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1. 发明专利

JPS5934311A Fence pillar concealed and protruded from underground 失效
标题翻译：从地下洞穴伸展和伸展的扶手
公开(公告)号：JPS5934311A
公开(公告)日：1984-02-24
申请号：JP14575082
申请日：1982-08-23
申请人： Isao Watanabe
发明人： WATANABE ISAO
IPC分类号： E01F15/00

2. 发明专利

JPS59216510A Clutch apparatus of power mower 失效
标题翻译：电力离合器装置
公开(公告)号：JPS59216510A
公开(公告)日：1984-12-06
申请号：JP8970383
申请日：1983-05-20
申请人： Isao Watanabe
发明人： WATANABE ISAO
IPC分类号： A01D34/76 , A01D69/08 , F16D13/38 , A01D35/26

3. 发明申请

US20130161937A1 WRISTBAND 有权
公开(公告)号：US20130161937A1
公开(公告)日：2013-06-27
申请号：US13819482
申请日：2011-04-06
申请人： Tetsuya Takashima , Satoru Honda , Isao Watanabe
发明人： Tetsuya Takashima , Satoru Honda , Isao Watanabe
IPC分类号： B42D15/10
CPC分类号： B42D25/28 , A44C5/0015 , B42D25/00 , G09F3/005
摘要： In a wristbhaving a label-like structure, fracturing notches for preventing unauthorized use are positioned where the two ends of the band are to be glued together. If temporary peeling of the glued ends is attempted, the wristband breaks reliably and it is difficult to return it to the original state. If fracturing notches (11) are formed on either a first winding region (6) or a second winding region (7), which are positioned at left and right ends of the printing region (5). The wristband is configured so that a ring shape can be formed by overlapping and adhering the adhesive layer on the rear surface of one of shape, the first winding region (6) or the second winding region (7) onto the other winding region. An adhesion position check mark (15, 16) is formed on either the first winding region (6) or the second winding region (7).
摘要翻译：在具有标签状结构的腕带中，用于防止未经授权使用的断裂凹口位于将胶带两端粘合在一起的位置。如果尝试胶合端的暂时剥离，则腕带可靠地断开，并且难以将其返回到原始状态。如果在位于打印区域（5）的左端和右端的第一缠绕区域（6）或第二缠绕区域（7）上形成压裂凹口（11）。腕带被构造成可以通过将形状的第一绕组区域（6）或第二绕组区域（7）的后表面上的粘合剂层重叠并粘合到另一绕组区域上来形成环形。粘合位置复选标记（15,16）形成在第一绕组区域（6）或第二绕组区域（7）上。

4. 发明授权

US08471353B2 Mesa photodiode and method for manufacturing the same 失效
标题翻译： Mesa光电二极管及其制造方法
公开(公告)号：US08471353B2
公开(公告)日：2013-06-25
申请号：US12801425
申请日：2010-06-08
申请人： Tomoaki Koi , Isao Watanabe , Takashi Matsumoto
发明人： Tomoaki Koi , Isao Watanabe , Takashi Matsumoto
IPC分类号： H01L31/00
CPC分类号： H01L31/105 , H01L31/1035 , H01L31/107
摘要： A mesa photodiode which includes a mesa, the side wall of the mesa (a light-receiving region mesa) and at least a shoulder portion of the mesa in an upper face of the mesa are continuously covered with a semiconductor layer of a first conductivity type, a second conductivity type, a semi-insulating type, or an undoped type (an undoped InP layer, for example) that is grown on the side wall and the upper face of the mesa. In the semiconductor layer, a layer thickness D1 of a portion covering the side wall of the mesa is equal to or greater than 850 nm.
摘要翻译：包括台面的台面光电二极管，台面的侧壁（光接收区域台面）和台面的上表面中的台面的至少台肩部分被第一导电类型的半导体层连续地覆盖，第二导电型，半绝缘型或未掺杂型（例如，未掺杂的InP层），其生长在台面的侧壁和上表面上。在半导体层中，覆盖台面的侧壁的部分的层厚度D1为850nm以上。

