专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2017532741A 耐環境性が向上された弾性電気接触端子及びその製造方法审中-公开
公开(公告)号：JP2017532741A
公开(公告)日：2017-11-02
申请号：JP2017516940
申请日：2015-07-06
申请人：ジョインセットカンパニーリミテッドJoinset Co.,Ltd. , ジョインセットカンパニーリミテッドJoinset Co.,Ltd. , キムソンギKIM, Sun−Ki , キムソンギKIM, Sun−Ki
发明人：ソンギキム , ソンギキム
IPC分类号： H01R13/24 , H01R11/01 , H01R43/16
CPC分类号： H01R4/625 , H01R4/58 , H01R11/01 , H01R12/57 , H01R13/24 , H01R13/2414 , H01R13/6584 , H01R43/007 , H05K1/11 , H05K3/34 , H05K3/3431 , H05K2201/1031
摘要：弾性コアと、接着剤層を介在して前記コアを包みながら接着されるポリマーフィルムと、前記ポリマーフィルムを包みながら接着されるはんだ付けが可能な銅箔と、を含む弾性電気接触端子が開示される。前記銅箔の外部に露出される全ての面に金属めっき層が形成される。

2. 发明申请

WO2011096682A2 EASILY SOLDERED SHIELD CASE FOR ELECTROMAGNETIC-WAVE SHIELDING 审中-公开
标题翻译：用于电磁波屏蔽的易于焊接的屏蔽壳
公开(公告)号：WO2011096682A2
公开(公告)日：2011-08-11
申请号：PCT/KR2011000624
申请日：2011-01-28
申请人： JOINSET CO LTD , KIM SUN-KI
发明人： KIM SUN-KI
IPC分类号： H05K9/00
CPC分类号： H05K9/0022
摘要： Disclosed is an easily soldered shield case for electromagnetic-wave shielding. The shield case comprises: a metal main body in the shape of a box of which the bottom surface is open; a flange which is formed extending integrally outward or inward from the open edge of the main body; a plurality of through holes formed along the flange or a plurality of recesses formed along the rear surface of the flange; and a solder member which is stably placed on the through holes or the recesses and projects in the thickness direction of the flange, wherein the shield case is mounted on a printed circuit board and the solder member is electrically and mechanically joined to the printed circuit board by means of soldering.
摘要翻译：公开了用于电磁波屏蔽的容易焊接的屏蔽壳。所述屏蔽壳包括：底面形状开口的箱体形式的金属主体; 形成为从主体的开口边缘整体向外或向内延伸的凸缘; 沿凸缘形成的多个通孔或沿凸缘的后表面形成的多个凹槽; 以及焊料部件，其被稳定地放置在所述通孔或所述凹部上并沿着所述凸缘的厚度方向突出，其中所述屏蔽壳体安装在印刷电路板上，并且所述焊接部件电连接和机械地接合到所述印刷电路板通过焊接。

3. 发明申请

WO2005051062A1 MULTI-FUNCTIONAL METAL SHIELD CASE AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：多功能金属屏蔽壳及其制造方法
公开(公告)号：WO2005051062A1
公开(公告)日：2005-06-02
申请号：PCT/KR2004/002792
申请日：2004-11-02
申请人： JOINSET CO., LTD. , KIM, Sun-Ki
发明人： KIM, Sun-Ki
IPC分类号： H05K5/04
CPC分类号： H05K9/0026
摘要： A multi-functional metal shield case and a method for making the same are provided. The multi-functional metal shield case includes a metal main body and an electrically non-conductive and heat conductive silicon layer. The metal main body includes a base and sidewalls integrally bent along edges of the base, and the electrically non-conductive and heat conductive silicon layer is formed on inner sides of the base and the sidewalls. Accordingly, heat can be rapidly transferred to the metal main body and emitted to an outside. Since the heat conductive silicon layer is non-conductive, an electric shock does not occur between the electronic component and the metal shield case. Further, since the heat conductive silicon layer is in contact with the electronic component, heat can be transferred more rapidly.
摘要翻译：提供了一种多功能金属屏蔽壳及其制造方法。多功能金属屏蔽壳体包括金属主体和非导电导热硅层。金属主体包括基部和沿基部的边缘整体弯曲的侧壁，并且导电和导热硅层形成在基部和侧壁的内侧上。因此，能够将热量快速地传递到金属主体并向外部排出。由于导热硅层是不导电的，所以在电子部件和金属屏蔽壳体之间不会发生电击。此外，由于导热硅层与电子部件接触，因此可以更快地传递热量。

