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    • 8. 发明申请
    • LEAD INSPECTION APPARATUS OF IC PACKAGE
    • IC封装的检测装置
    • WO1997028420A1
    • 1997-08-07
    • PCT/JP1997000246
    • 1997-01-31
    • KOMATSU LTD.HAMACHI, HisashiISHIKAWA, KoichiNAKAKOJI, Yoshihiko
    • KOMATSU LTD.
    • G01B11/24
    • H01L22/12
    • An apparatus for inspecting leads of an IC package (2) by forming images of illuminated leads. Lighting devices (3 and 4) disposed at the center of the bottom surface of the IC package to illuminate the leads have a width corresponding to a center area of the bottom surface of the IC package, where the lead terminals (1) of the IC package (2) do not exist, a length greater than stand-off of the lead terminals (1) of the IC package (2) and a height such that light can be radiated to only the lead terminals closer to the center portion of the IC package from the distal end portions of the leads. Cameras (7 and 8) for imaging the leads (1) are disposed to measure highly precisely the flatness of the lead terminals.
    • 一种用于通过形成照明引线的图像来检查IC封装(2)的引线的装置。 配置在IC封装的底面的中心以照亮引线的照明装置(3和4)的宽度对应于IC封装的底面的中心区域,其中IC的引线端子(1) 封装(2)不存在,其长度大于IC封装(2)的引线端子(1)的间隔,并且高度使得仅能够将光辐射到靠近中心部分的引线端子 IC封装从引线的远端部分。 用于使引线(1)成像的相机(7和8)被设置成高精度地测量引线端子的平坦度。