5. 发明授权

US08294234B2 Mesa photodiode and method for manufacturing the same 有权
标题翻译： Mesa光电二极管及其制造方法
公开(公告)号：US08294234B2
公开(公告)日：2012-10-23
申请号：US12662504
申请日：2010-04-20
申请人： Isao Watanabe , Tomoaki Koi
发明人： Isao Watanabe , Tomoaki Koi
IPC分类号： H01L31/0352 , H01L31/10
CPC分类号： H01L31/1844 , H01L31/105 , Y02E10/544
摘要： A mesa photodiode which includes a mesa, the sidewall of the mesa is a surface that is inclined in the direction in which the bottom of the mesa becomes wider. At least the sidewall of the mesa is covered with a semiconductor layer of a first conductivity type, a second conductivity type, a semi-insulating type, or an undoped type. The semiconductor layer is grown on at least the sidewall of the mesa. The inclined angle of the inclined surface of the mesa at the upper end portion is smaller than the inclined angle of the inclined surface of the mesa at the lower end portion.
摘要翻译：包括台面的台面光电二极管，台面的侧壁是在台面的底部变宽的方向上倾斜的表面。至少台面的侧壁被第一导电型，第二导电型，半绝缘型或未掺杂型的半导体层覆盖。半导体层至少在台面的侧壁上生长。上端部的台面的倾斜面的倾斜角度小于下端部的台面的倾斜面的倾斜角度。

6. 发明申请

US20110286775A1 FIXING DEVICE, IMAGE FORMING APPARATUS, AND HEAT GENERATION BELT 审中-公开
标题翻译：固定装置，图像形成装置和发热带
公开(公告)号：US20110286775A1
公开(公告)日：2011-11-24
申请号：US13092259
申请日：2011-04-22
申请人： Yasuhiro ISHIHARA , Isao Watanabe , Toshiaki Tanaka , Kosuke Sasaki
发明人： Yasuhiro ISHIHARA , Isao Watanabe , Toshiaki Tanaka , Kosuke Sasaki
IPC分类号： G03G15/20
CPC分类号： G03G15/2042
摘要： The present invention provides a fixing device for fixing an unfixed image onto a recording sheet by applying heat and pressure to the unfixed image while the recording sheet having the unfixed image formed thereon is passing through a fixing nip, the fixing nip being formed by pressing a pressurizing roller against a heat generation belt, wherein the heat generation belt rotates around a rotational axis and includes a resistive heat layer extending in a rotational axis direction thereof, the resistive heat layer configured to generate heat when electricity is supplied thereto and having a plurality of holes provided therein, and the holes are distributed unevenly in the resistive heat layer such that electrical resistivity of the resistive heat layer varies in the rotational axis direction.
摘要翻译：本发明提供了一种定影装置，用于通过对未定影图像施加热和压力将未定影图像固定在记录纸上，同时其上形成有未定影图像的记录片材通过定影辊隙，定影辊隙是通过压制加热辊抵靠发热带，其中所述发热带围绕旋转轴线旋转并且包括沿其旋转轴线方向延伸的电阻加热层，所述电阻热层被配置为当向其供电时产生热量并具有多个设置在其中的孔，并且孔在电阻热层中不均匀地分布，使得电阻热层的电阻率在旋转轴线方向上变化。

7. 发明申请

US20110116893A1 CONNECTION STRUCTURE FOR SHEET-METAL PARTS AND IMAGE FORMING APPARATUS 审中-公开
标题翻译：金属零件和图像形成装置的连接结构
公开(公告)号：US20110116893A1
公开(公告)日：2011-05-19
申请号：US13003734
申请日：2009-07-30
申请人： Kenichi Hayashi , Isao Watanabe , Toshikuni Ando , Kiyohito Tsujihara
发明人： Kenichi Hayashi , Isao Watanabe , Toshikuni Ando , Kiyohito Tsujihara
IPC分类号： F16B35/00
CPC分类号： G03G21/1642 , G03G2221/1678
摘要： An object of the present invention is to provide a connection structure for sheet-metal parts that permits two sheet-metal parts to be screwed to each other with good conductivity by a simple process in a simple structure, and an image forming apparatus provided with the connection structure.Disclosed is a connection structure for connecting a first sheet-metal part (31) to a second sheet-metal part (41) by placing the sheet-metal parts (31) and (41) such that their respective contact surfaces face to each other and by connecting the contact surfaces by a screw (50). A first pilot hole (32) that is smaller than the screw (50) is made in the first sheet-metal part (31), and a plurality of first small holes (33) that are smaller than the first pilot hole (32) are made in the first sheet-metal part (31), around the first pilot hole (32). In a process of connecting the first sheet-metal part (31) and the second sheet-metal part (41) together, when the screw (50) is tightened into the first pilot hole (32), force acts on the first sheet-metal part (31), around the first pilot hole (32). The first small holes (33) are pushed by the force, and projections are formed at the first small holes (33). Then, the projections come into contact with the second sheet-metal part (41).
摘要翻译：本发明的目的是提供一种用于以简单的结构简单的工艺使两个金属片彼此以良好的导电性彼此螺纹连接的金属板零件的连接结构，以及设置有连接结构。公开了一种用于通过将金属片（31）和（41）放置成使它们各自的接触表面彼此面对来连接第一金属片部件（31）与第二金属片部件（41）的连接结构并且通过螺钉（50）连接接触表面。在第一金属板部（31）上形成有小于螺钉（50）的第一导向孔（32），小于第一导向孔（32）的多个第一小孔（33）在第一导向孔（32）的周围形成在第一金属板部（31）中。在将第一金属片部件（31）与第二金属片部件（41）连接在一起的过程中，当螺钉（50）被紧固到第一引导孔（32）中时，力作用在第一片状金属部件金属部分（31）围绕第一引导孔（32）。第一小孔（33）被力推动，并且在第一小孔（33）处形成突起。然后，突起与第二金属片部件41接触。