4. 发明申请

WO2008010642A1 CERAMIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：陶瓷组件及其制造方法
公开(公告)号：WO2008010642A1
公开(公告)日：2008-01-24
申请号：PCT/KR2007/002413
申请日：2007-05-17
申请人： JOINSET CO., LTD , CHOI, Kwang-Hwi , JO, Seong-Soo , KIM, Sun-Ki
发明人： CHOI, Kwang-Hwi , JO, Seong-Soo , KIM, Sun-Ki
IPC分类号： H01G4/12
CPC分类号： H01C17/06533 , H01C7/008 , H01C7/1006 , H01G4/12 , Y10T29/49085
摘要： Provided are a ceramic component and a method of manufacturing the ceramic component. The ceramic component includes a previously fired insulation ceramic base, a functional ceramic sheet bonded to the insulation ceramic base by a diffusion bonding layer having an anchoring structure, internal electrodes embedded into the functional ceramic sheet, and external electrodes connected to the internal electrodes. A functional ceramic paste corresponding to the functional ceramic sheet is applied to the insulation ceramic base and is dried to form a functional ceramic film. The functional ceramic film is pressed against the insulation ceramic base to anchor functional ceramic film into the insulation ceramic base for sure attachment. The functional ceramic film is fired to allow functional oxide materials included in the functional ceramic film to permeate the insulation ceramic base by solid diffusion to form the diffusion bonding layer and to change the functional ceramic film into the functional ceramic sheet.
摘要翻译：提供陶瓷成分和陶瓷成分的制造方法。陶瓷部件包括预先烧制的绝缘陶瓷基体，通过具有锚定结构的扩散接合层与嵌入功能性陶瓷片的内部电极和连接到内部电极的外部电极接合到绝缘陶瓷基体的功能陶瓷片。将与功能性陶瓷片对应的功能陶瓷膏施加到绝缘陶瓷基体上，并干燥以形成功能陶瓷膜。将功能性陶瓷膜压在绝缘陶瓷基体上，将功能性陶瓷膜锚定到绝缘陶瓷基座中，以确保附着。烧制功能性陶瓷膜，使功能性陶瓷膜中所含的功能性氧化物通过固体扩散渗透绝缘陶瓷基体，形成扩散接合层，将功能陶瓷膜变更为功能性陶瓷片。

5. 发明申请

WO2007105865A1 CERAMIC COMPONENT ELEMENT AND CERAMIC COMPONENT AND METHOD FOR THE SAME 审中-公开
标题翻译：陶瓷组件元件和陶瓷组件及其相同方法
公开(公告)号：WO2007105865A1
公开(公告)日：2007-09-20
申请号：PCT/KR2007/000811
申请日：2007-02-15
申请人： JOINSET CO., LTD , CHOI, Kwang-Hwi , JO, Seong-Soo , KIM, Sun-Ki
发明人： CHOI, Kwang-Hwi , JO, Seong-Soo , KIM, Sun-Ki
IPC分类号： H01C7/02
CPC分类号： H01C7/18 , C04B37/001 , C04B2235/96 , C04B2235/9669 , C04B2237/34 , C04B2237/343 , C04B2237/346 , C04B2237/366 , C04B2237/60 , C04B2237/704 , H01C7/003 , H01C7/008 , H01C17/065 , H01G2/14 , H01G4/12 , H01G4/224 , H01G4/30 , H01G4/33 , Y10T29/49085 , Y10T428/24926
摘要： A ceramic component element is provided. The ceramic component element includes: an insulating ceramic base with pores formed on its surface and previously fired; and a functional ceramic sheet bonded to the insulating ceramic base and having electrical characteristics. The functional ceramic sheet is physically bonded to the insulating ceramic base by forming pressing a green sheet for the functional ceramic sheet on the insulating ceramic base at predetermined temperature and pressure so that parts of the green sheet are forced to put into the pores and anchored, and the functional ceramic sheet is chemically bonded to the insulating ceramic base by firing the anchored green sheet in such a manner that functional oxides of the green sheet penetrate the insulating ceramic base by solid diffusion to form a diffusion bonding layer.
摘要翻译：提供陶瓷元件。陶瓷元件包括：绝缘陶瓷基体，其表面上形成有预先烧制的孔; 和与绝缘陶瓷基体结合并具有电特性的功能陶瓷片。功能陶瓷片通过在绝缘陶瓷基体上以预定的温度和压力形成压制功能性陶瓷片的生片而物理地结合到绝缘陶瓷基底，使得生片的一部分被迫放入孔中并锚定，并且功能性陶瓷片通过以这样的方式烧结锚定的生片以化学方式结合到绝缘陶瓷基底，使得生坯的功能氧化物通过固体扩散渗透绝缘陶瓷基底以形成扩散粘合层。

