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    • 4. 发明申请
    • ONE-TOUCH TYPE QUICK COUPLER FOR CONNECTING STEEL BARS
    • 用于连接钢筋的单触式快速接头
    • US20140147198A1
    • 2014-05-29
    • US14127200
    • 2012-04-10
    • Hyun Ho KimJae Chang Lee
    • Hyun Ho KimJae Chang Lee
    • E04C5/16
    • E04C5/162E04C5/165E04C5/166F16B2200/10
    • Disclosure relates to a method of sharing a session key between wireless communication terminals using a variable-length authentication code. The method includes: generating a public key by using an own private key; generating a message including the public key and a first random number and encoding the message using an own secret key to exchange an encrypted message with the other terminal; decoding the encrypted message of the other terminal by receiving a secret key of the other terminal; generating an authentication code by calculating the first random number and a second random number included in the decoded message; obtaining a medium value from the authenticated code; and generating a session key by using a public key included in the decoded message of the other terminal.
    • 公开涉及使用可变长度认证码在无线通信终端之间共享会话密钥的方法。 该方法包括:通过使用自己的私钥生成公开密钥; 生成包括所述公开密钥和第一随机数的消息,并使用自己的密钥对所述消息进行编码,以与所述另一终端交换加密消息; 通过接收另一终端的秘密密钥对另一终端的加密消息进行解码; 通过计算解码消息中包含的第一随机数和第二随机数来生成认证码; 从认证代码获取中值; 以及通过使用包括在另一终端的解码消息中的公钥来生成会话密钥。
    • 5. 发明申请
    • PIEZOELECTRIC INKJET PRINTHEAD AND METHOD OF MANUFACTURING THE SAME
    • 压电喷墨印刷机及其制造方法
    • US20100319195A1
    • 2010-12-23
    • US12852613
    • 2010-08-09
    • Jong-beom KimJae-chang Lee
    • Jong-beom KimJae-chang Lee
    • B23P17/00
    • B41J2/1628B41J2/14233B41J2/161B41J2/1631B41J2/1642B41J2/1646Y10T29/49401
    • Provided are a piezoelectric inkjet printhead and a method of manufacturing the same. The piezoelectric inkjet printhead includes first and second single-crystalline silicon substrates. An ink flow path is disposed in a first surface of the first substrate. The ink flow path includes an ink introduction port, a manifold for supplying ink, a plurality of pressure chambers filled with ink to be ejected, a plurality of restrictors for connecting the manifold with the plurality of pressure chambers, respectively, and a plurality of nozzles for ejecting ink. The second substrate is bonded to the first substrate to thereby complete the ink flow path. A plurality of piezoelectric actuators are disposed on a second surface of the first substrate to correspond to each of the pressure chambers and provide drivability required for ejecting ink to the respective pressure chambers. In this construction, aligning the first and second substrates is unnecessary, so that the manufacturing process can be simplified, the manufacturing cost can be reduced, and ink ejecting performance can be improved.
    • 提供一种压电喷墨打印头及其制造方法。 压电喷墨打印头包括第一和第二单晶硅衬底。 墨流路设置在第一基板的第一表面中。 墨水流路包括墨水引入口,用于供应墨水的歧管,填充有待喷射墨水的多个压力室,分别用于将歧管与多个压力室连接的多个限制器,以及多个喷嘴 用于喷墨。 第二基板结合到第一基板,从而完成油墨流动路径。 多个压电致动器设置在第一基板的第二表面上以对应于每个压力室,并提供将油墨喷射到各个压力室所需的驱动能力。 在这种结构中,不需要对准第一和第二基板,从而可以简化制造工艺,可以降低制造成本,并且可以提高喷墨性能。
    • 8. 发明申请
    • Silicon direct bonding method
    • 硅直接键合法
    • US20070155056A1
    • 2007-07-05
    • US11505420
    • 2006-08-17
    • Sung-gyu KangSeung-mo LimJae-chang LeeWoon-bae Kim
    • Sung-gyu KangSeung-mo LimJae-chang LeeWoon-bae Kim
    • H01L21/00
    • H01L21/187H01L21/2007
    • A silicon direct bonding (SDB) method by which void formation caused by gases is suppressed. The SDB method includes: preparing two silicon substrates having corresponding bonding surfaces; forming trenches having a predetermined depth in at least one bonding surface of the two silicon substrates; forming gas discharge outlets connected to the trenches on at least one of the two silicon substrates to vertically penetrate the bonding surface; cleaning the two silicon substrates; closely contacting the two silicon substrates to each other; and thermally treating the two substrates to bond them to each other. The trenches are formed along at least a part of a plurality of dicing lines, and both ends of the trenches are clogged. Gases generated during a thermal treatment process can be smoothly and easily discharged through the trenches and the gas discharge outlet such that a void is prevented from being formed in the junctions of the two silicon substrates due to the gases.
    • 抑制由气体引起的空隙形成的硅直接接合(SDB)方法。 SDB方法包括:制备具有相应粘合表面的两个硅衬底; 在所述两个硅衬底的至少一个接合表面中形成具有预定深度的沟槽; 形成连接到所述两个硅衬底中的至少一个上的沟槽的气体放电出口,以垂直地穿透所述接合表面; 清洁两个硅衬底; 使两个硅衬底彼此紧密接触; 并对两个基板进行热处理以将它们彼此粘合。 沟槽沿着多个切割线的至少一部分形成,并且沟槽的两端被堵塞。 在热处理过程中产生的气体可以通过沟槽和气体排出口平滑且容易地排出,从而防止由于气体而在两个硅衬底的接合处形成空隙。