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1. 发明申请

WO1996011985A1 THERMOPLASTIC RESIN COMPOSITION, INJECTION MOLDING METHOD THEREOF AND INJECTION MOLDED ARTICLE 审中-公开
标题翻译：热塑性树脂组合物，注射成型方法及注塑成型
公开(公告)号：WO1996011985A1
公开(公告)日：1996-04-25
申请号：PCT/JP1995002133
申请日：1995-10-18
申请人： POLYPLASTICS CO., LTD. , MIYAZAKI, Hirotaka , AKETA, Tomoyuki , MURAKAMI, Haruji , ISHIKAWA, Takayuki , KOBAYASHI, Kazuhito , MIGITA, Ayako
发明人： POLYPLASTICS CO., LTD.
IPC分类号： C08L101/00
CPC分类号： C08L55/02 , B29C45/0001 , B29C45/2708 , B29K2105/0079 , C08G2261/312 , C08L23/10 , C08L25/06 , C08L33/06 , C08L59/00 , C08L65/02 , C08L67/00 , C08L67/02 , C08L67/03 , C08L67/04 , C08L69/00 , C08L77/00 , C08L81/02 , C08L101/00 , C08L2205/12 , Y10T428/1352 , Y10T428/1397 , Y10T428/24994 , Y10T428/269 , C08L2666/18 , C08L2666/14 , C08L2666/02
摘要： This invention provides a thermoplastic resin composition comprising a thermoplastic resin (A) not forming an anisotropic melt phase and a liquid crystal polymer (B) capable of forming the anisotropic melt phase, an injection molding method thereof and an injection molded article capable of providing a thin molded article having excellent mechanical strength. A thermoplastic resin composition (C) comprises 99 to 50 wt.% of the thermoplastic resin (A) and 1 to 50 wt.% of the liquid crystal polymer (B). The liquid crystal polymer (B) is microscopically dispersed in an island form in the matrix phase of the thermoplastic resin (A) so that when the composition (C) is heat-treated at a temperature not higher than the melting point of the liquid crystal polymer (B) under a non-load state and is then cooled, the liquid crystal polymer (B) falls within the range of the weight average particle diameter of 10 to 40 mu m and at least 80 wt.% thereof falls within the range of the particle diameter of 0.5 to 60 mu m. The injection molding method comprises carrying out injection molding of the thermoplastic resin composition (C) at a resin temperature not lower than the fluidization start temperature of the liquid crystal polymer (B) and at a gate passage rate of the molten resin of at least 500 m/min, and an injection molded article characterized in that the liquid crystal polymer (B) is dispersed in a fibrous form in the matrix phase of the thermoplastic resin (A) at a mean aspect ratio of at least 6.
摘要翻译：本发明提供一种热塑性树脂组合物，其包含不形成各向异性熔融相的热塑性树脂（A）和能够形成各向异性熔融相的液晶聚合物（B），其注射成型方法和能够提供薄模制品具有优异的机械强度。热塑性树脂组合物（C）含有99〜50重量％的热塑性树脂（A）和1〜50重量％的液晶聚合物（B）。液晶聚合物（B）在热塑性树脂（A）的基体相中以岛状显微分散，使得当组合物（C）在不高于液晶的熔点的温度下进行热处理时聚合物（B），然后冷却，液晶聚合物（B）落入重量平均粒径为10〜40μm的范围内，其中至少80wt％落在范围内的粒径为0.5〜60μm。注射成型方法包括在不低于液晶聚合物（B）的流化开始温度的树脂温度下进行热塑性树脂组合物（C）的注射成型，并且熔融树脂的浇口通道速率为至少500 m / min，注射成型制品的特征在于，液晶聚合物（B）以热塑性树脂（A）的基质相以纤维状分散，平均纵横比为6以上。

