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    • 3. 发明授权
    • Electroless plating method
    • 无电镀法
    • US6093453A
    • 2000-07-25
    • US310884
    • 1999-05-17
    • Jane Ang
    • Jane Ang
    • C23C18/16B05D1/18
    • C23C18/168C23C18/1617C23C18/1619
    • An electroless plating apparatus heats a plating bath solution with precise uniformity and avoids localized high temperatures within the bath. The electroless plating apparatus achieves this performance using two solution tanks included an inner tank nested inside an outer tank. A distributed heating element encases a plurality of surfaces of the outer tank, which contains an ethylene glycol solution. The inner tank contains a plating bath solution. A substrate is placed inside the inner tank for plating. Each of the outer tank and the inner tank include a device for evenly distributing the applied heat. In one embodiment, the outer tank heat distributing device is a pump which mixes the ethylene glycol solution. The inner tank heat distributing device is a pump which recirculates plating bath solution, applying returning solution via a sparger.
    • 无电解电镀装置加热电镀液,精细均匀,避免了浴液内的局部高温。 化学镀设备使用两个溶液罐来实现这一性能,其中包括嵌在外槽内的内罐。 分布式加热元件包围含有乙二醇溶液的外罐的多个表面。 内罐含有镀液溶液。 将基板放置在内槽内用于电镀。 外箱和内罐均设有用于均匀分布施加热量的装置。 在一个实施例中,外罐散热装置是混合乙二醇溶液的泵。 内箱散热装置是一种使电镀液溶液再循环的泵,通过喷射器应用返回的溶液。
    • 4. 发明授权
    • Uniform heat distribution apparatus and method for electroless nickel
plating in fabrication of thin film head gaps
    • 在制造薄膜头间隙时的无电镀镍均匀配热装置和方法
    • US5938845A
    • 1999-08-17
    • US546389
    • 1995-10-20
    • Jane Ang
    • Jane Ang
    • C23C18/16B05C3/00
    • C23C18/168C23C18/1617C23C18/1619
    • An electroless plating apparatus heats a plating bath solution with precise uniformity and avoids localized high temperatures within the bath. The electroless plating apparatus achieves this performance using two solution tanks included an inner tank nested inside an outer tank. A distributed heating element encases a plurality of surfaces of the outer tank, which contains an ethylene glycol solution. The inner tank contains a plating bath solution. A substrate is placed inside the inner tank for plating. Each of the outer tank and the inner tank include a device for evenly distributing the applied heat. In one embodiment, the outer tank heat distributing device is a pump which mixes the ethylene glycol solution. The inner tank heat distributing device is a pump which recirculates plating bath solution, applying returning solution via a sparger.
    • 无电解电镀装置加热电镀液,精细均匀,避免了浴液内的局部高温。 化学镀设备使用两个溶液罐来实现这一性能,其中包括嵌在外槽内的内罐。 分布式加热元件包围含有乙二醇溶液的外罐的多个表面。 内罐含有镀液溶液。 将基板放置在内槽内用于电镀。 外箱和内罐均设有用于均匀分布施加热量的装置。 在一个实施例中,外罐散热装置是混合乙二醇溶液的泵。 内箱散热装置是一种使电镀液溶液再循环的泵,通过喷射器应用返回的溶液。
    • 5. 发明授权
    • Thin film magnetic head including layered magnetic side poles
    • 薄膜磁头包括分层磁极侧极
    • US5748417A
    • 1998-05-05
    • US641345
    • 1996-05-01
    • Arun MalhotraJane AngG. Robert GrayJames Watterston
    • Arun MalhotraJane AngG. Robert GrayJames Watterston
    • G11B5/23G11B5/235G11B5/31G11B5/48G11B5/147
    • G11B5/3133G11B5/3103G11B5/3106G11B5/3116G11B5/313G11B5/3146G11B5/3163G11B5/3183G11B5/488G11B5/232G11B5/235G11B5/3113G11B5/4893
    • A thin film magnetic head is fabricated on a substrate by depositing a seed layer on the substrate. This seed layer is advantageously used as a common seed for a plurality of magnetic head related structures which are built-up on the substrate. A lower magnetic layer is plated on the substrate in an opening provided in an insulative layer which is deposited on the substrate. The aforementioned seed layer is used as the seed for this lower magnetic layer. A plurality of magnetic layers are plated at one end of the lower magnetic layer to build-up and form a first side pole by using the above seed layer as a seed. Another plurality of magnetic layers are plated at the other end of the lower magnetic layer to build-up and form a second side pole by using the same seed layer as a seed. The first and second side poles thus formed include upper and lower ends, the lower ends being plated to the ends of the lower magnetic layer. A first upper pole is plated to the upper end of the first side pole. The first upper pole includes a gap end facing the second side pole. A gap region of nonmagnetic material is deposited adjacent the gap end of the first upper pole. A second upper pole is plated to the upper end of the second side pole and includes a gap end adjacent the gap region.
