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1. 发明授权

US07210982B2 Method and apparatus for polishing a substrate 有权
标题翻译：抛光基板的方法和装置
公开(公告)号：US07210982B2
公开(公告)日：2007-05-01
申请号：US11512208
申请日：2006-08-30
申请人： Itsuro Watanabe , Takashi Kubo
发明人： Itsuro Watanabe , Takashi Kubo
IPC分类号： B24B49/00
CPC分类号： B24B37/30
摘要： The present invention is to provide a method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate.The device for polishing a substrate is adapted so that a substrate is attached to a film stretched on a frame; the frame is installed on a carrier; the carrier and a polishing surface-plate are brought closer relative to each other to polish a surface to be polished of the substrate attached to the film by pressing the substrate to the polishing surface-plate; the frame is removed from the carrier after the completion of the polishing, and the polished substrate is removed from the frame.
摘要翻译：本发明提供一种适用于研磨大尺寸玻璃基板的玻璃基板的研磨方法和装置。用于抛光衬底的装置适于使得衬底附接到在框架上拉伸的膜; 框架安装在承运人身上; 载体和抛光面板相对于彼此更靠近，以通过将基板压在抛光表面板上来抛光附着在膜上的基板被抛光的表面; 在完成抛光之后将框架从载体上移除，并且抛光的基板从框架中移出。

2. 发明申请

US20070000874A1 METHOD AND APPARATUS FOR POLISHING A SUBSTRATE 有权
标题翻译：抛光衬底的方法和装置
公开(公告)号：US20070000874A1
公开(公告)日：2007-01-04
申请号：US11512208
申请日：2006-08-30
申请人： Itsuro Watanabe , Takashi Kubo
发明人： Itsuro Watanabe , Takashi Kubo
IPC分类号： C03C15/00 , C23F1/00 , H01L21/302 , B44C1/22
CPC分类号： B24B37/30
摘要： The present invention is to provide a method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate. The device for polishing a substrate is adapted so that a substrate is attached to a film stretched on a frame; the frame is installed on a carrier; the carrier and a polishing surface-plate are brought closer relative to each other to polish a surface to be polished of the substrate attached to the film by pressing the substrate to the polishing surface-plate; the frame is removed from the carrier after the completion of the polishing, and the polished substrate is removed from the frame.
摘要翻译：本发明提供一种适用于研磨大尺寸玻璃基板的玻璃基板的研磨方法和装置。用于抛光衬底的装置适于使得衬底附接到在框架上拉伸的膜; 框架安装在承运人身上; 载体和抛光面板相对于彼此更靠近，以通过将基板压在抛光表面板上来抛光附着在膜上的基板被抛光的表面; 在完成抛光之后将框架从载体上移除，并且抛光的基板从框架中移出。

3. 发明授权

US07115022B2 Method and apparatus for polishing a substrate 有权
标题翻译：抛光基板的方法和装置
公开(公告)号：US07115022B2
公开(公告)日：2006-10-03
申请号：US11045089
申请日：2005-01-31
申请人： Itsuro Watanabe , Takashi Kubo
发明人： Itsuro Watanabe , Takashi Kubo
IPC分类号： B24B49/00
CPC分类号： B24B37/30
摘要： The present invention is to provide a method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate.The device for polishing a substrate is adapted so that a substrate is attached to a film stretched on a frame; the frame is installed on a carrier; the carrier and a polishing surface-plate are brought closer relative to each other to polish a surface to be polished of the substrate attached to the film by pressing the substrate to the polishing surface-plate; the frame is removed from the carrier after the completion of the polishing, and the polished substrate is removed from the frame.
摘要翻译：本发明提供一种适用于研磨大尺寸玻璃基板的玻璃基板的研磨方法和装置。用于抛光衬底的装置适于使得衬底附接到在框架上拉伸的膜; 框架安装在承运人身上; 载体和抛光面板相对于彼此更靠近，以通过将基板压在抛光表面板上来抛光附着在膜上的基板被抛光的表面; 在完成抛光之后将框架从载体上移除，并且抛光的基板从框架中移出。

4. 发明申请

US20050130386A1 Method and apparatus for polishing a substrate 有权
标题翻译：抛光基板的方法和装置
公开(公告)号：US20050130386A1
公开(公告)日：2005-06-16
申请号：US11045089
申请日：2005-01-31
申请人： Itsuro Watanabe , Takashi Kubo
发明人： Itsuro Watanabe , Takashi Kubo
IPC分类号： G02F1/1333 , B24B37/04 , B24B7/00 , B24B9/00 , H01L21/76
CPC分类号： B24B37/30
摘要： The present invention is to provide a method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate. The device for polishing a substrate is adapted so that a substrate is attached to a film stretched on a frame; the frame is installed on a carrier; the carrier and a polishing surface-plate are brought closer relative to each other to polish a surface to be polished of the substrate attached to the film by pressing the substrate to the polishing surface-plate; the frame is removed from the carrier after the completion of the polishing, and the polished substrate is removed from the frame.
摘要翻译：本发明提供一种适用于研磨大尺寸玻璃基板的玻璃基板的研磨方法和装置。用于抛光衬底的装置适于使得衬底附接到在框架上拉伸的膜; 框架安装在承运人身上; 载体和抛光面板相对于彼此更靠近，以通过将基板压在抛光表面板上来抛光附着在膜上的基板被抛光的表面; 在完成抛光之后将框架从载体上移除，并且抛光的基板从框架中移出。

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