6. 发明申请

WO2009110653A1 SOLDERABLE ELASTIC ELECTRIC CONTACT TERMINAL 审中-公开
标题翻译：可焊接电气接触端子
公开(公告)号：WO2009110653A1
公开(公告)日：2009-09-11
申请号：PCT/KR2008/002122
申请日：2008-04-15
申请人： JOINSET CO., LTD , KIM, Sun-Ki
发明人： KIM, Sun-Ki
IPC分类号： H05K9/00
CPC分类号： H05K9/0009
摘要： Provided is a solderable elastic electric contact terminal. The elastic electric contact terminal includes an insulating elastic core including a non-foam rubber having a tube shape, an insulating non-foam rubber coating layer adhered to the insulating elastic core such that the insulating non-foam rubber coating layer encloses the insulating elastic core, and a heat resistant polymer film having one side adhered to the insulating non-foam rubber coating layer such that the heat resistant polymer film encloses the insulating non-foam rubber coating layer and another side on which a metal layer is integrally formed.
摘要翻译：提供了可焊接的弹性电接触端子。弹性电接触端子包括绝缘弹性芯，其包括具有管状的非泡沫橡胶，绝缘非泡沫橡胶涂层粘附到绝缘弹性芯，使得绝缘非泡沫橡胶涂层包围绝缘弹性芯以及耐热聚合物膜，其一侧粘附到绝缘非泡沫橡胶涂层，使得耐热性聚合物膜包围绝缘非泡沫橡胶涂层，并且另一侧上金属层整体形成。

7. 发明申请

WO2008088107A1 CONDUCTIVE PRESSURE SENSITIVE ADHESIVE TAPE 审中-公开
标题翻译：导电压力敏感胶带
公开(公告)号：WO2008088107A1
公开(公告)日：2008-07-24
申请号：PCT/KR2007/002421
申请日：2007-05-18
申请人： JOINSET CO., LTD , KIM, Sun-Ki
发明人： KIM, Sun-Ki
IPC分类号： C09J7/02
CPC分类号： C09J9/02 , B32B15/08 , C09J7/29 , C09J2201/20 , C09J2400/163 , C09J2423/006 , C09J2433/00 , C09J2467/006 , C09J2479/086 , C09J2483/00 , Y10T428/218 , Y10T428/28 , Y10T428/2804 , Y10T428/2848
摘要： A conductive pressure sensitive adhesive tape is provided. The conductive pressure sensitive adhesive tape includes a first metal foil, a polymer film attached to a surface of the first metal foil with a polymer binder interposed therebetween, a second metal foil attached to a surface of the polymer film with a polymer binder interposed therebetween, and a polymer adhesive layer formed on a backside of at least one of the first and second metal foils.
摘要翻译：提供导电压敏粘合带。导电性压敏粘合带包括第一金属箔，在第一金属箔的表面上附着聚合物粘合剂的聚合物膜，夹在聚合物膜的表面上的第二金属箔，聚合物粘合剂夹在其间，以及形成在所述第一和第二金属箔中的至少一个的背面上的聚合物粘合剂层。

