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    • 5. 发明授权
    • Substrate and method of forming substrate for fluid ejection device
    • 用于流体喷射装置的基板的形成基板和方法
    • US06776916B2
    • 2004-08-17
    • US10061514
    • 2002-02-01
    • Jeffery S. Hess
    • Jeffery S. Hess
    • B41J216
    • C23F1/02B41J2/14145B41J2/1603B41J2/1629B41J2/1631
    • A method of forming an opening through a substrate includes etching a first portion of the opening into the substrate from a first side, etching a plurality of second portions of the opening into the substrate from a second side opposite the first side, continued etching of at least one of the first portion and the plurality of second portions of the opening to the other of the first portion and the plurality of second portions of the opening, and overetching each of the second portions of the opening at an interface between the first portion and each of the second portions of the opening, including communicating each of the second portions with an adjacent one of the second portions.
    • 通过基板形成开口的方法包括从第一侧将开口的第一部分蚀刻到基板中,从与第一侧相反的第二侧将开口的多个第二部分蚀刻到基板中,继续蚀刻 开口的第一部分和多个第二部分中的至少一个到开口的第一部分和多个第二部分中的另一个,并且在第一部分和第二部分之间的界面处, 每个开口的第二部分包括使每个第二部分与相邻的一个第二部分连通。