8. 发明授权

US07531115B2 Conductive material and method for filling via-hole 有权
标题翻译：用于填充通孔的导电材料和方法
公开(公告)号：US07531115B2
公开(公告)日：2009-05-12
申请号：US11074729
申请日：2005-03-09
申请人： Isao Watanabe , Kaoru Hashimoto , Osamu Taniguchi
发明人： Isao Watanabe , Kaoru Hashimoto , Osamu Taniguchi
IPC分类号： H01B1/02
CPC分类号： H01L21/76898 , H05K1/0306 , H05K3/4061 , H05K2201/0272 , H05K2201/0347 , H05K2203/0425 , H05K2203/085 , H05K2203/1105 , H05K2203/1461 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T29/49169
摘要： The conductive material comprises a first metal material having a melting point of not more than 250° C. and a second metal material having a melting point of not less than 500° C., and is paste at a temperature not more than 250° C. Whereby the conductive material can have much higher conductivity than the resin paste. The conductive material can be used in paste, whereby the conductive material can be buried in the via-hole in the same way as the resin paste.
摘要翻译：导电材料包括熔点不超过250℃的第一金属材料和熔点不低于500℃的第二金属材料，并且在不高于250℃的温度下是糊状物由此导电材料的导电率可以高于树脂浆料。导电材料可以用于糊料，由此导电材料可以以与树脂浆料相同的方式埋在通孔中。

9. 发明授权

US07434063B2 Authentication method, apparatus, and system 失效
标题翻译：验证方法，设备和系统
公开(公告)号：US07434063B2
公开(公告)日：2008-10-07
申请号：US10263198
申请日：2002-10-03
申请人： Isao Watanabe
发明人： Isao Watanabe
IPC分类号： H04K1/00 , G06F7/04
CPC分类号： G06F21/32 , G07C9/00142 , G07C9/00158
摘要： In an authentication apparatus, at least one authentication program corresponding to an authentication method of the user's choice executes an authentication process based on data received from a sensor unit and personal feature data. An authentication determination program calculates a comprehensive authentication level value of such an authentication method on the basis of authentication evaluation data. When the calculated comprehensive authentication level value has exceeded the predetermined authentication level, the authentication determination program determines that authentication has succeeded; otherwise, the program determines that authentication has failed.
摘要翻译：在认证装置中，对应于用户选择的认证方法的至少一个认证程序基于从传感器单元接收的数据和个人特征数据执行认证处理。认证确定程序基于认证评估数据计算这种认证方法的综合认证级别值。当所计算的综合认证级别值已经超过预定认证级别时，认证确定程序确定认证成功; 否则，程序确定认证失败。

10. 发明授权

US07074309B2 Heater-equipped air-fuel ratio sensor 有权
公开(公告)号：US07074309B2
公开(公告)日：2006-07-11
申请号：US10334725
申请日：2003-01-02
申请人： Isao Watanabe , Michihiro Yamakawa , Masanori Fukutani
发明人： Isao Watanabe , Michihiro Yamakawa , Masanori Fukutani
IPC分类号： G01N27/407
CPC分类号： G01N27/4067 , Y10T29/49002 , Y10T29/49083
摘要： A heater is inserted into an inside chamber of a sensor element until a tip end of the heater is surely brought into contact with a bottom surface of the inside chamber. Next, a metallic holder is attached on an outside surface of the heater. Then, the metallic holder is slid along the outside surface of the heater toward the bottom surface of the sensor element to engage the metallic holder with an edge of the sensor element.

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