8. 发明专利

JP2017527965A 電気接続端子有权
公开(公告)号：JP2017527965A
公开(公告)日：2017-09-21
申请号：JP2017508558
申请日：2016-04-18
申请人：ジョインセットカンパニーリミテッドJoinset Co.,Ltd. , ジョインセットカンパニーリミテッドJoinset Co.,Ltd.
发明人：ソンギキム , ソンギキム , キハンパク , キハンパク
IPC分类号： H01R13/24 , H01R13/03
CPC分类号： H01R13/2421 , H01R12/714 , H01R13/03
摘要：【課題】【解決手段】電気伝導性対象物の間に介在されて前記対象物を互いに電気的に連結する電気接続端子が開示される。前記電気接続端子は、金属材質の弾性コイルばねと、前記ばねの少なくとも一つの端部に接着されて形成され、前記対象物に電気的に接触する電気伝導性接触部と、を含み、前記接触部は、液状のポリマー樹脂に金属パウダーが混合された液状の電気伝導性材料が前記ばねの端部を包んで硬化されるか、前記ばねの一端の端部孔に流入硬化されて形成される。【選択図】

9. 发明申请

WO2012128593A3 SENSOR HAVING AN EMBEDDED ELECTRODE, AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：具有嵌入电极的传感器及其制造方法
公开(公告)号：WO2012128593A3
公开(公告)日：2012-12-27
申请号：PCT/KR2012002153
申请日：2012-03-23
申请人： JOINSET CO LTD , EXPANTECH CO LTD , KIM SUN-KI , KIM SUNG-YOUL , JUNG HYUN-HAK , KIM JUNG-SUK
发明人： KIM SUN-KI , KIM SUNG-YOUL , JUNG HYUN-HAK , KIM JUNG-SUK
IPC分类号： G01N27/30 , G01N27/02 , H01L21/28
CPC分类号： G01N27/12
摘要： Disclosed is a sensor having an embedded electrode, which can be manufactured at a reduced cost and applied to many different fields. The sensor comprises: a sensing stack in which a first conductive layer and a second conductive layer are stacked and layered with a separation layer interposed therebetween; and an electrode terminal arranged at a side surface of the sensing stack and electrically connected to the first and second conductive layers. The first and second conductive layers are exposed on at least one side surface of the sensing stack except for the side surface on which the electrode terminal is arranged, to thereby form a sensing surface.
摘要翻译：公开了一种具有嵌入式电极的传感器，其可以以降低的成本制造并应用于许多不同的领域。该传感器包括：感测叠层，其中第一导电层和第二导电层被堆叠并且隔着隔离层而层叠; 以及电极端子，布置在感测堆叠的侧表面并且电连接到第一导电层和第二导电层。第一导电层和第二导电层暴露在除了布置有电极端子的侧表面之外的感测堆叠的至少一个侧表面上，从而形成感测表面。

10. 发明申请

WO2008004741A1 SOLDERABLE ELECTRIC CONTACT TERMINAL 审中-公开
标题翻译：可焊接电接头端子
公开(公告)号：WO2008004741A1
公开(公告)日：2008-01-10
申请号：PCT/KR2007/000916
申请日：2007-02-22
申请人： JOINSET CO., LTD , KIM, Sun-Ki , LEE, Seung-Jin
发明人： KIM, Sun-Ki , LEE, Seung-Jin
IPC分类号： H01R4/18
CPC分类号： H01R13/2414 , H05K3/341 , H05K3/4015 , H05K2201/0133 , H05K2201/056 , Y10S439/927
摘要： A solderable electric contact terminal includes; an insulating foam rubber having a predetermined volume; an insulating non-foam rubber coating layer adhered to the insulating foam rubber such that the insulating non-foam rubber encloses the insulating foam rubber; and a heat resistant polymer film having inner surface adhered to the insulating non-foam rubber coating layer such that the heat resistant polymer film encloses the insulating non-foam rubber coating layer, and outer surface on which a metal layer is integrally formed.
摘要翻译：可焊接电接触端子包括：具有预定体积的绝缘泡沫橡胶; 绝缘非泡沫橡胶涂层粘附到绝缘泡沫橡胶上，使得绝缘非泡沫橡胶包围绝缘泡沫橡胶; 以及耐热聚合物膜，其具有粘附到绝缘非泡沫橡胶涂层的内表面，使得耐热聚合物膜包围绝缘非泡沫橡胶涂层以及金属层整体形成的外表面。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式