2. 发明申请

WO1997015631A1 SYNTHETIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF 审中-公开
标题翻译：合成树脂组合物及其成型品
公开(公告)号：WO1997015631A1
公开(公告)日：1997-05-01
申请号：PCT/JP1996003063
申请日：1996-10-22
申请人： POLYPLASTICS CO., LTD. , SAITO, Tatsuya , ISHIKAWA, Takayuki
发明人： POLYPLASTICS CO., LTD.
IPC分类号： C08L101/00
CPC分类号： C08L67/02 , C08K5/54 , C08L69/00 , C08L101/00 , C08L67/00 , C08L59/02 , C08L77/12 , C08L67/04 , C08L2666/14 , C08L2666/18
摘要： A resin composition comprising a thermoplastic resin (such as polyester resin) which does not exhibit anisotropy in melting and a liquid-crystal polyester resin which causes little delamination and is excellent in mechanical properties can be prepared by blending 100 parts by weight of a resin component comprising (a) 99 to 50 parts by weight of a thermoplastic resin which does not exhibit anisotropy in melting and (b) 1 to 50 parts by weight of a liquid-crystal polyester resin forming an anisotropic molten phase with (c) 0.01 to 3.0 parts by weight of at least one silane compound selected from among vinylalkoxysilanes, aminoalkoxysilanes and mercaptoalkoxysilanes.
摘要翻译：包含不具有熔融各向异性的热塑性树脂（例如聚酯树脂）和几乎不产生分层并且机械性能优异的液晶聚酯树脂的树脂组合物可以通过将100重量份的树脂组分其包含（a）99〜50重量份不具有熔融各向异性的热塑性树脂，（b）1〜50重量份形成各向异性熔融相的液晶聚酯树脂，（c）为0.01〜3.0 重量份的至少一种选自乙烯基烷氧基硅烷，氨基烷氧基硅烷和巯基烷氧基硅烷的硅烷化合物。

3. 发明申请

WO1993026142A1 THREE-DIMENSIONAL PRINTED CIRCUIT BOARD, ELECTRONIC CIRCUIT PACKAGE USING THIS BOARD, AND METHOD FOR MANUFACTURING THIS BOARD 审中-公开
标题翻译：三维印刷电路板，使用该板的电子电路封装以及制造该板的方法
公开(公告)号：WO1993026142A1
公开(公告)日：1993-12-23
申请号：PCT/JP1993000756
申请日：1993-06-04
申请人： MITSUI TOATSU CHEMICALS, INCORPORATED , NISHIHARA, Kunio , HOSONO, Youichi , NAGAMINE, Kunihiro , KAYAMA, Takashi , ISHIKAWA, Takayuki
发明人： MITSUI TOATSU CHEMICALS, INCORPORATED
IPC分类号： H05K01/02
CPC分类号： H05K1/02 , H01L23/043 , H01L23/10 , H01L23/24 , H01L23/3121 , H01L23/3672 , H01L23/3735 , H01L23/492 , H01L23/49822 , H01L23/4985 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L25/16 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/16152 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K1/0284 , H05K1/056 , H05K1/117 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/0058 , H05K3/284 , H05K3/363 , H05K3/4644 , H05K3/4652 , H05K2201/0129 , H05K2201/0154 , H05K2201/0355 , H05K2201/10477 , H05K2203/063 , H05K2203/1316 , H05K2203/302 , Y10T29/49169 , Y10T29/49172 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A metallic base board is used for mounting electronic components thereon. The board is formed by laminating a plurality of copper foils on a metallic board through thermoplastic polyimide. On the copper foils circuit patterns are formed. The metallic base board having such circuit patterns is bent and deeply drawn in order to configure a box having an open face. The area of the open face is nearly equal to that of the bottom face. On the edges of the open face flanges are formed. On the flanges, by patterning, there are formed leads which are used for connecting this board to another wiring board. The three-dimensional printed circuit board thus prepared is mounted on another wiring board with its open face down. The leads are soldered to the circuit pattern on the wiring board. Electronic components are mounted on the bottom face of the three-dimensional printed circuit board. Hence, an electronic circuit package is constructed.
摘要翻译：金属基板用于在其上安装电子部件。该板通过热塑性聚酰亚胺在金属板上层压多个铜箔而形成。在铜箔上形成电路图形。具有这种电路图形的金属基板被弯曲并深拉以构成具有开口面的盒子。开放面的面积几乎等于底面的面积。在开口面凸缘的边缘上形成。在法兰上，通过图案化，形成用于将该板连接到另一布线板的引线。将如此制备的三维印刷电路板安装在其开口面向下的另一布线板上。引线焊接到电路板上的电路图案。电子部件安装在三维印刷电路板的底面上。因此，构建了电子电路封装。

