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    • 1. 发明授权
    • Electronic circuit packages
    • 电子电路封装
    • US07820919B2
    • 2010-10-26
    • US10535684
    • 2004-12-06
    • Jeffrey PowellRoger ApplebyMark T Moore
    • Jeffrey PowellRoger ApplebyMark T Moore
    • H05K9/00
    • H01L23/552H01L23/24H01L2924/1423H01L2924/1616H01L2924/16195H01L2924/3011
    • This invention relates to electronic circuit packages designed to hold high frequency circuits operating particularly, but not exclusively, in the microwave, millimeter wave, and sub-millimeter wave bands. The invention provides a package incorporating a cavity in a material for containment of the circuits, wherein the package further incorporates at least one conductive surface mounted on an inner surface extending into the cavity, the conductivity thereof being adapted to be at least partially absorbent to electromagnetic radiation. The conductive surface according to the present invention will tend to attenuate electromagnetic radiation present within the cavity, and so help to prevent undesired coupling from one point to another within the cavity. The conductivity of the conductive material is preferably arranged to match the impedance of the radiation mode estimated or computed to be present within the cavity.
    • 本发明涉及设计用于保持特别但非排他地在微波,毫米波和亚毫米波段中工作的高频电路的电子电路封装。 本发明提供一种将包含在用于容纳电路的材料中的空腔的封装,其中所述封装还包括安装在延伸到所述腔中的内表面上的至少一个导电表面,其导电性适于至少部分地吸收到电磁 辐射。 根据本发明的导电表面将倾向于衰减腔内存在的电磁辐射,并且因此有助于防止在空腔内从一个点到另一个点的不期望的耦合。 优选地,导电材料的导电性被布置成使估计或计算出的存在于腔内的辐射模式的阻抗匹配。
    • 4. 发明授权
    • Methods and systems for gas treatment
    • 气体处理方法和系统
    • US5271557A
    • 1993-12-21
    • US866888
    • 1992-04-02
    • R. Larry LynchJeffrey Powell
    • R. Larry LynchJeffrey Powell
    • B01D53/04B01D53/26B01F3/02B01F15/00B09C1/00B01D3/42G05D22/00
    • B09C1/005B01D53/0454B01D53/26B01F15/00175B01F15/00207B01F3/026
    • The present invention provides a process for decreasing the relative humidity of a gaseous or vaporous process stream, while increasing the temperature thereof. A preferred embodiment of the process of the present invention is implemented using a bleed valve, a positive displacement blower located downstream therefrom, and a control mechanism for opening and closing the bleed valve. When opened, the bleed valve preferably permits ambient air to admix with the gaseous process feed stream to form the blower feed stream. Increased blower gas throughput results in a lower magnitude gas temperature increase across the blower. The control mechanism used in the practice of the present invention involves monitoring the temperature of the blower effluent (or the gaseous feed to a downstream unit operation), and controlling operation of the bleed valve in accordance with that temperature reading.
    • 本发明提供一种降低气态或蒸气过程流的相对湿度同时增加其温度的方法。 本发明方法的优选实施方案使用排放阀,位于其下游的正排量鼓风机和用于打开和关闭排放阀的控制机构来实现。 当打开时,排放阀优选地允许环境空气与气态工艺进料流混合以形成鼓风机进料流。 鼓风机气体通量的增加导致鼓风机气体温度升高。 在本发明的实践中使用的控制机构包括监测鼓风机流出物(或下游单元操作的气体进料)的温度,以及根据该温度读数来控制排放阀的操作。