
    • US12797782
    • 2010-06-10
    • Da-Wei LaiJen-Chou TsengChien-Yuan Lee
    • Da-Wei LaiJen-Chou TsengChien-Yuan Lee
    • H01L27/105H01L27/092H01L29/06H01L27/118
    • H01L27/0921H01L29/0642H01L2027/11892H01L2924/0002H01L2924/00
    • A latch-up prevention structure and method for ultra-small high voltage tolerant cell is provided. In one embodiment, the integrated circuit includes an input and/or output pad, a floating high-voltage n-well (HVNW) connected to the input and/or output pad through a P+ in the floating HVNW and also connected to a first voltage supply, a low-voltage n-well (LVNW) connected to a second voltage supply through a N+ in the LVNW, a HVNW control circuit, and a guard-ring HVNW, where the first voltage supply has higher voltage level than the second voltage supply, guard-ring HVNW is inserted in between the floating HVNW and LVNW to prevent a latch-up path between a P+ in HVNW and N+ in LVNW by using the HVNW control circuit that controls the guard-ring HVNW's voltage level. The guard-ring HVNW's voltage level is matched by the floating HVNW's voltage level.
    • 提供了一种用于超小型高耐压单元的闭锁预防结构和方法。 在一个实施例中,集成电路包括通过浮动HVNW中的P +连接到输入和/或输出焊盘的输入和/或输出焊盘,浮动高压n阱(HVNW),并且还连接到第一电压 提供通过LVNW中的N +连接到第二电压源的低电压n阱(LVNW),HVNW控制电路和保护环HVNW,其中第一电压源具有比第二电压更高的电压电平 电源,保护环HVNW插入在浮动HVNW和LVNW之间,以防止HVNW中的P +与LVNW中的N +之间的闩锁路径,通过使用控制保护环HVNW的电压电平的HVNW控制电路。 保护环HVNW的电压电平与浮动HVNW的电压电平相匹配。
    • 2. 发明授权
    • Vertical BJT and SCR for ESD
    • 垂直BJT和SCR用于ESD
    • US08809905B2
    • 2014-08-19
    • US13339189
    • 2011-12-28
    • Wun-Jie LinChing-Hsiung LoJen-Chou Tseng
    • Wun-Jie LinChing-Hsiung LoJen-Chou Tseng
    • H01L29/66
    • H01L27/0262H01L29/732H01L29/74
    • An electrostatic discharge (ESD) protection device includes a well region formed from semiconductor material with a first doping type and a floating base formed from semiconductor material with a second doping type. The floating base is disposed vertically above the well region. The ESD also includes a first terminal receiving region formed from semiconductor material with a third doping type. The first terminal receiving region is disposed vertically above the floating base. The ESD further includes a second terminal receiving region. The second terminal receiving region is laterally spaced apart from the first terminal receiving region by silicon trench isolation (STI) region. In some embodiments, the second terminal receiving region is formed from semiconductor material with the third doping type to form a bipolar junction transmitter (BJT) or with a fourth doping type to form a silicon controlled rectifier (SCR).
    • 静电放电(ESD)保护装置包括由具有第一掺杂类型的半导体材料和由具有第二掺杂类型的半导体材料形成的浮动基底形成的阱区。 浮动底座垂直设置在井区域上方。 ESD还包括由具有第三掺杂类型的半导体材料形成的第一端子接收区域。 第一端子接收区域垂直设置在浮动基座上方。 ESD还包括第二终端接收区域。 第二端子接收区域通过硅沟槽隔离(STI)区域与第一端子接收区域横向间隔开。 在一些实施例中,第二端子接收区域由具有第三掺杂类型的半导体材料形成以形成双极结发送器(BJT)或具有第四掺杂类型以形成可控硅整流器(SCR)。
    • 4. 发明授权
    • Fast turn on silicon controlled rectifiers for ESD protection
    • 快速开启可控硅整流器,实现ESD保护
    • US08692289B2
    • 2014-04-08
    • US13558154
    • 2012-07-25
    • Yu-Ti SuTzu-Heng ChangJen-Chou TsengMing-Hsiang Song
    • Yu-Ti SuTzu-Heng ChangJen-Chou TsengMing-Hsiang Song
    • H01L29/74H01L31/111H02H3/00H02H7/00H02H9/02
    • H01L27/0817H01L27/0262H01L29/7436
    • Fast turn on silicon controlled rectifiers for ESD protection. A semiconductor device includes a semiconductor substrate of a first conductivity type; a first well of a second conductivity type; a second well of the second conductivity type; a first diffused region of the first conductivity type and coupled to a first terminal; a first diffused region of the second conductivity type; a second diffused region of the first conductivity type; a second diffused region of the second conductivity type in the second well; wherein the first diffused region of the first conductivity type and the first diffused region of the second conductivity type form a first diode, and the second diffused region of the first conductivity type and the second diffused region of the second conductivity type form a second diode, and the first and second diodes are series coupled between the first terminal and the second terminal.