4. 发明申请

WO1998023430A1 INJECTION-MOLDED OBJECT 审中-公开
标题翻译：注射成型对象
公开(公告)号：WO1998023430A1
公开(公告)日：1998-06-04
申请号：PCT/JP1997004318
申请日：1997-11-26
申请人： POLYPLASTICS CO., LTD. , MURAKAMI, Haruji , ISHIKAWA, Takayuki , KOBAYASHI, Kazuhito
发明人： POLYPLASTICS CO., LTD.
IPC分类号： B29C45/00
CPC分类号： C08L67/00 , B29C45/0001 , B29K2105/0079 , C08K3/24 , C08K5/5425 , C08K5/5455 , C08K5/548 , C08K2201/016 , C08L67/03 , C08L69/00 , C08L2205/12 , Y10T428/1095 , C08L2666/18
摘要： A resin composition comprising a blend of a thermoplastic resin with a liquid-crystalline polymer is injection-molded while form the liquid-crystalline polymer into fibers during the molding to thereby give an injection-molded object excellent in mechanical strength etc. A thermoplastic resin composition comprising 100 parts by weight of a resin ingredient consisting of 99 to 50 parts by weight of a thermoplastic resin (A) forming no anisotropic molten phase and 1 to 50 parts by weight of a liquid-crystalline polymer (B) capable of forming an anisotropic molten phase and 0,01 to 1.0 part by weight of at least one compound (C) selected among phosphoric acid, phosphorous acid, and metal salts thereof is injection-molded to give a molding in which the polymer (B) is present in the form of fibers having an average aspect ratio of 6 or higher in the matrix of the resin (A).
摘要翻译：将包含热塑性树脂与液晶聚合物的共混物的树脂组合物注射成型，同时在成型期间将液晶聚合物形成纤维，从而得到机械强度等优异的注塑成型体。热塑性树脂组合物包含100重量份的由99〜50重量份不形成各向异性熔融相的热塑性树脂（A）和1〜50重量份能够形成各向异性的液晶聚合物（B）的树脂成分熔融相和0.01-1.0重量份的至少一种选自磷酸，亚磷酸及其金属盐的化合物（C）进行注射成型，得到聚合物（B）存在于在树脂（A）的基体中具有6或更高的平均纵横比的纤维的形式。

5. 发明申请

WO2006059407A9 METHOD OF GAS RESISTANCE TEST FOR IMAGE AND INK SET 审中-公开
标题翻译：用于图像和墨水的气体阻力测试方法
公开(公告)号：WO2006059407A9
公开(公告)日：2006-09-14
申请号：PCT/JP2005010312
申请日：2005-05-31
申请人： CANON KK , KOJIMA YOJIRO , OGINO HIROYUKI , ISHIKAWA TAKAYUKI , YAMAMOTO TAKAO
发明人： KOJIMA YOJIRO , OGINO HIROYUKI , ISHIKAWA TAKAYUKI , YAMAMOTO TAKAO
IPC分类号： G01N17/00 , B41J2/01 , C09D11/00 , C09D11/30
CPC分类号： C09D11/32 , C09D11/40
摘要： Gas resistance of an image is evaluated by placing the image in a mixed gas atmosphere containing at least ozone and nitrogen dioxide. The mixed gas atmosphere is controlled such that the concentrations of ozone and nitrogen dioxide are not less than 75ppb and not less than 150 ppb, respectively, and the mixed gas is continuously supplied to the surface of a sample bearing the image at a flow rate not less than 0.2 m/s and not more than 3.0 m/s.
摘要翻译：通过将图像放置在至少含有臭氧和二氧化氮的混合气体气氛中来评估图像的气体阻力。控制混合气体气氛，使得臭氧和二氧化氮的浓度分别不小于75ppb且不小于150ppb，并且将混合气体以不同于流速的方式连续地供给到承载图像的样品的表面小于0.2m / s且不大于3.0m / s。