    • 通过在衬底上沉积种子层,在衬底上制造薄膜磁头。 该种子层有利地用作在基底上积累的多个磁头相关结构的常见种子。 在设置在沉积在基板上的绝缘层中的开口中,在基板上电镀下层磁性层。 上述种子层用作该下层磁性层的种子。 多个磁性层通过使用上述种子层作为种子在下部磁性层的一端进行电镀以形成第一侧极。 另外多个磁性层在下部磁性层的另一端被电镀,以通过使用与种子相同的种子层来形成第二侧极。 这样形成的第一和第二侧极包括上端和下端,下端被电镀到下磁性层的端部。 第一上极被电镀到第一侧极的上端。 第一上极包括面向第二侧极的间隙端。 非磁性材料的间隙区域邻近第一上极的间隙端部沉积。 第二上极被电镀到第二侧极的上端,并且包括邻近间隙区的间隙端。
    • 6. 发明授权
    • Method and system for removing an antiferromagnetic seed structure
    • 去除反铁磁种子结构的方法和系统
    • US08419953B1
    • 2013-04-16
    • US13170491
    • 2011-06-28
    • Wencheng SuZhigang ZhouJane AngMing Jiang
    • Wencheng SuZhigang ZhouJane AngMing Jiang
    • B44C1/22
    • H01L43/12G01R33/09G01R33/093G11B5/3163G11B5/3906G11B5/3929
    • A method for fabricating a transducer on a substrate is described. The transducer includes an antiferromagnetic seed structure. The antiferromagnetic seed structure includes a first NiFe layer, a first multilayer including a first Ru layer, a second NiFe layer, and a second multilayer including a second Ru layer. The second multilayer, the second NiFe layer and part of the first Ru layer are removed using a first wet etch, which uses a first etchant combination to remove NiFe and in which Ru is insoluble. The second Ru layer is removed through lift-off due to etching of the second NiFe layer. A remainder of the first Ru layer is removed through a second wet etch, which uses a second etchant combination to remove Ru. A remaining portion of the first multilayer and the first NiFe layer are removed through a third etch, which uses a third etchant combination that removes NiFe.
    • 描述了在衬底上制造换能器的方法。 换能器包括反铁磁种子结构。 反铁磁种子结构包括第一NiFe层,包括第一Ru层的第一多层,第二NiFe层和包含第二Ru层的第二层。 使用第一湿蚀刻去除第二层,第二NiFe层和第一Ru层的一部分,第一湿法蚀刻使用第一蚀刻剂组合去除NiFe,其中Ru不溶。 由于第二NiFe层的蚀刻,第二Ru层被剥离除去。 通过第二湿蚀刻去除第一Ru层的剩余部分,其使用第二蚀刻剂组合去除Ru。 通过第三蚀刻去除第一多层和第一NiFe层的剩余部分,该蚀刻使用去除NiFe的第三蚀刻剂组合。
    • 8. 发明授权
    • Method of fabricating a thin film magnetic head including layered
magnetic side poles
    • 包括层状磁性侧极的薄膜磁头的制造方法
    • US5673474A
    • 1997-10-07
    • US722702
    • 1996-09-30
    • James WatterstonArun MalhotraG. Robert GrayJane Ang
    • James WatterstonArun MalhotraG. Robert GrayJane Ang
    • G11B5/235G11B5/31G11B5/42
    • G11B5/3133G11B5/3106G11B5/3163G11B5/3183G11B5/235G11B5/3113Y10T29/49044Y10T29/49046Y10T29/49062Y10T29/49064
    • A method is provided for fabricating a thin film magnetic head on a substrate. A seed layer formed on the substrate and advantageously used as a common seed for a plurality of magnetic head related structures which are built-up on the substrate. A lower magnetic layer is plated on the substrate in an opening provided in an insulative layer which is deposited on the substrate. The aforementioned seed layer is used as the seed for the plating of this lower magnetic layer. A plurality of magnetic layers are plated at one end of the lower magnetic layer to build-up and form a first side pole by again using the aforementioned seed layer as a seed. Another plurality of magnetic layers are plated at the other end of the lower magnetic layer to build-up and form a second side pole by using the same seed layer as a seed. The first and second side poles thus formed include upper and lower ends, the lower ends being plated to the ends of the lower magnetic layer. A first upper pole is plated to the upper end of the first side pole. The first upper pole includes a gap end facing the second side pole. A gap region of nonmagnetic material is deposited adjacent the gap end of the first upper pole. A second upper pole is plated to the upper end of the second side pole and includes a gap end adjacent the gap region.
    • 提供了一种在衬底上制造薄膜磁头的方法。 种子层,形成在衬底上并且有利地用作在衬底上积累的多个与磁头相关的结构的共同种子。 在设置在沉积在基板上的绝缘层中的开口中,在基板上电镀下层磁性层。 使用上述种子层作为用于该下部磁性层的电镀的种子。 多个磁性层在下部磁性层的一端被电镀以再次使用上述种子层作为种子来积聚并形成第一侧极。 另外多个磁性层在下部磁性层的另一端被电镀,以通过使用与种子相同的种子层来形成第二侧极。 这样形成的第一和第二侧极包括上端和下端,下端被电镀到下磁性层的端部。 第一上极被电镀到第一侧极的上端。 第一上极包括面向第二侧极的间隙端。 非磁性材料的间隙区域邻近第一上极的间隙端部沉积。 第二上极被电镀到第二侧极的上端,并且包括邻近间隙区的间隙端。