    • 快速开启可控硅整流器,实现ESD保护。 半导体器件包括第一导电类型的半导体衬底; 第二导电类型的第一阱; 第二导电类型的第二阱; 第一导电类型的第一扩散区域并耦合到第一端子; 第二导电类型的第一扩散区域; 第一导电类型的第二扩散区域; 第二导电类型的第二扩散区域; 其中第一导电类型的第一扩散区域和第二导电类型的第一扩散区域形成第一二极管,并且第一导电类型的第二扩散区域和第二导电类型的第二扩散区域形成第二二极管, 并且第一和第二二极管串联耦合在第一端子和第二端子之间。
    • 6. 发明申请
    • Fast Turn On Silicon Controlled Rectifiers for ESD Protection
    • 快速开启用于ESD保护的硅控整流器
    • US20140027815A1
    • 2014-01-30
    • US13558154
    • 2012-07-25
    • Yu-Ti SuTzu-Heng ChangJen-Chou TsengMing-Hsiang Song
    • Yu-Ti SuTzu-Heng ChangJen-Chou TsengMing-Hsiang Song
    • H01L27/06H01L21/8222
    • H01L27/0817H01L27/0262H01L29/7436
    • Fast turn on silicon controlled rectifiers for ESD protection. A semiconductor device includes a semiconductor substrate of a first conductivity type; a first well of a second conductivity type; a second well of the second conductivity type; a first diffused region of the first conductivity type and coupled to a first terminal; a first diffused region of the second conductivity type; a second diffused region of the first conductivity type; a second diffused region of the second conductivity type in the second well; wherein the first diffused region of the first conductivity type and the first diffused region of the second conductivity type form a first diode, and the second diffused region of the first conductivity type and the second diffused region of the second conductivity type form a second diode, and the first and second diodes are series coupled between the first terminal and the second terminal.
    • 快速开启可控硅整流器,实现ESD保护。 半导体器件包括第一导电类型的半导体衬底; 第二导电类型的第一阱; 第二导电类型的第二阱; 第一导电类型的第一扩散区域并耦合到第一端子; 第二导电类型的第一扩散区域; 第一导电类型的第二扩散区域; 第二导电类型的第二扩散区域; 其中第一导电类型的第一扩散区域和第二导电类型的第一扩散区域形成第一二极管,并且第一导电类型的第二扩散区域和第二导电类型的第二扩散区域形成第二二极管, 并且第一和第二二极管串联耦合在第一端子和第二端子之间。
    • 7. 发明申请
    • ESD PROTECTION DEVICE
    • ESD保护装置
    • US20080258223A1
    • 2008-10-23
    • US11775614
    • 2007-07-10
    • Jen-Chou Tseng
    • Jen-Chou Tseng
    • H01L23/62
    • H01L27/0255H01L29/8618
    • An ESD protection device is provided. The ESD protection device of the present invention includes a semiconductor substrate/well, a first doped region, a second doped region and a third doped region. The first doped region doped with a first dopant is disposed in the semiconductor substrate/well. The second doped region doped with a second dopant is disposed in the semiconductor substrate/well, wherein a predetermined distance is maintained between the second doped region and the first doped region. The third doped region doped with the second dopant is disposed in the first doped region. The ESD protection device of the present invention is adapted for solving the reverse recovery problem of the conventional diode during the bipolar type ESD stressing.
    • 提供ESD保护装置。 本发明的ESD保护器件包括半导体衬底/阱,第一掺杂区,第二掺杂区和第三掺杂区。 掺杂有第一掺杂剂的第一掺杂区域设置在半导体衬底/阱中。 掺杂有第二掺杂剂的第二掺杂区域设置在半导体衬底/阱中,其中在第二掺杂区域和第一掺杂区域之间保持预定距离。 掺杂有第二掺杂剂的第三掺杂区域设置在第一掺杂区域中。 本发明的ESD保护器件适用于在双极型ESD应力期间解决传统二极管的反向恢复问题。
    • 9. 发明申请
    • SILICON CONTROLLED RECTIFIER
    • 硅控整流器
    • US20050224836A1
    • 2005-10-13
    • US10711542
    • 2004-09-24
    • Jen-Chou Tseng
    • Jen-Chou Tseng
    • H01L23/60H01L27/02H01L29/32H01L29/68H01L29/74
    • H01L27/0262H01L29/7436
    • A silicon controlled rectifier is provided, including: a first conducting-type substrate; two second conducting-type deep wells separately disposed inside the first conducting-type substrate; a gate above the first conducting-type substrate and between the two second conducting-type deep wells; a first source/drain inside one of the two second conducting-type deep wells and at one side of the gate; a second source/drain inside the other of the two second conducting-type deep wells and at the other side of the gate; a first conducting-type doped region inside the first conducting-type substrate; and a first conducting-type doped floating region inside the one of the two second conducting-type deep wells and adjacent to the first source/drain. The first conducting-type doped floating region and the first source/drain constitute an equivalent Zener diode so that the modified silicon controlled rectifier can have a higher holding voltage.
    • 提供一种可控硅整流器,包括:第一导电型衬底; 分别设置在第一导电型基板内的两个第二导电型深阱; 在第一导电型衬底之上和两个第二导电类型深阱之间的栅极; 在两个第二导电类型深阱之一和栅极一侧的一个内的第一源极/漏极; 两个第二导电类型深阱的另一个内部的第二源极/漏极,以及栅极的另一侧; 第一导电型衬底内的第一导电型掺杂区; 以及在所述两个第二导电类型深阱中的一个内部并且与所述第一源极/漏极相邻的第一导电型掺杂漂浮区域。 第一导电型掺杂浮置区和第一源极/漏极构成等效的齐纳二极管,使得改进的可控硅整流器可以具有较高的保持电压。