6. 发明申请

WO2006059407A1 METHOD OF GAS RESISTANCE TEST FOR IMAGE AND INK SET 审中-公开
标题翻译：图像和油墨设置的气体阻力测试方法
公开(公告)号：WO2006059407A1
公开(公告)日：2006-06-08
申请号：PCT/JP2005/010312
申请日：2005-05-31
申请人： CANON KABUSHIKI KAISHA , KOJIMA, Yojiro , OGINO, Hiroyuki , ISHIKAWA, Takayuki , YAMAMOTO, Takao
发明人： KOJIMA, Yojiro , OGINO, Hiroyuki , ISHIKAWA, Takayuki , YAMAMOTO, Takao
IPC分类号： G01N17/00 , B41J2/01 , C09D11/00
CPC分类号： C09D11/32 , C09D11/40
摘要： Gas resistance of an image is evaluated by placing the image in a mixed gas atmosphere containing at least ozone and nitrogen dioxide. The mixed gas atmosphere is controlled such that the concentrations of ozone and nitrogen dioxide are not less than 75ppb and not less than 150 ppb, respectively, and the mixed gas is continuously supplied to the surface of a sample bearing the image at a flow rate not less than 0.2 m/s and not more than 3.0 m/s.
摘要翻译：通过将图像置于至少包含臭氧和二氧化氮的混合气体气氛中来评估图像的耐气体性。控制混合气体气氛使得臭氧和二氧化氮的浓度分别不低于75ppb并且不低于150ppb，并且混合气体以流速不连续地供应到承载图像的样品的表面小于0.2m / s且不大于3.0m / s。

7. 发明申请

WO1997015628A1 SYNTHETIC RESIN COMPOSITION 审中-公开
标题翻译：合成树脂组合物
公开(公告)号：WO1997015628A1
公开(公告)日：1997-05-01
申请号：PCT/JP1996003064
申请日：1996-10-22
申请人： POLYPLASTICS CO., LTD. , SAITO, Tatsuya , ISHIKAWA, Takayuki
发明人： POLYPLASTICS CO., LTD.
IPC分类号： C08L67/02
CPC分类号： C08L67/00 , C08K5/54 , C08L67/02 , C08L2666/14
摘要： A synthetic resin composition which comprises a thermoplastic resin not exhibiting anisotropy in a molten state (such as polyester resin) and a liquid-crystal polyester resin and which little causes delamination and is excellent in mechanical properties can be prepared by blending 100 parts by weight of a resin component comprising (a) a thermoplastic resin not exhibiting anisotropy in a molten state in an amount of one part by weight or above but below 50 parts by weight and (b) a liquid-crystal polyester resin forming an anisotropic molten phase in an amount of more than 50 parts by weight up to 99 parts by weight with 0.01 to 3.0 parts by weight of (c) at least one silane compound selected from the group consisting of vinylalkoxysilanes, aminoalkoxysilanes and mercaptoalkoxysilanes.
摘要翻译：包含不具有熔融状态的各向异性的热塑性树脂（例如聚酯树脂）和液晶聚酯树脂并且很少引起分层并且机械性能优异的合成树脂组合物可以通过将100重量份的树脂组分，其包含（a）在熔融状态下不显示各向异性的热塑性树脂，其量为1重量份以上但低于50重量份，和（b）形成各向异性熔融相的液晶聚酯树脂数量大于50重量份，最多99重量份，0.01至3.0重量份的（c）至少一种选自乙烯基烷氧基硅烷，氨基烷氧基硅烷和巯基烷氧基硅烷的硅烷化合物。

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